Micross

International Conference and Exhibition on
High Temperature Electronics Network (HiTEN 2017)

July 10-12, 2017
Queens' College
Cambridge, United Kingdom

Conference Chairs:

Colin Johnston
Oxford University
colin.johnston@materials.ox.ac.uk

R. Wayne Johnson
Tennessee Tech University
wjohnson@tntech.edu

Organizing Committee:

Alison Crossley, University of Oxford (UK)
Andy Longford, Panda Europe IMAPS UK (UK)
Patrick McCluskey, CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Normann, Perma Works (US)
Bernard Parmentier, Schlumberger (F)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)



Premier Sponsors:
HiTEN Premier Sponsor - Presidio Components
HiTEN Premier Sponsor - Evans Capacitor Company
 
2 Premier Spots Available
 

 


Corporate Sponsors:

HiTEN Corporate Sponsor - Analog Devices
HiTEN Corporate Sponsor - Joule
HiTEN Corporate Sponsor - KEMET
HiTEN Corporate Sponsor - CISSOID
HiTEN Corporate Sponsor - XREL Semiconductor
HiTEN Corporate Sponsor - TEKMOS
HiTEN Corporate Sponsor - Trendsetter Electronics

1 Corporate Spot Available

 

HiTEN Conference Focus:

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.



 

MONDAY, 10 JULY


7:30am-6:00pm

Registration Open

10:00am-7:00pm

Exhibits Open (when not in session)


 

Breakfast - provided by the College for those staying overnight only.


8:30am-8:45am

Opening Remarks: Conference Chair –
Colin Johnston, Oxford University


SESSION 1

APPLICATIONS
Session Chair: Colin Johnston, Oxford University

 

8:45am-9:15am

An Advanced Extreme Environment Wireless Telemetry System for Turbine Blade Instrumentation
John Fraley, Wolfspeed, A Cree Company (Joshua McConkey, Anand Kulkarni, Brett Sparkman, Stephen Minden)

9:15am-9:45am

Development of a Novel Logging Tool for 450°C Geothermal Wells
Morten Hamreoen Røed, SINTEF (Sigbjørn Kolberg, Jon Vedum, Magnus Hjelstuen, Anders Liverud, Øyvind Nistad Stamnes)

9:45am-10:15am

High Temperature Quadrature Amplitude Modulation over Orthogonal Frequency Division Multiplexing
Avery Cashion, Sandia National Labs. Geothermal Research Dept. (Grzegorz Cieslewki)


10:15am-11:00am

Coffee/Tea Break in the Exhibit Area


SESSION 2

SILICON - I
Session Chair: Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS

 

11:00am-11:30am

Creation of an ARM(C) Cortex(C)-M based Microcontroller for High Temperature Embedded Systems
Ross Bannatyne, VORAGO Technologies (R. Bannatyne, D. Gifford, K. Klein, C. Merritt, K. McCarville, S. Neddermeyer)

11:30am-12:00pm

High-Precision Mixed-Signal Sensor Interface for a Wide Temperature Range [0°-300°C]
Georg Gläser, Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH) (Dirk Nuernbergk, Melexis GmbH; Dagmar Kirsten, X-FAB Semiconductor Foundries AG; André Richter, Marco Reinhard, Gerrit Kropp, IMMS GmbH)

12:00pm-12:30pm

High Temperature EEPROM Using a Differential Approach for High Reliability
Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Sebastian Braun, Michael Alfring, Norbert Kordas, Andreas Kelberer, Stefan Dreiner, Rainer Kokozinski)

12:30pm-1:00pm

A Precision Data Acquisition and Control Platform for 200C+ High Temperature Environments
Jeff Watson, Analog Devices, Inc. (Maithil Pachchigar, Analog Devices; Ross Bannatyne, Clay Merritt, Vorago Technologies; Chris Conrad, Glenn Smollinger, Earle Drack, PetroMar Technologies)


1:00pm-2:00pm

Lunch Break


SESSION 3

PACKAGING & INTERCONNECT
Session Chair: Andy Longford, PandA Europe Limited

 

2:00pm-2:30pm

Intermetallic Connections for High Temperature Applications
Andrey Novikov, University of Rostock (Mathias Nowottnick)

2:30pm-3:00pm

Evaluation of Printed-circuit Boards Materials for High Temperature Operation
Cyril Buttay, Laboratoire Ampere, CNRS (Oriol Avino-Salvado, Wissam Sabbah, Hervé Morel, Pascal Bevilacqua)

3:00pm-3:30pm

The Tamessa Project: a Practical Application of a 225C Multilayer PCB/SMT/COB System
Piers Tremlett, Microsemi


3:30pm-4:15pm

Coffee/Tea Break in the Exhibit Area


4:15pm-4:45pm

Effects of Bond Pad Thickness on Copper Wire Bond Reliability
Subramani Manoharan, CALCE, University of Maryland (Patrick McCluskey, Stevan Hunter)

4:45pm-5:15pm

Microstructure Stability of TLPS Interconnects in High Operating Temperature Applications
Catherine Shearer, EMD Performance Materials

