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Call for Papers - IMAPS 2003

 36th International Symposium on Microelectronics

Hynes Convention Center
Boston, MA
November 16-20, 2003

The 36th International Symposium on Microelectronics will be held at the Hynes Convention Center, Boston, MA. It is sponsored by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. All abstracts submitted must represent original, previously unpublished work.

General Chair: 
Doug Bokil

Technical Program Chair:
Ken Gilleo, Cookson Electronics
Abstract Cut-off Date: March 14, 2003

Notice of Acceptance: April 14, 2003
Final Manuscripts Due: July 25, 2003

Papers are being sought from, but not limited to, the following subjects:

Advanced Materials & Processes
Advanced Substrate Technology
Area Array Assembly
Automotive Electronics
Chip-Scale Packaging/Flip Chip
High Density Displays
High Density Packaging
Low Cost Packaging Methods
Management & Marketing
Manufacturing Technologies
Medical Electronics
MEMS Packaging and Applications
Modeling & Simulation
Novel Interconnections
Polymer Materials & Applications
Power Packaging/Thermal Management
Printed Wiring and Flex Boards
Quality & Reliability
RF/Microwave — Wireless Sensor Packaging & Applications
Space & Military Electronics
Statistical Process Control Methods
Surface Mount Technology
System Level Packaging
Thick & Thin Film Materials
Wafer Scale Packaging
Please send your 250-300 word abstract electronically only by March 14, 2003, using the On-line submittal form at:

If you are having problems with the on-line submittal form, 
please email Jackki Morris-Joyner or call 305-382-8433.

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