Sunday, November 16, 2003
All PDCs run 9 am - 5 pm, unless otherwise noted.
All PDCs will be held at the Hynes Convention Center.
Sunday, November 16
5 pm - 6 pm
Attendees & Instructors only)
Flip Chip and CSP Technologies - Constructions, Materials, Assembly
R. Wayne Johnson, Ph.D., Auburn University
The increasing number of I/O per semiconductor chip combined with
the product driven requirements of thinner, smaller and lighter
weight have lead the electronics packaging and assembly industry
to chip scale packages and flip chip (Flip Chip in Package (FCiP)
and Flip Chip on Laminate (FCoL)) technologies. In fact, many
CSPs use FCiP constructions. This course will begin by examining
the drivers for flip chip and CSP technologies then examine the
options, their construction and trade-offs. 3-D CSPs will also
be examined. Substrate design requirements will be discussed including
routing, and pad design. Major assembly issues are flux selection
for flip chip, solder paste printing for CSPs, under filling,
if necessary, and inspection. Under filling which is not a traditional
SMT assembly process is required for flip chip and often for CSPs.
The under fill process and material options for flip chip and
CSP will be examined. Recently, wafer applied under fill material
concepts for FCoL assemblies have been discussed and this new
technology concept will be explored. The replacement of leads
by solder spheres impacts reliability, particularly in thermal
cycling and bending, and must be considered prior to implementing
these technologies. The course will conclude with a discussion
Who should attend?
This Course is intended for those individuals soon to be responsible
for implementing flip chip assembly, suppliers of materials and
equipment for flip chip assembly and others interested in flip
Dr. Johnson is an Alumni Professor of Electrical
Engineering at Auburn University and Director of the Laboratory
for Electronics Assembly and Packaging (LEAP). At Auburn, he has
established teaching and research laboratories for advanced packaging
and electronics assembly. Research efforts are focused on materials,
processing, and reliability for electronics assembly. He has worked
in MCM design, MCM-L, -C and -D substrate technology as well as
advanced SMT, wire bond and flip chip assembly techniques. He
has published and presented numerous papers at workshops and conferences
and in technical journals. He has also co-edited one IEEE book
on MCM technology and written two book chapters in the areas of
silicon MCM technology and MCM assembly. He received the 1997
Auburn Alumni Engineering Council Senior Faculty Research Award
for his work in electronics packaging and assembly. Dr. Johnson
is the current Technical Vice President of IMAPS and was the 1991
President of the Society. He received the 1993 John A. Wagnon,
Jr. Technical Achievement Award from ISHM, was named a Fellow
of the Society in 1994 and received the Daniel C. Hughes Memorial
Award in 1997. He is also a member of IEEE, SMTA, and IPC. Dr.
Johnson received the B.E. and M.Sc. degrees in 1979 and 1982 from
Vanderbilt University, Nashville, TN, and the Ph.D. degree in
1987 from Auburn University, Auburn, AL, all in electrical engineering.
He has worked in the microelectronics industry for DuPont, Eaton,
Low Temperature Co-fired Ceramics (LTCC)
Fred D. Barlow and Aicha Elshabini, University of Arkansas
This course is a one-day PDC focusing on the materials, processes,
design, and applications of Low Temperature Co-fired Ceramics
(LTCC). The course will begin with a brief history and background
of the technology. A detailed discussion of the process flow and
processes will cover each step used in the fabrication of LTCC
substrates. A discussion of the material properties and design
guidelines and considerations will also be covered in detail.
Finally, a discussion of the technical advances and the technical
applications of the technology will outline the relative strengths
of LTCC for a number of target markets.
· History of LTCC and Background
· LTCC Process
· Material Properties
· Design Considerations
· Technical Advances
Who should attend?
Engineers, managers, and technicians, who desire to expand their
background or strengthen their understanding of the technology.
The course will not assume any prerequisite background.
Aicha Elshabini is Professor of Electrical
and Computer Engineering. She obtained a B.Sc. in Electrical Engineering
at Cairo University, 1973, in both Electronics and Communications
areas, a Masters in Electrical Engineering at University of Toledo,
1975, in Microelectronics, and a Ph.D. Degree in Electrical Engineering
at the University of Colorado, 1978 in Semiconductor Devices and
Microelectronics. Currently, she is serving the position of Professor
and Department Head for the Electrical Engineering Department
at University of Arkansas (since July 1, 1999), and Interim Department
Head for Computer Science & Computer Engineering Department
(since July 1, 2000). She has been serving as the faculty advisor
for IMAPS student society at both institutions since 1980 to present
time. Elshabini is a Fellow member of IEEE/CPMT Society (1993)
Citation for 'Contribution to Hybrid Microelectronics Education
and to Hybrid Microelectronics to Microwave Applications', a Fellow
member of IMAPS Society (1993), The International Microelectronics
and Packaging Society, Citation for 'Continuous Contribution to
Microelectronics and Microelectronics Industries for numerous
years'. Dr. Elshabini was awarded the 1996 John A. Wagnon Jr.,
Technical Achievement Award from IMAPS. She has served as the
Editor of the IMAPS International Journal of Microcircuits &
Electronic Packaging for 10 years.
