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Advanced Technical Program
Tuesday, November 18 thru Thursday, November 20, 2003

Wednesday, November 19, 2003

MEMS Packaging
Chairs: David Galipeau, South Dakota State University; Janet Lumpp, University of Kentucky
8 am - 11:25 am

As microelectromechanical systems (MEMS) become more widely used, new packaging challenges and opportunities continue to arise. This session covers state-of-the art solutions in MEMS packaging for inertial, RF, and optical systems.

Vacuum Packaging of MEMS Inertial Sensors
Thomas F. Marinis, Joseph W. Soucy, Draper Laboratory

Novel Noninvasive Methodology for Characterization of Packaging for MEMS Inertial Sensors
Ryszard J. Pryputniewicz, Peter Hefti, Adam R. Siegel, Adam R. Klempner, Cosme Furlong, Worcester Polytechnic Institute; Thomas F. Marinis, Joseph W. Soucy, Draper Laboratory

Low-Cost Manufacturing/Packaging Process for MEMS Inertial Sensors
David F. Guillou, IC Mechanics, Inc.

Low Cost Packaging of MEMS Accelerometers
Lawrence Felton, Michael Duffy, Peter Farrell, Nicole Hablutzel, Willaim Webster, Analog Devices, Inc.

Impact of Thermal Cycles During the Packaging Assembly Process on RF MEMS Switch Performance
Ananda De Silva, Lianjun Liu, Henry Hughes, Motorola Inc.

Low Profile Packaging Solution for RF-MEMS Suitable for Mass Production
Frank Daeche, Günter Ehrler, Michael Weber, Andreas Meckes, Robert Aigner, Hans-Joerg Timme, Infineon Technologies AG

Near Hermetic Air Cavity Plastic Packaging for Wireless, MEMS and Optical Applications
John W. Roman, RJR Polymers

Novel Manufacturing Technology
Chairs: Christina Conway, Rockwell Collins, Inc.; Bob Palumbo, Kyocera America
8 am - 11 am

The pursuit of smaller, more functionalities and cheaper microelectronics demands low cost and robust manufacturing. This session highlights the latest developments in general manufacturing technologies, such as quality system implementation for fabless operations, manufacturing information exchange and PWB component placement optimization. This session also reports, from a manufacturing point of view, the progresses on laser wafer marking, low cost fine line thick film and LTCC.

Implementation of a Quality System for a FABless Semiconductor Company
Mary McDonald, Individual Solution Options/Quality Services, Inc.; Michael Madden, SigmaTel Corp.

Improvement of Placement Accuracy by Placement Optimization
Timo Liukkonen, Aulis Tuominen, Nokia Networks

Laser Wafer Marking at Die Level
Bo Gu, Jack Gillespie, Rainer Schramn, GSI Lumonics Inc.

Low Cost Fine Line Mo-Mn Thick Film for Microwave Applications
Ken Kuang, Lisa Hamel, Kevin Cotner, Kyocera America, Inc.

Manufacturability Study of LTCC Integrated Packages for High Performance, Low Cost RF SiP Modules
Matthew Hoppe, G. Surbeck. H. Moret, K. Green, Ditrans Corporation

An Investigation of the Properties of Newly Developed LTCC Materials for their use in Microwave Antenna
Shotaro Watanabe, Kazunari Watanabe, Katsutoshi Nakayama, Asahi Glass Co., Ltd.

Chair: John Devaney, Hi-Rel Laboratories
8 am - 11 am

This session consists of 7 papers each on a unique topic, 6 of which touch on an aspect of the reliability of components, substrates or materials used in the manufacture of various types of hybrids or multi chip assemblies. The seventh discusses a novel approach to failure analysis on complex circuits used in multi chip modules.

Effect of Hydrogen on GaAs MMICs in Hermetic Packages
Dipendra Nath Goswami, Picosecond Pulse Labs

Effect of Isothermal Aging on the Intermetallic Compound Layer Growth in BGA Joints with Sn-Ag-Cu Solder
Jeong-Won Yoon, Seung-Boo Jung, Sungkyunkwan University; Chang-Bae Lee, Samsung Electro-Mechanics Co., Ltd.

