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Advanced Technical Program
Tuesday, November 18 thru Thursday, November 20, 2003




Thursday, November 20, 2003

THA1
Optoelectronics Packaging and Processes
Chairs: Shapna Pal, Department of Defense; Jeff Shakespeare, Consultant
8 am - 10:35 am

Optimization efforts in optoelectronic assembly processes continue to meet the stringent packaging requirements that surpass those of conventional microelectronic assembly. Novel materials processing and alignment techniques are presented to solve those packaging challenges.

Ink-Jet Printing for Optical/Electrical Interfacing of VCSEL and PD Arrays
Ting Chen, Donald J. Hayes, David B. Wallace, MicroFab Technologies, Inc.

Novel Design of Wedge-Shaped Lensed Fibers for Fiber-Laser Coupling by using a Wide-Angle Beam Propagation Method
Yongzhi He, Samir K. Mondal, Frank G. Shi, University of California

Unique Metal-To-Glass Bonding for Hermetic Packaging of MOEMS and Other Applications
David H. Stark, Electronics Packaging Solutions, Inc.

Packaging Challenges of High-Power LEDs for Solid State Lighting
Shatil Haque, Dan Steigerwald, Serge Rudaz, Bob Steward, Jerome Bhat, Dave Collins, Frank Wall, Sudhir Subramanya, Chris Elpedes, Phil Elizondo, Paul S. Martin, Lumileds Lighting

X-IGA: Consumer price packaging for 40Gbit/s Tranceiver Modules?
Georg Meyer-Berg, Ivo Koren, Holger Huebner, Harry Hedler, Thorsten Meyer, Ulrich Lange, Infineon Technologies


THA2
CSP Modeling and Reliability
Chair: Theodore G. Tessier, ST Assembly Test Services Inc.
8 am - 11 am

This session will cover recent advancements in CSP modeling, reliability and highlight package level and board level reliability improvements that have emerged recently.

Board Level Reliability of Various Stacked Die Chip Scale Packages Configurations
Flynn P. Carson, Bret Zahn, ChipPAC, Inc.

Assembly and Reliability Issues Associated with Leadless Chip Scale Packages
Muffadal Mukadam, K. Srihari, Binghamton University; Michael Meilunas, Universal Instruments Corporation

An Objective Assessment of Printed and Plated Bumping Technologies
Jamin Ling, Won-Sun Shin, Edward Law, Sheila Alvarez, Isobel Tan, Ted Tessier, Il-Kwon Shim, Diane Sahakian, ST Assembly Testing Services (STATS - US)

The Effects of Solder Composition on Ball Fatigue Strength of Chip Scale Packages
Seung-weon Ha, Flynn Carson, Y. C. Kim, G. S. Kim, ChipPAC Incorporated

Numerical Simulation of Underfill Cure Evolution in Chip-Scale-Package (CSP) Manufacturing Process
Rajesh R. Gomatam, John Coulter, Lehigh University

NonEpoxy-Based Underfill for CSP Assembly
Paul Morganelli, Robert Frimanson, Douglas Katze, Emerson & Cuming Specialty Polymers


THA3
Emerging Technologies
Chairs: Kumaraswamy "Jay" Jayaraj, SiWave Inc.; Brian Farrell, Foster Miller, Inc.
8 am - 11:25 am

Papers in this session cover a wide spectrum of emerging packaging technologies including: nanomaterials, novel materials and assembly methods.

The Performance of Next Generation Semiconductor Molding Compounds for Array Packaging and Transfer-Molded Flip Chip Encapsulation
Louis P. Rector, Mark Dimke, Henkel Loctite

Electrical Properties of Ferrite/Dielectrics Multi-layer EMI Filters using Buffer Layer
Moon Soo Park, Jae Hyuk Jang, Byung Gyu Chang, Seung Gyo Chung, Samsung Electro-Mechanics

Mechanical Reinforcement for Sphere Attach Applications
Maureen A. Brown, Richard Jung, Jin Liu, John Stipp, Amir Fattahian, Sandhya Shashipadme, Kester-Northrop Grumman

Novel Low-Cost Sol-Gel Derived Nano-structured and Repairable Interconnects
Ankur O. Aggarwal, I. R. Abothu , P. M. Raj, M. D. Sacks, Rao R. Tummala, Georgia Institute of Technology

LaPlace - A New Assembly Method using Laser Heating for Ultra Fine Pitch Devices
Thorsten Teutsch, Ronald G. Blankenhorn, Ghassem Azdasht, Peter Penke, Guenter Frieb, Elke Zakel, PacTech USA - Packaging Technologies, Inc.

Computational Modeling of Optical Trapping of Nanoparticles in Biomicrofluidic Devices
Ryszard J. Pryputniewicz, Zbigniew Sikorski, Mahesh Athavale, Zhijian Chen, Andrzej J. Przekwas, Worcester Polytechnic Institute

Progressive Development of Portable Non-Invasive Biomedical Imaging Electronics with Diversified Applications
Sihua Wen, Yuanqing Lin, Kiran Gangavarapu, Samantha Gaw, Jun Zhang, Gwen Lech, Shoko Nioka, Britton Chance, University of Pennsylvania


THA4
Modeling and CAD
Chair: Luu Nguyen, National Semiconductor Corp.
8 am - 11:25 am

A good understanding of the performance and reliability of a new package will need established analytical as well as semi-empirical simulation tools. This session addresses the latest development in package thermo-mechanical analysis, hygro-thermo-mechanical prediction, together with high frequency electrical package simulation, and a view of the changing role of package design software.

Analytical Solutions of Thermal Stress Distribution in Plastic Encapsulated IC Packages
Zhongmin Xiao, Biao Wang, Nanyang Technological University

The Effect of Material and Dimension Related Parameters on the FIT Figures of Interconnections in Reliability Calculations
Klas Andersson, Olli Salmela, Markku Tammenmaa, Jussi Särkkä, Nokia Research Center

Experimental Physics-Based Structure Integrity Analysis for Reliability Prediction
Hua Lu, Ryerson Polytechnic University; Jesse Zhou, Motorola Inc.; Rich Golek, Richgolek Consulting

A Study on Hygro-Mechnical and Thermo-Mechanical Analysis of QFN Package, using Finite Element Method
Dae Whan Kim, Sang Kook Kim, Man In Beak, LG Production Engineering Research Center

A Novel Modelling Methodology of Bump Arrays for RF and High-Speed Applications
Ivan Ndip, Grit Sommer, Werner John, Herbert Reichl, Fraunhofer Institute for Reliability and Microintegration (FhG-IZM)

Techniques of Robust Electrical Package Design using HFSS
Christopher Gordon, Andy Piloto, Jerry Aguirre, Paul Garland, Joseph Tallo, Heather Tallo, Rei Yamada, Derek Mrazek, Kyocera America Inc.

The Changing Role of Software for the Design of Microelectronic Circuits
Andres Carrasco, CAD Design Software


Special Session*
8 am - 9:20 am

Authors are NSF/SJS
2003 Award Recipients

*Presentations will be 20 minutes each


THA5
National Science Foundation & Sidney J. Stein Educational Foundation

Chairs: Rao Tummala, Leyla Conrad, Georgia Institute of Technology

Reliability of Multilayer Capacitors as a Function of Furnace Conditions
Chris Willaims, Alfred University

Fabrication of Microchannels in LTCC
Roxana Estevez, Florida International University

Organic and Inorganic Substrate Materials
Adam Brown, Arizona State University

Improving the Reliability of Active Metal Brazed Cu/AlN
Beth MacMichael, New York State College of Ceramics at Alfred University

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