5:15pm-5:45pm

A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multi-Layer Ceramic Capacitors
John Bultitude, KEMET Electronics Corporation (John McConnell, Lonnie Jones, Galen Miller, Jim Magee, Allen Templeton, Abhijit Gurav, Reggie Phillips)

5:45pm-6:15pm

Development of Thermal Conductive Sheet with Low Interfacial Heat Resistance 
Masao Tomikawa, Toray Industries (Akira Shimada)


6:15pm-7:00pm

Wine & Networking Reception in the Exhibit Area

7:00pm-8:30pm

Conference Dinner


 

 



 

TUESDAY, 11 JULY


7:30am-4:00pm

Registration Open

10:00am-3:30pm

Exhibits Open (when not in session)


 

Breakfast - provided by the College for those staying overnight only.


SESSION 4

DIE ATTACH - I
Session Chair: Samjid Mannan, King's College London

 

8:30am-9:00am

Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications
Maciej Patelka, NAMICS (Noriyuki Sakai)

9:00am-9:30am

Development of Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
Nick Krasco, Maciej Patelka, NAMICS (Sho Ikeda, Toshiyuki Sato)

9:30am-10:00am

Die-Attach Voiding Reduction in Gold Alloy Solder Preforms
Bernard Leavitt, Jr., Indium Corporation of America (Andy Mackie)


10:00am-11:15am

Coffee/Tea Break in the Exhibit Area


SESSION 5

SILICON - II
Session Chair: Jeff Watson, Analog Devices, Inc.

 

11:15am-11:45am

SOI Operational Amplifier Applications in 300C Operating Environment
Cheng-Po Chen, General Electric (Emad Andarawis, Russell Simpson)

11:45am-12:15pm

Comparison of a Current Mode Reference Generator Versus a ΔVbe Bandgap Circuit in a 1.0µm PD-SOI CMOS Process for High Temperature (225⁰C) Environments
Alex Pike, Meggitt Sensing Systems (Adrien Corne, Frank Bohac, Ravi Ananth)

 


MOVED TO SESSION 9:

High Temperature, Time Domain Sensor Interface based on Phase Shifter
Emna Chabchoub, CEA (Franck Badets, Mohamed Masmoudi, Pascal Nouet, Frédérick Mailly)

 

 

WITHDRAW BY AUTHOR ON JULY 5:
A High-Temperature Standard Cell Library for Synthesis of Very Large Scale Integrated SiC CMOS Circuits
James Holmes, Ozark Integrated Circuits, Inc. (Nicholas Chiolino, A. Matthew Francis, Matthew Barlow)


12:15pm-1:00pm

Lunch



1:00pm-2:00pm

Networking in the Exhibit area


SESSION 6

WIDE BANDGAP DEVICES
Session Chair: John Fraley, Wolfspeed, A Cree Company

 

2:00pm-2:30pm

A High Temperature Linear Wideband Power Amplifier for a Downhole Communication System
Dong Ha, Brannon Kerrigan, Virginia Polytechnic Institute and State University

2:30pm-3:00pm

A High Temperature 4H-SiC Voltage Reference for Depletion Mode GaN-Based Circuits
Dong Ha, ZiHao Zhang, Virginia Polytechnic Institute and State University (Jebreel Salem)

 

 

WITHDRAW BY AUTHOR ON JULY 5:
A 2 V to 15 V BiCMOS Level-Shifting Logic-Input Cell for SiC CMOS Integrated Circuits
James Holmes, Ozark Integrated Circuits, Inc. (A. Matthew Francis, Matthew Barlow, Nicholas Chiolino)


3:00pm-3:30pm

Coffee/Tea Break in the Exhibit area


SESSION 7

PACKAGING & TEST
Session Chair: Russell Craddock, General Electric Company

 

3:30pm-4:00pm

Development of a High Temperature Protective Coating to Enable Organic Printed Circuit Boards to Operate at Higher Temperatures
Martin Wickham, National Physical Laboratory (Vimal Gopee, Adam Lewis and Christine Thorogood, National Physical Laboratory; Robin Pittson, Laura Statton, Gwent Electronic Materials; Piers Tremlett, Microsemi Ltd.)

4:00pm-4:30pm

Different Sketches in Relation with Current Thermal Applications
Guénael Ribette, MICROTEST


 

Dinner not provided - Opportunity to visit Cambridge for Dinner & Networking!


 

 



 

WEDNESDAY, 12 JULY


7:30am-5:00pm

Registration Open

 

No Exhibits Today


 

Breakfast - provided by the College for those staying overnight only.