Contact Resistance of Anisotropic Conductive Adhesives
Ranjith Divigalpitiya, Peter Hogerton, 3M Canada Company

The Measurement of Ion Diffusion in Epoxy Molding Compounds used to Encapsulate Microelectronic Devices
Leon Lantz, II, Michael G. Pecht, Mark C. Wood, University of Maryland at College Park

The Significance of Glass Transition Temperature of Molding Compounds for Screening and Reliability Qualification of COTS PEMs
Alexander Teverovsky, QSS Group, Inc.

Quantitative EDX the Effective Column Short Failure Analysis for High Density Integrated Circuit Devices
Suntra Anuntapong, Nopphadol Kongtongnok, AMD Ltd.

Thermal Management
Chairs: Ajay P. Malshe, University of Arkansas; Dave Saums, DS&A
8 am - 11:25 am

The performance of thermal spreaders and heat sinks must keep pace with the demands of the electronic industry as "smaller-faster-lighter" is relentlessly pursued. More efficient and lighter weight thermal spreaders and heat sinks must continue to evolve through improvements in conventional technologies and/or the developments of new materials and technologies to ensure the efficient thermal management of electronic systems. In this session we have included a wide range of cutting edge topics addressed through modeling, experimentation and product development. We invite you to attend this important session, and we look forward for prolific discussions.

AlSiC for Optoelectronic Thermal Management and Packaging Designs
Mark A. Occhionero, Richard W. Adams, Dave Saums, Ceramics Process Systems

Impact of Heat Spreading Lids on Flip Chip Thermal Performance; With and Without Heat Sink
Jamil Wakil, IBM

LTCC Substrates with Internal Cooling Channel and Heat Exchangers
Marc A. Zampino, Hari Adluru, Yanqing Liu, W. Kinzy Jones, Florida International University

Thermal Performance of a High End Flip-Chip Organic Package
V. V. Calmidi, S. B. Sathe, Endicott Interconnect Technologies, Inc.

High Performance Dual Redundant (DR) Fan Modules
Howard Harrison, HB Innovation Ltd.; Fue-Sang Lien, University of Waterloo

Development of a Process Friendly Film for High Performance Thermal Management Applications
Andrew P. Collins, Chih-min Cheng, Emerson and Cuming

Remote Heat Sink with Temperature Control using a Miniaturized Loop Heat Pipe
Dimitry K. Khrustalev, Thermacore International, Inc.

Marketing Forum
Chairs: Michael P. O'Neill, Heraeus Inc. - CMD; Howard Imhof, Metalor Corp.; Adam Singer, Cookson Electronics
8 am - 11:25 am

The MMRC (Microelectronics Marketing Research Council) will offer a free-of-charge Marketing Forum to all IMAPS 2003 attendees who wish to participate. The Marketing Forum will be held on Wednesday morning, November 19, 2003, at the Hynes Convention Center, Boston, MA (Room number TBA).

2003 was forecasted as a year of continuing recovery for various segments of the microelectronics industry. This session will help clarify if those forecasts have been fulfilled, which technologies are “hot”, and which continue to struggle. With many companies resources stretched thin, how does this impact their ability to develop and deliver product? What was the impact of war, SARS, and the overall geopolitical environment on our industry? With manufacturing continuing its migration to low cost regions, how does this impact YOUR business? These questions and more will be addressed.

Speakers will discuss their analysis and insights into various current and emerging markets of interest to both current and prospective IMAPS members. Some of these markets are Passive Devices, WLAN, Automotive, Broadband, Wireless, manufacturing in China, etc. The Forum will feature four presentations with a panel discussion at the end that will allow for audience participation in this not to be missed event!

Opening Remarks
Michael O'Neill, Chairman, MMRC Steering Committee

Packaging is Leading the Recovery
Jim Walker, Gartner Dataquest

Opportunities for Application Specific and Value Added Components
Dennis Zogbi, Paumanok Group

Broadband Wireless Technology and Opportunities
Jack Browne, Penton Media

Global Electronics Manufacturing - The China Wild Card
Jan Vardaman, TechSearch International

The Wireless Industry - What's Hot and What's Not
Don Brown, International Wireless Packaging Consortium

Panel Discussion
Moderator - Jack Browne, Penton Media

Technology Drivers Trends for Electronic, Optical, Mechanical and Chemical Packaging Technologies toward Ubiquitous Network Age
(Japanese Translated Session)
Chairs: Fumio Miyashiro, Toshiba Chemical Corp.; Andy London, Heraeus Incorporated-Circuit Materials Division
8 am - 11:25 am

New applications in Advanced Packaging Technologies, based especially on Nano, MEMS and sensing Technologies as part of the coming Ubiquitous Network Age. Recently developed examples such as modules, components, substrates and materials will be introduced.

Advanced Packaging Technology Trend for Mobile Terminals toward Ubiquitous Age in Japan
Tomiyo Ema, Panasonic Mobile Communications Co., Ltd.

A Battery-Less Wireless System uses Ambient Heat with a Low-Voltage CMOS/SOI DC-DC Converter
Yoshifumi Yoshida, Seiko Instruments Inc.

Development of Direct Methanol Fuel Cell (DMFC) for Electric Power Supply of Portable Mobile Terminals
Hirohisa Miyamoto, Toshiba Corporation

Micro Fuel Cells using Carbon Nanohorns: A Portable Power Source in the Ubiquitous Society
Yoshimi Kubo, NEC

The Status and Future of Optical Circuit Packaging Technology
Osamu Mikami, Tokai University

Robot Technologies for Human-Robot Cooperation Systems in Ubiquitous Age
Yasuhisa Hirata, Tohoku University

Ubiquitous Transducers for Health Care and Environmental Analysis
Kohji Mitsubayashi, Tokai University

Sensors and MEMS
Chairs: David Galipeau, South Dakota State University; Richard Gehman, Honeywell Sensing and Control
2 pm - 5:25 pm

Sensor and MEMS applications continue to grow rapidly in traditional markets such as hazardous gas detection as well as newer areas like biomedical and RF MEMS. This session covers state-of-the-art sensors, systems, materials, and MEMS structures to measure hazardous gases, automotive emissions, and urinary pressure, as well as for RF applications.

Gasoline Vapor Sensor for Power Vent Water Heaters
Richard W. Gehman, Honeywell Sensing and Control

Screen-Printed Fe2O3/ZnO Thick Films for Gas Sensing Applications
Khalil Arshak, Ibrahim Gaidan, University of Limerick

The Application of Sensors in Automotive Emissions Testing
Delip "Doug" R. Bokil, Environmental Systems Products Holdings Inc.

Telemetry in Measuring Urinary Bladder Pressure
Bujjibabu Godavarthi, Joan Delalic, Michael R. Ruggieri, Michel A. Pontari, Temple University

Thermal Characterization of RF MEMS Relay Switch Design
Ryszard J. Pryputniewicz, Malgorzata S. Machate, David Rosato, Cosme Furlong, Worcester Polytechnic Institute

Design, Modeling and Simulation of Electrostatic flexures for Microelectromechanical Systems (MEMSEF)
Muhammad Imran, William L. Ables Jr., University of Arkansas at Little Rock

Electrophoretic Photoresist for Patterning Three Dimensional Structures (How to make groovy patterns and not mind being in the pits)
Jill E. Steeper, Shipley

RF & Microwaves
Chairs: John Gipprich, Northrop Grumman Corporation; Fred Barlow, University of Arkansas
2 pm - 5:25 pm

Packaging and integration of RF & Microwave circuits is a growing and important area. This session includes presentations covering new packaging methods, material evaluation, and new materials tailored for these demanding applications. In addition, several speakers will discuss new filter designs and the integration of these designs into compact product form factors.

New Temperature Calibration Method for Digital Microwave Radio Transceivers
N. Hassaine, L. Villeneuve, F. Concilio, Harris Corporation

MCMs for Space Application : up to 40 GHz inside the Multilayer Ceramic
Claude Drevon, Chloé Schaffause, Jean-Louis Cazaux, Alcatel Space Industries

Application of Uniplanar Structures for High Frequency Material Characterization
Can Eyup Akgun, Rhonda Franklin Drayton, University of Minnesota; Dan Amey, Tim Mobley, DuPont Microcircuit Materials

Embedded Passives in Low-Temperature Co-Fired Ceramic for RF & Microwave Applications
Michael Folk, S. Kaza, V. Wang, A. Elshabini, F. Barlow, University of Arkansas

New LTCC Material with Zero TCF and Low Loss at 15GHz
Yoshio Umayahara, Masaru Iwao, Kazuyoshi Shindo, Nippon Electric Glass Co., Ltd.

Synthesis and Characterization of Particle Filled LTCC Tape for Wireless Communication Applications
Kyoung-Ho Lee, Sun-Young Kim, Soonchunhyang University

LTCC MLC Bandpass Filter using Quarter-Wavelength Hairpin Resonators for WLAN
Gyu-Je Sung, Dong-Hun Yeo, Hankyong National University

Thick and Thin Film Material Processing
Chairs: Michael Ehlert, National Semiconductor LTCC Foundry; John Menaugh, DuPont Microcircuit Materials
2 pm - 5 pm

This session will highlight several new developments in ceramic substrates, especially LTCC, and new inks. Process topics include aqueous casting, fine line screen printing and a new thermal measurement method.

Lead and Cadmium Free Low Temperature Firing Thick Print Copper Inks
Orville W. Brown, Srinivasan Sridharan, Ferro Corporation

New Approach to Thermal Conductivity of Thin Films Measurements by Means of Comparative Method
Selim Achmatowicz, Elzbieta Zwierkowska, Institute of Electronic Materials Technology; Wojciech Lobodzinski, The Institute of Pro-Ecologic Electrothermics

A Model of Fine Line Screen-printing on LTCC
Shao-Ju Shih, Ricky Chen, Chiu Kuo-Chuang, Hung Ying-Chang, Lin Hong-Ching, Industrial Technology Research Institute

Dielectric and Magnetic LTCC Material System
Uwe Mackens, D. Hennings, B. Schreinemacher, R. Mauczok, S. Gruhlke, C. Martiny, M. Matters-Kammerer, K. Reimann, Philips Research Laboratories

Comparative Study on Laser Trimming with Different Wavelengths
Bo Gu, Bruce Couch, J.J. Oh, Paul Chase, GSI Lumonics Inc.

Development Thermoelectric Detectors on Base Higher Manganese Silicide (HMS) Films
T. S. Kamilov, A. A. Uzokov, D. K. Kabilov, S. F.Ganikhanov, R. A. Muminov, B. N. Zaveryuhin, V. V. Klechkovskaya, Tashkent State Aviation Institute

Wafer Level Packaging
Chairs: Michael Toepper, Fraunhofer IZM; Jamin Ling, ST Assembly and Testing Services (STATS - US)
2 pm - 5:25 pm

The importance of Wafer Level Packaging to a number of new and emerging technologies including traditional integrated circuit applications as well as MEMS and optoelectronic packaging applications is fueling the drive towards this form of packaging. This session will cover a host of applications involving wafer level packaging as well as some key developments in process technology which make these applications possible.

Compliant Wafer Level Packaging - A New Packaging Platform for Memory Products
Harry Hedler, Thorsten Meyer, Wolfgang Leiberg, Infineon

New Wafer Level Structure for Stress Free Area Array Solder Attach
Raymond A. Fillion, Laura Meyer, Kevin Durocher, Slawomir Rubinsztajn, David Shaddock, Joshua Wright, GE Global Research Center

Development of Wafer Level Packaging with Plastic Core Solder Ball
Masto Sumikawa, Rina Murayama, Masashi Ogawa, Hiroshi Matsubara, Sharp Corporation

Room Temperature Bond for Wafer Level Packaging
Helge W. Luesebrink, Austria Markus Wimplinger, Chad Brubaker, EV Group, Inc.; Paul Lindner, Austria Thomas Glinsner, EV Group GmbH

Wafer-Level Hermetic Cavity Packaging for MEMS, Optoelectronics, and Sensors
George A. Riley, FlipChips Dot Com

Wafer-Scale Packaging of Opto-Electronic Devices
Daryl Spencer, A. P. Malshe, R. B. Foster, University of Arkansas; C. B. O'Neal, SYCONN Corporation

Front End Compatible WL-CSP-Technology for RF- and HT-Applications
Klaus Burger, ATMEL Germany GmbH

Interactive Forum (Poster Session)
1 pm - 4pm

EWOD Induced Fluid Flow for Biological Applications
Ryan T. Marinis, Ryszard J. Pryputniewicz, Worcester Polytechnic Institute

Controlled Laser Ablation of Polyimide Substrates
Peter Gordon, Richard Berenyi, Balint Balogh, Budapest University of Technology and Economics

Epoxy Flux for Lead-Free Soldering
Ning-Cheng Lee, Wusheng Yin, Indium Corporation of America

MEMS Sensors for Temperature, Pressure, and Relative Humidity Measurements
Houri Johari, Ryszard J. Pryputniewicz, Worcester Polytechnic Institute

Modeling Fatigue Behavior of Electronically Conductive Filled Adhesive Joints under Cyclic Loading a Novel Modeling Approach for Integrated Joint Life Prediction
Rajesh R. Gomatam, Lehigh University; Erol Sancaktar, University of Akron

Reconfigurable Embedded Test for Improved System Reliability
Kimberly E. Newman, University of Denver

Development of Au Reflection Film with High Adhesion for Optical Interconnection between LSI Chips
Koichi Yokota, Ryohei Satoh, Yoshiharu Iwata, Kozo Fujimoto, Shogo Ura, Kenji Kintaka, Osaka University

SnZnAl Lead-free Solder with High Packaging Reliability
Masayuki Kitajima, Tadaaki Shono, Satoshi Masuda, Fujitsu Limited

On-Chip Isolation in Wafer-Level Chip-Scale Packages: Substrate Thinning and Circuit Partitioning by Trenches
M. Bartek, S. M. Sinaga, A. Polyakov, J. N. Burghartz, Delft University of Technology, DIMES/ECTM

Analytical and Experimental Characterization of an Optical MEMS Device
Ryszard J. Pryputniewicz, Cosme Furlong, Emily J. Pryputniewicz, Worcester Polytechnic Institute

Elimination of Epoxy Resin Bleed Through Thin Film Plasma Deposition
Martin J. Burmeister, Stellar Microelectronics, Inc.

Mechanical Strength of Glass Ceramic Substrates in Land Grid Array Packages
Angelo Villani, Peter Martino, Hewlett-Packard Company

Small Form Factor Fiber Optic Transceiver with Unique Design to Meet EMC/EMI/ESD and Thermal Requirements
Sunil Priyadarshi, Ihab Khalouf, Kishore Kamath, Shaun P Scrak, Julie Sheridan, Luminent Inc.

Flexible Thermal Management Circuits Bonded Directly to Aluminum Heat Sinks
Jim Fraivillig, Fraivillig Technologies

Failure Modes of Flip Chip Solder Joints under Current Stressing
Hua Ye, Cemal Basaran, Douglas C. Hopkins, State University of New York at Buffalo

Quantitative LGA/Substrate Assembly Contact Study from Pressure Sensitive Film Measurements
Wei Zou, Longworth Hai, IBM

A Novel Planarization Process for Providing Global Planarity for IC Manufacturing
Wu-Sheng Shih, Mark G. Daffron, Brewer Science, Inc.

Passive Component Integration in LTCC
Liang Chai, Aziz Shaikh, Vern Stygar, Ferro Electronic Material Systems

Estimation of Sn-3.0Ag-0.5Cu Solder Joint Reliability by Weibull Distribution and Modified Coffin-Manson Equation
Mitsuharu Yamabe, Toshiba Corporation

Development of Optoelectronic Holography Techniques for Nondestructive Evaluation of MEMS at the Wafer Level
Cosme Furlong, Curtis F. Ferguson, Michael J. Melson, Kevin A. Bruff, Ryszard J. Pryputniewicz, Worcester Polytechnic Institute

Tin-Silver Electroplating of Pb-free Wafer Bumps
Rozalia Beica, Kai Wang, Neil Brown, Shipley Company; Roger Quon, Tien Cheng, John Griffith, IBM

Hybrid Approach to Thermal Management of a FET Power Amplifier
Ryszard J. Pryputniewicz, David Rosato, Cosme Furlong, Dariusz R. Pryputniewicz, Worcester Polytechnic Institute

Effect of Die-Attach Adhesives on the Stress Evolution in MEMS Packaging
Junghyun Cho, Satyajit S. Walwadkar, P. W. Farrell, Lawrence E. Felton, State University of New York - Binghamton

Flip Chip Technology for High Temperature Automotive Applications
Tania Braun, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl, Fraunhofer IZM

Cure Processing Effects on Conductive Epoxy Adhesives as Solder Alternatives
Wanda O'Hara, Sherri Smith, Chih-Ming Cheng, Emerson & Cuming

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