Advanced Technical Program
Tuesday, November 18 thru Thursday, November 20,
2003
Wednesday,
November 19, 2003
WA1
MEMS Packaging
Chairs: David Galipeau, South Dakota State University;
Janet Lumpp, University of Kentucky
8 am - 11:25 am
As microelectromechanical systems (MEMS) become more widely
used, new packaging challenges and opportunities continue to
arise. This session covers state-of-the art solutions in MEMS
packaging for inertial, RF, and optical systems.
Vacuum Packaging of MEMS Inertial Sensors
Thomas F. Marinis, Joseph W. Soucy, Draper Laboratory
Novel Noninvasive Methodology for Characterization
of Packaging for MEMS Inertial Sensors
Ryszard J. Pryputniewicz, Peter Hefti, Adam R. Siegel, Adam R.
Klempner, Cosme Furlong, Worcester Polytechnic Institute; Thomas
F. Marinis, Joseph W. Soucy, Draper Laboratory
Low-Cost Manufacturing/Packaging Process
for MEMS Inertial Sensors
David F. Guillou, IC Mechanics, Inc.
Low Cost Packaging of MEMS Accelerometers
Lawrence Felton, Michael Duffy, Peter Farrell, Nicole Hablutzel,
Willaim Webster, Analog Devices, Inc.
Impact of Thermal Cycles During the Packaging
Assembly Process on RF MEMS Switch Performance
Ananda De Silva, Lianjun Liu, Henry Hughes, Motorola Inc.
Low Profile Packaging Solution for RF-MEMS
Suitable for Mass Production
Frank Daeche, Günter Ehrler, Michael Weber, Andreas Meckes,
Robert Aigner, Hans-Joerg Timme, Infineon Technologies AG
Near Hermetic Air Cavity Plastic Packaging
for Wireless, MEMS and Optical Applications
John W. Roman, RJR Polymers
WA2
Novel Manufacturing Technology
Chairs: Christina Conway, Rockwell Collins, Inc.;
Bob Palumbo, Kyocera America
8 am - 11 am
The pursuit of smaller, more functionalities and cheaper
microelectronics demands low cost and robust manufacturing.
This session highlights the latest developments in general manufacturing
technologies, such as quality system implementation for fabless
operations, manufacturing information exchange and PWB component
placement optimization. This session also reports, from a manufacturing
point of view, the progresses on laser wafer marking, low cost
fine line thick film and LTCC.
Implementation of a Quality System for
a FABless Semiconductor Company
Mary McDonald, Individual Solution Options/Quality Services, Inc.;
Michael Madden, SigmaTel Corp.
Improvement of Placement Accuracy by
Placement Optimization
Timo Liukkonen, Aulis Tuominen, Nokia Networks
Laser Wafer Marking at Die Level
Bo Gu, Jack Gillespie, Rainer Schramn, GSI Lumonics Inc.
Low Cost Fine Line Mo-Mn Thick Film for
Microwave Applications
Ken Kuang, Lisa Hamel, Kevin Cotner, Kyocera America, Inc.
Manufacturability Study of LTCC Integrated
Packages for High Performance, Low Cost RF SiP Modules
Matthew Hoppe, G. Surbeck. H. Moret, K. Green, Ditrans Corporation
An Investigation of the Properties of
Newly Developed LTCC Materials for their use in Microwave Antenna
Shotaro Watanabe, Kazunari Watanabe, Katsutoshi Nakayama, Asahi
Glass Co., Ltd.
WA3
Reliability
Chair: John Devaney, Hi-Rel Laboratories
8 am - 11 am
This session consists of 7 papers each on a unique topic,
6 of which touch on an aspect of the reliability of components,
substrates or materials used in the manufacture of various types
of hybrids or multi chip assemblies. The seventh discusses a
novel approach to failure analysis on complex circuits used
in multi chip modules.
Effect of Hydrogen on GaAs MMICs in
Hermetic Packages
Dipendra Nath Goswami, Picosecond Pulse Labs
Effect of Isothermal Aging on the Intermetallic
Compound Layer Growth in BGA Joints with Sn-Ag-Cu Solder
Jeong-Won Yoon, Seung-Boo Jung, Sungkyunkwan University; Chang-Bae
Lee, Samsung Electro-Mechanics Co., Ltd.
