Advanced Technical Program
Tuesday, November 18 thru Thursday, November 20,
2003
Thursday,
November 20, 2003
THA1
Optoelectronics Packaging and Processes
Chairs: Shapna Pal, Department of Defense; Jeff
Shakespeare, Consultant
8 am - 10:35 am
Optimization efforts in optoelectronic assembly processes
continue to meet the stringent packaging requirements that surpass
those of conventional microelectronic assembly. Novel materials
processing and alignment techniques are presented to solve those
packaging challenges.
Ink-Jet Printing for Optical/Electrical
Interfacing of VCSEL and PD Arrays
Ting Chen, Donald J. Hayes, David B. Wallace, MicroFab Technologies,
Inc.
Novel Design of Wedge-Shaped Lensed Fibers
for Fiber-Laser Coupling by using a Wide-Angle Beam Propagation
Method
Yongzhi He, Samir K. Mondal, Frank G. Shi, University of California
Unique Metal-To-Glass Bonding for Hermetic
Packaging of MOEMS and Other Applications
David H. Stark, Electronics Packaging Solutions, Inc.
Packaging Challenges of High-Power LEDs
for Solid State Lighting
Shatil Haque, Dan Steigerwald, Serge Rudaz, Bob Steward, Jerome
Bhat, Dave Collins, Frank Wall, Sudhir Subramanya, Chris Elpedes,
Phil Elizondo, Paul S. Martin, Lumileds Lighting
X-IGA: Consumer price packaging for
40Gbit/s Tranceiver Modules?
Georg Meyer-Berg, Ivo Koren, Holger Huebner, Harry Hedler, Thorsten
Meyer, Ulrich Lange, Infineon Technologies
THA2
CSP Modeling and Reliability
Chair: Theodore G. Tessier, ST Assembly Test Services
Inc.
8 am - 11 am
This session will cover recent advancements in CSP modeling,
reliability and highlight package level and board level reliability
improvements that have emerged recently.
Board Level Reliability of Various Stacked
Die Chip Scale Packages Configurations
Flynn P. Carson, Bret Zahn, ChipPAC, Inc.
Assembly and Reliability Issues Associated
with Leadless Chip Scale Packages
Muffadal Mukadam, K. Srihari, Binghamton University; Michael Meilunas,
Universal Instruments Corporation
An Objective Assessment of Printed and
Plated Bumping Technologies
Jamin Ling, Won-Sun Shin, Edward Law, Sheila Alvarez, Isobel Tan,
Ted Tessier, Il-Kwon Shim, Diane Sahakian, ST Assembly Testing
Services (STATS - US)
The Effects of Solder Composition on
Ball Fatigue Strength of Chip Scale Packages
Seung-weon Ha, Flynn Carson, Y. C. Kim, G. S. Kim, ChipPAC Incorporated
Numerical Simulation of Underfill Cure
Evolution in Chip-Scale-Package (CSP) Manufacturing Process
Rajesh R. Gomatam, John Coulter, Lehigh University
NonEpoxy-Based Underfill for CSP Assembly
Paul Morganelli, Robert Frimanson, Douglas Katze, Emerson &
Cuming Specialty Polymers
THA3
Emerging Technologies
Chairs: Kumaraswamy "Jay" Jayaraj, SiWave
Inc.; Brian Farrell, Foster Miller, Inc.
8 am - 11:25 am
Papers in this session cover a wide spectrum of emerging
packaging technologies including: nanomaterials, novel materials
and assembly methods.
