The hands-on workshops sell out quickly and enrollment is
limited, please check for availability.
“hands-on” courses are back! Last year the “hands-on”
courses sold out early and were an overwhelming success.
IMAPS, in partnership with the National Training Center
for Microelectronics (NTCm)
is again offering technical training sessions designed to
provide attendees with a “hands-on” learning experience.
Enroll early as class size is limited!
Training Center for Microelectronics (NTCm),
located in Bethlehem, Pennsylvania, is an extension of
Northampton Community College. NTCm is the
recognized leader in microelectronics manufacturing industry
training and is known for clear, concise “hands-on” training
courses specializing in hybrid, RF and related technologies. All
courses carry Continuing Education Units (CEU) which earn credit
toward your degree. Website: www.northampton.edu/ntc.
(how to) for Operators and Technicians
limited to 12 students
Thomas J. Green, National Training Center for
course is intended as a practical “hands-on” set of
laboratory exercises to allow the operators to really understand
the wirebonding process. An experienced industry instructor will
review the basic manual wirebonder equipment design and setup
and explore how machine settings such as power, time, force and
stage temperature affect the bonding process. Both ultrasonic
wedge and thermosonic ball bonding will be explored using the
industry’s latest manual wirebonders. Students will also have
an opportunity to perform wire pull and ball shear testing and
visually inspect wirebond interconnects to gain further insights
into the process.
basics of thermosonic and ultrasonic wire bonding.
defects and how to prevent them.
Learn how to do
wire pull and ball shear testing.
Know how to set up
and use manual wirebonding equipment.
Who Should Attend:
course is intended as a beginning to intermediate level course
for operators, technicians and others with limited wire bonding
experience interested in a practical “hands-on” tutorial.
Tom Green has eighteen
years experience in the microelectronics industry and presently
teaches at the National Training Center for Microelectronics.
As a staff engineer with Lockheed Martin he was
responsible for the materials and processes used in building
custom hybrids and RF microcircuits for space applications.
Specific areas of expertise included wirebonding, die attach and
seam sealing. As an officer assigned to USAF Rome Laboratories
he conducted research on semiconductor failure mechanisms and
analyzed numerous microelectronic component failures from Air
Force avionics systems. He
has published seven technical papers and is a member of the
IMAPS National Technical Committee. Tom earned a B.S. in
Metallurgy and Materials Engineering from Lehigh University and
a Masters in Engineering from University of Utah.
Printing (how to) for Operators and Technicians
limited to 10 students
David Malanga, Heraeus, Inc., Circuit Materials Division
course is designed to focus on the concepts of screen printing
and firing of thick film materials.
An overview of the screen printing process will be given
with a “hands-on” demonstration to emphasize printer set up
and operation. Screen
print process parameters such as snap off, pressure and print
speed and how they effect the finished print will be explored in
detailed. Each student will have an opportunity to print various
types of thick film materials using a variety of different
screens. State-of-the-art microscopes and thickness profiling
equipment will be available to assess the quality of the wet
print. The firing process and its effect on the finished print
will be discussed in detail.
importance of proper screen printer set up.
trouble-shoot screening problems.
factors that affect wet print thickness and line resolution.
issues with proper furnace set up and atmospheric control.
Who Should Attend:
is intended for operators and technicians and others who need to
gain a deeper understanding of the thick film printing process.
Malanga is currently Technical Service Manager for Thick Film
Products at Heraeus Inc., Circuit Materials Division. Dave has
eleven years at Heraeus
working both in R&D formulating materials (resistors,
conductors, and dielectrics) and in Technical Service solving
processing and application problems directly with customers.
Dave earned a B.S. in Ceramic Science and Engineering from
Rutgers University and a M.S. in Ceramic Science and Engineering
from Rutgers University. In addition, he has published various
articles on thick film resistors, conductors, and component
metallizations, LTCC materials, and fiber optic materials.
Introduction to High Reliability
Soldering for Operators and Technicians
limited to 12 students
Joel A. Weiner, The Johns Hopkins University Applied Physics
course will focus on the requirements and techniques for the
production of high reliability hand soldered connections. The
overview will cover scientific, technical, and practical
aspects, and include a “hot-iron” activity. A NASA-certified soldering instructor will cover the
metallurgy of solders, required basic bench-level equipment,
component preparation, soldering methods, storage, cleaning,
electrostatic discharge damage prevention, inspection/test
procedures, and criteria for acceptable soldered connections.
for assembly and soldering of a variety of component types and
mounting configurations will be covered. These include soldering
of terminals to boards, dual in-line packages, through-hole
parts, lapped joints, high voltage components, and connectors.
If they wish, students will have an opportunity to solder a
variety of components to a printed wiring board.
drivers and issues important to high reliability hand soldering.
Learn what is
needed at a work bench that is intended for high reliability
acceptable and unacceptable solder connections.
thrill of hand soldering.
Who Should Attend:
course is intended for intermediate level soldering operators
and technicians; for supervisors responsible for their
performance; and for anyone wishing a better understanding of
the high reliability hand soldering process.
Special Course Materials:
attendees will be given copies of NASA-STD-8739.3, “Soldered
Electrical Connections,” and the “Student Workbook for Hand
Soldering,” NASA, December 1998, as well as course notes.
Weiner has thirty years experience in printed circuit board
production, microelectronic assembly, high reliability
electromechanical device fabrication, inspection and quality
assurance. Presently he is the Quality Assurance and
Improvements Manager of the Technical Services Department at the
Johns Hopkins University Applied Physics Laboratory. He is a
Member of the Principal Professional Staff, and has previously
been both the Assistant Group Supervisor of the Microelectronics
Group and of the Electronic Services Group. Joel has a B.S.
(Brooklyn College, City University of New York)
and an M.S.(Rutgers University) in chemistry, and an M.S.
in Technical Management (Johns Hopkins University). He has
nearly forty publications, presentations and patents in related
fields. He is certified by NASA as an Instructor for Hand
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