Contact Resistance of Anisotropic Conductive
Adhesives
Ranjith Divigalpitiya, Peter Hogerton, 3M Canada Company
The Measurement of Ion Diffusion in Epoxy
Molding Compounds used to Encapsulate Microelectronic Devices
Leon Lantz, II, Michael G. Pecht, Mark C. Wood, University of
Maryland at College Park
The Significance of Glass Transition
Temperature of Molding Compounds for Screening and Reliability
Qualification of COTS PEMs
Alexander Teverovsky, QSS Group, Inc.
Quantitative EDX the Effective Column
Short Failure Analysis for High Density Integrated Circuit Devices
Suntra Anuntapong, Nopphadol Kongtongnok, AMD Ltd.
WA4
Thermal Management
Chairs: Ajay P. Malshe, University of Arkansas; Dave
Saums, DS&A
8 am - 11:25 am
The performance of thermal spreaders and heat sinks must
keep pace with the demands of the electronic industry as "smaller-faster-lighter"
is relentlessly pursued. More efficient and lighter weight thermal
spreaders and heat sinks must continue to evolve through improvements
in conventional technologies and/or the developments of new
materials and technologies to ensure the efficient thermal management
of electronic systems. In this session we have included a wide
range of cutting edge topics addressed through modeling, experimentation
and product development. We invite you to attend this important
session, and we look forward for prolific discussions.
AlSiC for Optoelectronic Thermal Management
and Packaging Designs
Mark A. Occhionero, Richard W. Adams, Dave Saums, Ceramics
Process Systems
Impact of Heat Spreading Lids on Flip
Chip Thermal Performance; With and Without Heat Sink
Jamil Wakil, IBM
LTCC Substrates with Internal Cooling
Channel and Heat Exchangers
Marc A. Zampino, Hari Adluru, Yanqing Liu, W. Kinzy Jones, Florida
International University
Thermal Performance of a High End Flip-Chip
Organic Package
V. V. Calmidi, S. B. Sathe, Endicott Interconnect Technologies,
Inc.
High Performance Dual Redundant (DR)
Fan Modules
Howard Harrison, HB Innovation Ltd.; Fue-Sang Lien, University
of Waterloo
Development of a Process Friendly Film
for High Performance Thermal Management Applications
Andrew P. Collins, Chih-min Cheng, Emerson and Cuming
Remote Heat Sink with Temperature Control
using a Miniaturized Loop Heat Pipe
Dimitry K. Khrustalev, Thermacore International, Inc.
WA5
Marketing Forum
Chairs: Michael P. O'Neill, Heraeus Inc. - CMD; Howard
Imhof, Metalor Corp.; Adam Singer, Cookson Electronics
8 am - 11:25 am
The MMRC (Microelectronics Marketing Research Council) will
offer a free-of-charge Marketing Forum to all IMAPS 2003 attendees
who wish to participate. The Marketing Forum will be held on
Wednesday morning, November 19, 2003, at the Hynes Convention
Center, Boston, MA (Room number TBA).
2003 was forecasted as a year of continuing recovery for
various segments of the microelectronics industry. This session
will help clarify if those forecasts have been fulfilled, which
technologies are “hot”, and which continue to struggle.
With many companies resources stretched thin, how does this
impact their ability to develop and deliver product? What was
the impact of war, SARS, and the overall geopolitical environment
on our industry? With manufacturing continuing its migration
to low cost regions, how does this impact YOUR business? These
questions and more will be addressed.
Speakers will discuss their analysis and insights into various
current and emerging markets of interest to both current and
prospective IMAPS members. Some of these markets are Passive
Devices, WLAN, Automotive, Broadband, Wireless, manufacturing
in China, etc. The Forum will feature four presentations with
a panel discussion at the end that will allow for audience participation
in this not to be missed event!
Opening Remarks
Michael O'Neill, Chairman, MMRC Steering Committee
Packaging is Leading the Recovery
Jim Walker, Gartner Dataquest
Opportunities for Application Specific
and Value Added Components
Dennis Zogbi, Paumanok Group
Broadband Wireless Technology and Opportunities
Jack Browne, Penton Media
Global Electronics Manufacturing - The
China Wild Card
Jan Vardaman, TechSearch International
The Wireless Industry - What's Hot and
What's Not
Don Brown, International Wireless Packaging Consortium
Panel Discussion
Moderator - Jack Browne, Penton Media
WA6
Technology Drivers Trends for Electronic, Optical, Mechanical and
Chemical Packaging Technologies toward Ubiquitous Network Age
(Japanese Translated Session)
Chairs: Fumio Miyashiro, Toshiba Chemical Corp.; Andy
London, Heraeus Incorporated-Circuit Materials Division
8 am - 11:25 am
New applications in Advanced Packaging Technologies, based
especially on Nano, MEMS and sensing Technologies as part of
the coming Ubiquitous Network Age. Recently developed examples
such as modules, components, substrates and materials will be
introduced.