The Performance of Next Generation Semiconductor
Molding Compounds for Array Packaging and Transfer-Molded Flip
Chip Encapsulation
Louis P. Rector, Mark Dimke, Henkel Loctite
Electrical Properties of Ferrite/Dielectrics
Multi-layer EMI Filters using Buffer Layer
Moon Soo Park, Jae Hyuk Jang, Byung Gyu Chang, Seung Gyo Chung,
Samsung Electro-Mechanics
Mechanical Reinforcement for Sphere Attach
Applications
Maureen A. Brown, Richard Jung, Jin Liu, John Stipp, Amir Fattahian,
Sandhya Shashipadme, Kester-Northrop Grumman
Novel Low-Cost Sol-Gel Derived Nano-structured
and Repairable Interconnects
Ankur O. Aggarwal, I. R. Abothu , P. M. Raj, M. D. Sacks, Rao
R. Tummala, Georgia Institute of Technology
LaPlace - A New Assembly Method using
Laser Heating for Ultra Fine Pitch Devices
Thorsten Teutsch, Ronald G. Blankenhorn, Ghassem Azdasht, Peter
Penke, Guenter Frieb, Elke Zakel, PacTech USA - Packaging Technologies,
Inc.
Computational Modeling of Optical Trapping
of Nanoparticles in Biomicrofluidic Devices
Ryszard J. Pryputniewicz, Zbigniew Sikorski, Mahesh Athavale,
Zhijian Chen, Andrzej J. Przekwas, Worcester Polytechnic Institute
Progressive Development of Portable Non-Invasive
Biomedical Imaging Electronics with Diversified Applications
Sihua Wen, Yuanqing Lin, Kiran Gangavarapu, Samantha Gaw, Jun
Zhang, Gwen Lech, Shoko Nioka, Britton Chance, University of Pennsylvania
THA4
Modeling and CAD
Chair: Luu Nguyen, National Semiconductor Corp.
8 am - 11:25 am
A good understanding of the performance and reliability
of a new package will need established analytical as well as
semi-empirical simulation tools. This session addresses the
latest development in package thermo-mechanical analysis, hygro-thermo-mechanical
prediction, together with high frequency electrical package
simulation, and a view of the changing role of package design
software.
Analytical Solutions of Thermal Stress
Distribution in Plastic Encapsulated IC Packages
Zhongmin Xiao, Biao Wang, Nanyang Technological University
The Effect of Material and Dimension
Related Parameters on the FIT Figures of Interconnections in Reliability
Calculations
Klas Andersson, Olli Salmela, Markku Tammenmaa, Jussi Särkkä,
Nokia Research Center
Experimental Physics-Based Structure
Integrity Analysis for Reliability Prediction
Hua Lu, Ryerson Polytechnic University; Jesse Zhou, Motorola Inc.;
Rich Golek, Richgolek Consulting
A Study on Hygro-Mechnical and Thermo-Mechanical
Analysis of QFN Package, using Finite Element Method
Dae Whan Kim, Sang Kook Kim, Man In Beak, LG Production Engineering
Research Center
A Novel Modelling Methodology of Bump
Arrays for RF and High-Speed Applications
Ivan Ndip, Grit Sommer, Werner John, Herbert Reichl, Fraunhofer
Institute for Reliability and Microintegration (FhG-IZM)
Techniques of Robust Electrical Package
Design using HFSS
Christopher Gordon, Andy Piloto, Jerry Aguirre, Paul Garland,
Joseph Tallo, Heather Tallo, Rei Yamada, Derek Mrazek, Kyocera
America Inc.
The Changing Role of Software for the
Design of Microelectronic Circuits
Andres Carrasco, CAD Design Software
Special Session*
8 am - 9:20 am
Authors are NSF/SJS
2003 Award Recipients
*Presentations will be 20 minutes
each
THA5
National Science Foundation & Sidney J. Stein Educational
Foundation
Chairs: Rao Tummala, Leyla Conrad, Georgia Institute of Technology
Reliability of Multilayer Capacitors
as a Function of Furnace Conditions
Chris Willaims, Alfred University
Fabrication of Microchannels in LTCC
Roxana Estevez, Florida International University
Organic and Inorganic Substrate Materials
Adam Brown, Arizona State University
Improving the Reliability of Active
Metal Brazed Cu/AlN
Beth MacMichael, New York State College of Ceramics at Alfred
University
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