NTCµ Hands-On Factory Training Workshops
Sunday, November 16, 2003
The National Training Center for Microelectronics (NTCµ),
located in Bethlehem, Pennsylvania, is an extension of Northampton
Community College. NTCµ is the recognized leader in microelectronics
manufacturing industry training and is known for clear, concise
"hands-on" training courses specializing in hybrid,
RF and related technologies. All courses carry Continuing Education
Units (CEU) which earn credit toward your degree. Website: www.northampton.edu/ntc.
The hands-on workshops sell out quickly and enrollment
is limited, please check for availability. Email Rayma
or call 202-548-4001 ext. 711.
Sunday, November 16
9 am - 5 pm
The "hands-on" courses are back! In the past the "hands-on"
courses have sold out early and were an overwhelming success. IMAPS,
in partnership with the National Training Center for Microelectronics
(NTCµ) is again offering technical training sessions designed
to provide attendees with a "hands-on" learning experience.
Enroll early as class size is limited!
Screen Printing (how to) for Operators and Technicians
Wirebonding (how to) for Operators and Technicians
Enrollment limited to 10 students
Instructor: Thomas J. Green, National Training Center for
This course is intended as a practical "hands-on" set
of laboratory exercises to allow the operators to really understand
the wire bonding process. An experienced industry instructor will
review the basic manual wire bonder equipment design and setup
and explore how machine settings such as power, time, force and
stage temperature affect the bonding process. Both ultrasonic
wedge and thermosonic ball bonding will be explored using the
industry's latest manual wire bonders. Students will also have
an opportunity to perform wire pull and ball shear testing and
visually inspect wire bond interconnects to gain further insights
into the process.
What you will learn:
After completing the course, you will be able to:
o understand the basics of thermosonic and ultrasonic wire bonding
o recognize visual defects and how to prevent them
o learn how to do wire pull and ball shear testing
o know how to set up and use manual wirebonding equipment
Who Should Attend:
This course is intended as a beginning to intermediate level course
for operators, technicians and others with limited wire bonding
experience interested in a practical "hands-on" tutorial.
Tom Green has eighteen years experience in
the microelectronics industry and presently teaches at the National
Training Center for Microelectronics. As a staff engineer with
Lockheed Martin he was responsible for the materials and processes
used in building custom hybrids and RF microcircuits for space
applications. Specific areas of expertise included wire bonding,
die attach and seam sealing. As an officer assigned to USAF Rome
Laboratories he conducted research on semiconductor failure mechanisms
and analyzed numerous microelectronic component failures from
Air Force avionics systems. He has published seven technical papers
and is a member of the IMAPS National Technical Committee. Tom
earned a B.S. in Metallurgy and Materials Engineering from Lehigh
University and a Masters in Engineering from University of Utah.