Advanced Packaging Technology Trend
for Mobile Terminals toward Ubiquitous Age in Japan
Tomiyo Ema, Panasonic Mobile Communications Co., Ltd.
A Battery-Less Wireless System uses
Ambient Heat with a Low-Voltage CMOS/SOI DC-DC Converter
Yoshifumi Yoshida, Seiko Instruments Inc.
Development of Direct Methanol Fuel
Cell (DMFC) for Electric Power Supply of Portable Mobile Terminals
Hirohisa Miyamoto, Toshiba Corporation
Micro Fuel Cells using Carbon Nanohorns:
A Portable Power Source in the Ubiquitous Society
Yoshimi Kubo, NEC
The Status and Future of Optical Circuit
Packaging Technology
Osamu Mikami, Tokai University
Robot Technologies for Human-Robot Cooperation
Systems in Ubiquitous Age
Yasuhisa Hirata, Tohoku University
Ubiquitous Transducers for Health Care
and Environmental Analysis
Kohji Mitsubayashi, Tokai University
WP1
Sensors and MEMS
Chairs: David Galipeau, South Dakota State University;
Richard Gehman, Honeywell Sensing and Control
2 pm - 5:25 pm
Sensor and MEMS applications continue to grow rapidly in
traditional markets such as hazardous gas detection as well
as newer areas like biomedical and RF MEMS. This session covers
state-of-the-art sensors, systems, materials, and MEMS structures
to measure hazardous gases, automotive emissions, and urinary
pressure, as well as for RF applications.
Gasoline Vapor Sensor for Power Vent
Water Heaters
Richard W. Gehman, Honeywell Sensing and Control
Screen-Printed Fe2O3/ZnO Thick Films
for Gas Sensing Applications
Khalil Arshak, Ibrahim Gaidan, University of Limerick
The Application of Sensors in Automotive
Emissions Testing
Delip "Doug" R. Bokil, Environmental Systems Products
Holdings Inc.
Telemetry in Measuring Urinary Bladder
Pressure
Bujjibabu Godavarthi, Joan Delalic, Michael R. Ruggieri, Michel
A. Pontari, Temple University
Thermal Characterization of RF MEMS
Relay Switch Design
Ryszard J. Pryputniewicz, Malgorzata S. Machate, David Rosato,
Cosme Furlong, Worcester Polytechnic Institute
Design, Modeling and Simulation of Electrostatic
flexures for Microelectromechanical Systems (MEMSEF)
Muhammad Imran, William L. Ables Jr., University of Arkansas at
Little Rock
Electrophoretic Photoresist for Patterning
Three Dimensional Structures (How to make groovy patterns and
not mind being in the pits)
Jill E. Steeper, Shipley
WP2
RF & Microwaves
Chairs: John Gipprich, Northrop Grumman Corporation;
Fred Barlow, University of Arkansas
2 pm - 5:25 pm
Packaging and integration of RF & Microwave circuits
is a growing and important area. This session includes presentations
covering new packaging methods, material evaluation, and new
materials tailored for these demanding applications. In addition,
several speakers will discuss new filter designs and the integration
of these designs into compact product form factors.
New Temperature Calibration Method for
Digital Microwave Radio Transceivers
N. Hassaine, L. Villeneuve, F. Concilio, Harris Corporation
MCMs for Space Application : up to 40
GHz inside the Multilayer Ceramic
Claude Drevon, Chloé Schaffause, Jean-Louis Cazaux, Alcatel
Space Industries
Application of Uniplanar Structures
for High Frequency Material Characterization
Can Eyup Akgun, Rhonda Franklin Drayton, University of Minnesota;
Dan Amey, Tim Mobley, DuPont Microcircuit Materials
Embedded Passives in Low-Temperature
Co-Fired Ceramic for RF & Microwave Applications
Michael Folk, S. Kaza, V. Wang, A. Elshabini, F. Barlow, University
of Arkansas
New LTCC Material with Zero TCF and
Low Loss at 15GHz
Yoshio Umayahara, Masaru Iwao, Kazuyoshi Shindo, Nippon Electric
Glass Co., Ltd.
Synthesis and Characterization of Particle
Filled LTCC Tape for Wireless Communication Applications
Kyoung-Ho Lee, Sun-Young Kim, Soonchunhyang University
LTCC MLC Bandpass Filter using Quarter-Wavelength
Hairpin Resonators for WLAN
Gyu-Je Sung, Dong-Hun Yeo, Hankyong National University
WP3
Thick and Thin Film Material Processing
Chairs: Michael Ehlert, National Semiconductor LTCC
Foundry; John Menaugh, DuPont Microcircuit Materials
2 pm - 5 pm
This session will highlight several new developments in
ceramic substrates, especially LTCC, and new inks. Process topics
include aqueous casting, fine line screen printing and a new
thermal measurement method.
Lead and Cadmium Free Low Temperature
Firing Thick Print Copper Inks
Orville W. Brown, Srinivasan Sridharan, Ferro Corporation
New Approach to Thermal Conductivity
of Thin Films Measurements by Means of Comparative Method
Selim Achmatowicz, Elzbieta Zwierkowska, Institute of Electronic
Materials Technology; Wojciech Lobodzinski, The Institute of Pro-Ecologic
Electrothermics
A Model of Fine Line Screen-printing
on LTCC
Shao-Ju Shih, Ricky Chen, Chiu Kuo-Chuang, Hung Ying-Chang, Lin
Hong-Ching, Industrial Technology Research Institute
Dielectric and Magnetic LTCC Material
System
Uwe Mackens, D. Hennings, B. Schreinemacher, R. Mauczok, S. Gruhlke,
C. Martiny, M. Matters-Kammerer, K. Reimann, Philips Research
Laboratories
Comparative Study on Laser Trimming
with Different Wavelengths
Bo Gu, Bruce Couch, J.J. Oh, Paul Chase, GSI Lumonics Inc.
Development Thermoelectric Detectors
on Base Higher Manganese Silicide (HMS) Films
T. S. Kamilov, A. A. Uzokov, D. K. Kabilov, S. F.Ganikhanov, R.
A. Muminov, B. N. Zaveryuhin, V. V. Klechkovskaya, Tashkent State
Aviation Institute
WP4
Wafer Level Packaging
Chairs: Michael Toepper, Fraunhofer IZM; Jamin Ling,
ST Assembly and Testing Services (STATS - US)
2 pm - 5:25 pm
The importance of Wafer Level Packaging to a number of new
and emerging technologies including traditional integrated circuit
applications as well as MEMS and optoelectronic packaging applications
is fueling the drive towards this form of packaging. This session
will cover a host of applications involving wafer level packaging
as well as some key developments in process technology which
make these applications possible.
Compliant Wafer Level Packaging - A
New Packaging Platform for Memory Products
Harry Hedler, Thorsten Meyer, Wolfgang Leiberg, Infineon
New Wafer Level Structure for Stress
Free Area Array Solder Attach
Raymond A. Fillion, Laura Meyer, Kevin Durocher, Slawomir Rubinsztajn,
David Shaddock, Joshua Wright, GE Global Research Center
Development of Wafer Level Packaging
with Plastic Core Solder Ball
Masto Sumikawa, Rina Murayama, Masashi Ogawa, Hiroshi Matsubara,
Sharp Corporation
Room Temperature Bond for Wafer Level
Packaging
Helge W. Luesebrink, Austria Markus Wimplinger, Chad Brubaker,
EV Group, Inc.; Paul Lindner, Austria Thomas Glinsner, EV Group
GmbH
Wafer-Level Hermetic Cavity Packaging
for MEMS, Optoelectronics, and Sensors
George A. Riley, FlipChips Dot Com
Wafer-Scale Packaging of Opto-Electronic
Devices
Daryl Spencer, A. P. Malshe, R. B. Foster, University of Arkansas;
C. B. O'Neal, SYCONN Corporation
Front End Compatible WL-CSP-Technology
for RF- and HT-Applications
Klaus Burger, ATMEL Germany GmbH
WP5
Interactive Forum (Poster Session)
1 pm - 4pm
EWOD Induced Fluid Flow for Biological
Applications
Ryan T. Marinis, Ryszard J. Pryputniewicz, Worcester Polytechnic
Institute
Controlled Laser Ablation of Polyimide
Substrates
Peter Gordon, Richard Berenyi, Balint Balogh, Budapest University
of Technology and Economics
Epoxy Flux for Lead-Free Soldering
Ning-Cheng Lee, Wusheng Yin, Indium Corporation of America
MEMS Sensors for Temperature, Pressure,
and Relative Humidity Measurements
Houri Johari, Ryszard J. Pryputniewicz, Worcester Polytechnic
Institute
Modeling Fatigue Behavior of Electronically
Conductive Filled Adhesive Joints under Cyclic Loading a Novel
Modeling Approach for Integrated Joint Life Prediction
Rajesh R. Gomatam, Lehigh University; Erol Sancaktar, University
of Akron
Reconfigurable Embedded Test for Improved
System Reliability
Kimberly E. Newman, University of Denver
Development of Au Reflection Film with
High Adhesion for Optical Interconnection between LSI Chips
Koichi Yokota, Ryohei Satoh, Yoshiharu Iwata, Kozo Fujimoto, Shogo
Ura, Kenji Kintaka, Osaka University
SnZnAl Lead-free Solder with High Packaging
Reliability
Masayuki Kitajima, Tadaaki Shono, Satoshi Masuda, Fujitsu Limited
On-Chip Isolation in Wafer-Level Chip-Scale
Packages: Substrate Thinning and Circuit Partitioning by Trenches
M. Bartek, S. M. Sinaga, A. Polyakov, J. N. Burghartz, Delft University
of Technology, DIMES/ECTM
Analytical and Experimental Characterization
of an Optical MEMS Device
Ryszard J. Pryputniewicz, Cosme Furlong, Emily J. Pryputniewicz,
Worcester Polytechnic Institute
Elimination of Epoxy Resin Bleed Through
Thin Film Plasma Deposition
Martin J. Burmeister, Stellar Microelectronics, Inc.
Mechanical Strength of Glass Ceramic
Substrates in Land Grid Array Packages
Angelo Villani, Peter Martino, Hewlett-Packard Company
Small Form Factor Fiber Optic Transceiver
with Unique Design to Meet EMC/EMI/ESD and Thermal Requirements
Sunil Priyadarshi, Ihab Khalouf, Kishore Kamath, Shaun P Scrak,
Julie Sheridan, Luminent Inc.
Flexible Thermal Management Circuits
Bonded Directly to Aluminum Heat Sinks
Jim Fraivillig, Fraivillig Technologies
Failure Modes of Flip Chip Solder Joints
under Current Stressing
Hua Ye, Cemal Basaran, Douglas C. Hopkins, State University of
New York at Buffalo
Quantitative LGA/Substrate Assembly
Contact Study from Pressure Sensitive Film Measurements
Wei Zou, Longworth Hai, IBM
A Novel Planarization Process for Providing
Global Planarity for IC Manufacturing
Wu-Sheng Shih, Mark G. Daffron, Brewer Science, Inc.
Passive Component Integration in LTCC
Liang Chai, Aziz Shaikh, Vern Stygar, Ferro Electronic Material
Systems
Estimation of Sn-3.0Ag-0.5Cu Solder
Joint Reliability by Weibull Distribution and Modified Coffin-Manson
Equation
Mitsuharu Yamabe, Toshiba Corporation
Development of Optoelectronic Holography
Techniques for Nondestructive Evaluation of MEMS at the Wafer
Level
Cosme Furlong, Curtis F. Ferguson, Michael J. Melson, Kevin A.
Bruff, Ryszard J. Pryputniewicz, Worcester Polytechnic Institute
Tin-Silver Electroplating of Pb-free
Wafer Bumps
Rozalia Beica, Kai Wang, Neil Brown, Shipley Company; Roger Quon,
Tien Cheng, John Griffith, IBM
Hybrid Approach to Thermal Management
of a FET Power Amplifier
Ryszard J. Pryputniewicz, David Rosato, Cosme Furlong, Dariusz
R. Pryputniewicz, Worcester Polytechnic Institute
Effect of Die-Attach Adhesives on the
Stress Evolution in MEMS Packaging
Junghyun Cho, Satyajit S. Walwadkar, P. W. Farrell, Lawrence E.
Felton, State University of New York - Binghamton
Flip Chip Technology for High Temperature
Automotive Applications
Tania Braun, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner,
H. Reichl, Fraunhofer IZM
Cure Processing Effects on Conductive
Epoxy Adhesives as Solder Alternatives
Wanda O'Hara, Sherri Smith, Chih-Ming Cheng, Emerson & Cuming
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