SESSION 8

DIE ATTACH - II
Session Chair: Steve Riches, Tribus-D Ltd

 

8:30am-9:00am

Sintered Silver Die Attach with Extreme Thermal Stability for Extreme and Dynamic Environments
Khalid Khtatba, King's College University (Seyed Amir Paknejad, Ali Mansourian, Samjid H. Mannan)

9:00am-9:30am

Evaluation of High Temperature Joining Technologies for Semiconductor Die Attach
Siyuan Qi, The Manufacturing Technology Centre Ltd (Chris Powley, Maria Mirgkizoudi, Adele Pliscott, Peter Collier)

9:30am-10:00am

Thermal Reliability of SiC Device with Cu Sintering Die-attach Processed at 250C in N2 Gas
Shijo Nagao, Osaka University (Hiroki Yoshikawa, Hiroshi Fujita, Akio Shimoyama, Shinya Seki, Hao Zhang, Katsuaki Suganuma)

10:00am-10:30am

Potential of Zn-Al Solder Alloy for High Temperature SiC Power Module
Hidekazu Tanisawa, National Institute of Advanced Industrial Science and Technology (AIST) (Hiroshi Sato, Hiroki Takahashi, Fumiki Kato, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi)


10:30am-11:15am

Coffee/Tea Break


11:15am-11:45am

Pore Engineering of Sintered Silver via Electromigration
Ali Mansourian, King's College London

11:45am-12:15pm

Effect of Isothermal Aging at 250C on Shear Strength of Joints using Sn-Coated Cu Particle Paste for High-temperature Application
Hiroshi Nishikawa, Osaka University (Xiangdong Liu)

12:15pm-12:45pm

Time-efficient sintering processes to attach power devices using nanosilver dry film
Jingru Dai, University of Nottingham (Jianfeng Li, Pearl Agyakwa, Christopher Mark Johnson)


1:00pm-2:00pm

Lunch Break


SESSION 9

POWER
Session Chair: Colin Johnston, Oxford University

 

2:00pm-2:30pm

Product Development of High Power Electronics for High Reliability Applications
Tiago Loureiro Teixeira, Micross Components (Juan Bevan)

2:30pm-3:00pm

A High Temperature Half Bridge 1200V/30A SiC MOSFET Intelligent Power Module in a Hermetic Package for Industrial & Aerospace Applications
Etienne Vanzieleghem, CISSOID S.A. (Rupert Burbidge, Nicolas Pequignot, Zlatan Gradincic, Pierre Delatte, Albert Urrabazo)

3:00pm-3:30pm

Design and Fabrication of a Power Si/SiC LDMOSFET for High Temperature Applications
Fan Li, School of Engineering, University of Warwick (P.M. Gammon, V. Kilchytska, K. Ben Ali, C.W. Chan, F. Gity, T. Trajkovic, V. Pathirana, N. Udugampola, D. Flandre, J.W. Gardner, P.A. Mawby)


3:30pm-4:00pm

Coffee/Tea Break


4:00pm-4:30pm

Evaluation of Thermal Resistance Degradation of SiC Power Module Corresponding to Thermal Cycle Test
Fumiki Kato, National Institute of Advanced Industrial Science and Technology (Hiroki Takahashi, Hidekazu Tanisawa, Kenichi Koui, Shinji Sato, Yoshinori Murakami, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato)

4:30pm-5:00pm

High Temperature, Time Domain Sensor Interface based on Phase Shifter
Emna Chabchoub, CEA (Franck Badets, Mohamed Masmoudi, Pascal Nouet, Frédérick Mailly)


5:00pm

Closing Remarks: Conference Chair –
Colin Johnston, Oxford University


 



Speaker Dates/Information:

HiTEN Speaker Information:

  • Abstracts Deadline Extended: February 15, 2017
  • Abstract Notification Emails Sent: March 28, 2017
  • Final Manuscript (Proceedings) due: May 3, 2017
  • Early Registration Deadline: June 2, 2017
  • Room/Food Reservation Deadline: June 2, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop, cloud, or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Final Manuscripts for the HiTEN Proceedings are due May 3, 2017.
Send Your Final Manuscript Via E-Mail to bschieman@imaps.org, in PDF format only (PDF can be in color).

Selected Manuscripts from HiTEN will be considered for publishing in the Journal of Microelectronics and Electronic Packaging. Invitations will be made separately. Inquiries can be sent to jmep@imaps.org.

Speakers must register for this conference at the reduced speaker rates. Early registration deadline is June 2017; and Room/Food reservation deadline is June 2017. See registration form for detailed information.

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: June 2, 2017)

Delegate, Speaker/Chair, and Student registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) Proceedings CD-ROM. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 6/2/2017
Advance/Onsite Fee
After 6/2/2017
Delegate
$600
$700
Speaker / Chair
$450
$550
Student
$250
$350
Tabletop Exhibit
$600
$700
Corporate Sponsorship (Includes Tabletop - Limit 8)
$1500
$1500
Premier Sponsorship (Includes Tabletop - Limit 4)
$3000
$3000

 


Housing Reservations: (Room Reservation Deadline: June 2, 2017)

Conference Location:
Queens' College
Cambridge, CB3 9ET, United Kingdom
Phone: +44 (0)1223 335511

 

Book your lodging reservation directly with the College today! We have reserved a block of rooms at the College to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates OR MIGHT NOT BE AVAILABLE. IMAPS room blocks at most events historically sell out ahead of the discount deadline, so we encourage you to make your reservations quickly for the best price and availability.

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems