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Sunday PDCs All PDCs run 9 am - 5 pm, unless otherwise noted.
S3 Flip Chip and CSP Technologies - Constructions, Materials, Assembly and Reliability Course Leader: R. Wayne Johnson, Ph.D., Auburn University Course Description: Who should attend? Dr. Johnson is an Alumni Professor of Electrical Engineering at Auburn University and Director of the Laboratory for Electronics Assembly and Packaging (LEAP). At Auburn, he has established teaching and research laboratories for advanced packaging and electronics assembly. Research efforts are focused on materials, processing, and reliability for electronics assembly. He has worked in MCM design, MCM-L, -C and -D substrate technology as well as advanced SMT, wire bond and flip chip assembly techniques. He has published and presented numerous papers at workshops and conferences and in technical journals. He has also co-edited one IEEE book on MCM technology and written two book chapters in the areas of silicon MCM technology and MCM assembly. He received the 1997 Auburn Alumni Engineering Council Senior Faculty Research Award for his work in electronics packaging and assembly. Dr. Johnson is the current Technical Vice President of IMAPS and was the 1991 President of the Society. He received the 1993 John A. Wagnon, Jr. Technical Achievement Award from ISHM, was named a Fellow of the Society in 1994 and received the Daniel C. Hughes Memorial Award in 1997. He is also a member of IEEE, SMTA, and IPC. Dr. Johnson received the B.E. and M.Sc. degrees in 1979 and 1982 from Vanderbilt University, Nashville, TN, and the Ph.D. degree in 1987 from Auburn University, Auburn, AL, all in electrical engineering. He has worked in the microelectronics industry for DuPont, Eaton, and Amperex. S4 Low Temperature Co-fired Ceramics (LTCC) Course Leaders: Fred D. Barlow and Aicha Elshabini, University of Arkansas Course Description: Topics: Who should attend? Aicha Elshabini is Professor of Electrical and Computer Engineering. She obtained a B.Sc. in Electrical Engineering at Cairo University, 1973, in both Electronics and Communications areas, a Masters in Electrical Engineering at University of Toledo, 1975, in Microelectronics, and a Ph.D. Degree in Electrical Engineering at the University of Colorado, 1978 in Semiconductor Devices and Microelectronics. Currently, she is serving the position of Professor and Department Head for the Electrical Engineering Department at University of Arkansas (since July 1, 1999), and Interim Department Head for Computer Science & Computer Engineering Department (since July 1, 2000). She has been serving as the faculty advisor for IMAPS student society at both institutions since 1980 to present time. Elshabini is a Fellow member of IEEE/CPMT Society (1993) Citation for 'Contribution to Hybrid Microelectronics Education and to Hybrid Microelectronics to Microwave Applications', a Fellow member of IMAPS Society (1993), The International Microelectronics and Packaging Society, Citation for 'Continuous Contribution to Microelectronics and Microelectronics Industries for numerous years'. Dr. Elshabini was awarded the 1996 John A. Wagnon Jr., Technical Achievement Award from IMAPS. She has served as the Editor of the IMAPS International Journal of Microcircuits & Electronic Packaging for 10 years. Fred Barlow earned a Bachelors of Science in
Physics and Applied Physics from Emory University in 1990, a Masters
of Science in Electrical Engineering from Virginia Tech in 1994,
and a Ph.D. in Electrical Engineering from Virginia Tech in 1999.
He is currently working as Assistant Professor in the Electrical
Engineering Department at University of Arkansas. Dr. Barlow has
published widely on electronic packaging and electronic materials
evaluation and is Co-Editor of The Handbook of Thin Film Technology
(McGraw Hill, 1998). In addition, he has written several book
chapters including two chapters on thin films and one on components
and devices. He has achieved the Outstanding Contribution Award
with IMAPS in recognition of his efforts in developing and implementing
the CD-ROM project for IMAPS publications, IMAPS home page on
the Internet, and for his technical contributions. He currently
serves on the IMAPS national technical committee for power packaging.
His research interests include electronic packaging for power
electronic and microwave applications as well as RF and microwave
design. S5 Fundamentals of Fabrication and Packaging of MEMS, Related Micro and Nano Systems Course Leader: Ajay P. Malshe, Ph.D., High Density Electronics Center (HiDEC), University of Arkansas Course Description: Course Notes: Specific Topics Covered: Who should attend? Ajay P. Malshe is an Associate Professor at the Department of Mechanical Engineering, Director of SERC for Durable Micro and Nano Systems, and an adjunct faculty at the High Density Electronics Center (HiDEC), Department of Electrical Engineering, University of Arkansas, USA. His three distinct fields of research and educational interest are integration and advanced packaging of micro and nano systems, nanomanufacturing, and surface engineering of materials for advanced manufacturing. He has edited two proceedings, and authored two book chapters including one on MEMS Packaging; over one hundred referred publications, holds five patents and four pending. He is currently an active Executive Council member of International Microelectronics And Packaging Society (IMAPS) through the organization of Advanced Technology Workshops (ATW) on MEMS Packaging. Currently, he is Chairman of Thermal Management Technical Sub-committee and also National Chair of Topical Technology Workshops for IMAPS. In addition he is an active member of ASME, IEEE, MRS and AVS. S6 Advanced Organic Substrate Package Design & Manufacturing for RF & Broadband Applications Course Leader: Hassan Hashemi, Conexant Systems Course Description: Course Content: The class will be run informally and interaction with the attendees is encouraged. Questions and tangential discussions will be invited. Who should attend? Hassan Hashemi is Executive Director of Advanced Packaging & Product Development at Mindspeed Technologies, a Conexant Systems Business in Newport Beach, California. He is currently managing design and development of single and multi-chip packages for broadband digital, mixed-signal, and RF devices used in infrastructure communication and storage applications. He holds a Masters degree in electrical engineering from the University of Texas at Austin, and has over 18 years of experience in microelectronics package design, manufacturing, and product development. Prior to joining Conexant, he was a senior member technical staff at Microelectronics and Computer Corp. and Advanced Micro Devices. He holds 14 US patents, has authored three book chapters and over 40 technical papers in the areas of high-speed package electrical and thermal design and implementation. S7 RF/Microwave Hybrids: Basics, Materials and Processes Course Leader: Richard Brown, Richard Brown Associates, Inc. Course Description: Who should attend? Special Course Materials: Richard Brown is a technical and engineering
consultant in hybrids, with more than 30 years experience, encompassing
thin and thick film, electroplating and substrate technologies.
He began his career at Bell Telephone Laboratories. After joining
RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave
Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa
Electronic Packaging technology team as program manager to implement
thin film on high temperature co-fired ceramic for MCMs. He has
published extensively, authoring a chapter on Thin Film for Microwave
Hybrids in "Handbook of Thin Film Technology," McGraw-Hill,
NY, 1998, A. Elshabini-Riad, Ed. In 1995, ISHM awarded him the
prestigious John A. Wagnon, Jr., Technical Achievement Award.
His text "Materials and Processes for Microwave Hybrids"
was published in 1991 by ISHM, Reston, VA, and most recently,
RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer
Academic Press, 2002 S8 Overview of MEMS, MOEMS and Nano Technology Course Leader: Dr. Ken Gilleo, Cookson Electronics Cancelled 1/2 Day Course - AM
S9 runs 9 AM - Noon S9 New Developments for Electronic Packaging and Assembly Course Leader: Dr. Jennie S. Hwang, H-Technologies Group, Inc. Course Description: What will you learn? Special Course Materials: Who should attend? Dr. Hwang received her doctorate in Materials Science & Engineering from Case Western Reserve University and two masters from Columbia University and Kent State University's Liquid Crystal Institute She has been a major contributor to Surface Mount Technology since its inception. Serving as an advisor to major OEMs/ODMs, U.S. government and contract manufacturers, she has provided solutions to many challenging production-floor problems in the last 20-years of SMT establishment, including U.S. F-22 program. Among her many honors and awards, Dr. Hwang is elected to the National Academy of Engineering, inducted to the WIT International Hall of Fame, and received Distinguished Alumni Award from her alma maters. She also received the U.S. Congressional Certificate of Recognition, YWCA Women of Achievement Award, and was named one of the 28 R&D-Stars-to-Watch by Industry Week. She has held various "Woman pioneering" capacities. She is an invited lecturer/keynote speaker worldwide and the author of over 200 publications, including the sole authorship of five internationally used textbooks and a co-author of several books related to electronic packaging and assembly technologies. She writes a monthly column for SMT Magazine. Contributing to corporate governance, education and community, Dr. Hwang has served on various corporate, educational, and civic boards. She is a member of various professional organizations, having served as the National President of Surface Mount Technology Association. She has held executive positions with Lockheed Martin, SCM and IEM Corp., currently the president of H-Technologies Group Inc., providing technology and business solutions to the electronics industry. S10 FOR STUDENTS ONLY! - FREE Microsystems Packaging: Technologies, Markets and Careers 1/2 Day Course PM o 1 PM - 5:00 PM Instructors: Prof. Rao R. Tummala, Petit Chair Professor, Director NSF-PRC, GRA Scholar, Georgia Institute of Technology; Janet K. Lumpp, University of Kentucky; Leyla Conrad, Georgia Institute of Technology Information technology involves hardware, software, applications and services. This industry has become the largest industry surpassing agriculture that lasted more than a millennium and steel that lasted more than a century. It is becoming the driving engine for science, technology, manufacturing and services paving the way for unparalleled prosperity of people and countries that participate in it. Better than 80% of all millionaires in the U.S. during the last five years have been attributed to this industry. Microelectronics systems packaging involves all the technologies in forming electronic systems for consumer, telecom, computer, automotive, aerospace and medical industries. These technologies typically involve all the components and their interconnections to form system level boards to provide system level functions. Microelectronics packaging is the ultimate cross-disciplinary technology that involves engineers from various backgrounds. For example: electrical design typically performed by Electrical or Electronic and Computer Engineers; thermo-mechanical design by Mechanical Engineers; development of new materials that provide the required functions by Materials Engineers; fabrication of components by Chemical Engineers; electrical test by Electrical or Electronic Engineers; IC and board assembly by Mechanical or Materials Engineers; thermal management and reliability by Mechanical Engineers; and so on. Working together as a team from all these disciplines, packaging engineers design, fabricate, integrate, test, cool and assure reliability of the entire microelectronic system. This four-hour course will present the global microelectronics
market, past and future technologies that constitute this market,
the educational opportunities that are available and career prospects
for a lifelong career around the world in various industries. |