Fred Barlow earned a Bachelors of Science in
Physics and Applied Physics from Emory University in 1990, a Masters
of Science in Electrical Engineering from Virginia Tech in 1994,
and a Ph.D. in Electrical Engineering from Virginia Tech in 1999.
He is currently working as Assistant Professor in the Electrical
Engineering Department at University of Arkansas. Dr. Barlow has
published widely on electronic packaging and electronic materials
evaluation and is Co-Editor of The Handbook of Thin Film Technology
(McGraw Hill, 1998). In addition, he has written several book
chapters including two chapters on thin films and one on components
and devices. He has achieved the Outstanding Contribution Award
with IMAPS in recognition of his efforts in developing and implementing
the CD-ROM project for IMAPS publications, IMAPS home page on
the Internet, and for his technical contributions. He currently
serves on the IMAPS national technical committee for power packaging.
His research interests include electronic packaging for power
electronic and microwave applications as well as RF and microwave
Fundamentals of Fabrication and Packaging of MEMS, Related Micro
and Nano Systems
Ajay P. Malshe, Ph.D., High Density Electronics Center (HiDEC),
University of Arkansas
Fabrication and application specific packaging of micro electromechanical
systems (MEMS) is a subject of immense interest. Their application
specific packaging with other components is challenging and unlike
IC packaging, has a different set of demands from releasing, dicing-to-interconnection
at chip-scale and manufacturing at wafer-level. This globally
taught course will address silicon and non-silicon micro fabrication
processes and related design details, and packaging of silicon
and non-silicon MEMS and related microsystems. The course will
use a range of novel applications to advocate the use of various
fabrication and packaging processes. The course will also introduce
a new area on the horizon - "nano packaging and manufacturing."
In the broader scope of the subject, for the 21st century packaging
community infusion of signals (electrical, optical, chemical,
mechanical, etc.), domains (hermetic, vacuum, fluidic, optical,
etc.) and scales (nano-to-micro-macro) are of significant importance
for designing and developing next generation engineered micro
and nano products as well as for adding value / functions to the
existing products. Particularly, key words, namely MEMS, micro
systems and nano technology, have the captured attention of technology
leaders. MEMS and related micro systems are typically divided
into two application areas: sensors and actuators. These are applied
for a range of applications such as automotive, biomedical, optical,
RF, etc. Examples of systems, devices and related application
specific packages, are accelerometers, gyros, DMDâ, lab-on-a-chip,
SMART drugs, etc. Further, with the major investment and key advancements
in nanotechnology, nano integrated MEMS and related micro devices
and packages are of major importance to the next generation of
engineered electronic systems.
(1) Chapter by "Packaging of MEMS and MOEMS: Challenges and
A Case Study" by Drs. Malshe and O'Conner, (2) copies of
the transparencies on MEMS and Nanomanufacturing, and (3) publication-
"NSF-EC Workshop on Nanomanufacturing and Processing: A Summary
Report," Malshe et al., SPIE International Symposium on Smart
Materials, Nano-, and Micro-Smart Systems, Melbourne, Australia,
Specific Topics Covered:
Morning Session (Module I): Introduction, Fabrication, Testing,
Reliability and Services.
Afternoon Session (Module II): An Introduction to M4 and MEMS,
their Packaging and Assembly, and Nano Packaging and Manufacturing.
Who should attend?
The course is meant for industry and academic leaders and investors
in science and engineering with interest in MEMS and related micro
and nano systems. Highly recommended for R&D scientists, engineers
and managers involved in sensors, actuators, instrumentation and
systems related to micro and nano systems technology. Graduate
students with special interest in the above areas will also find
Ajay P. Malshe is an Associate Professor at
the Department of Mechanical Engineering, Director of SERC for
Durable Micro and Nano Systems, and an adjunct faculty at the
High Density Electronics Center (HiDEC), Department of Electrical
Engineering, University of Arkansas, USA. His three distinct fields
of research and educational interest are integration and advanced
packaging of micro and nano systems, nanomanufacturing, and surface
engineering of materials for advanced manufacturing. He has edited
two proceedings, and authored two book chapters including one
on MEMS Packaging; over one hundred referred publications, holds
five patents and four pending. He is currently an active Executive
Council member of International Microelectronics And Packaging
Society (IMAPS) through the organization of Advanced Technology
Workshops (ATW) on MEMS Packaging. Currently, he is Chairman of
Thermal Management Technical Sub-committee and also National Chair
of Topical Technology Workshops for IMAPS. In addition he is an
active member of ASME, IEEE, MRS and AVS.
Advanced Organic Substrate Package Design & Manufacturing for
RF & Broadband Applications
Hassan Hashemi, Conexant Systems
The objectives of this course are to review design and manufacturing
practices and tradeoffs affecting current and next generation
RF & GHz Packaging using laminate substrate technologies in
single or multiple die packaging format. The course material is
primarily based upon the instructor's experience on current practices
used for Wireless & GHz IC packaging for internet infrastructure
applications. The course is designed for engineers or engineering
managers who want to understand more about laminate single or
multi chip modules, and the unique requirements for assuring that
packages can be manufactured in a high volume commercial application
and meet stringent electrical and thermal performance requirements.
· Overview of Multi Chip packages and their benefits
· Review RF laminate packages designed to use Chip On Board,
embedded passives, & SMD
· RF MCM-L design issues with emphasis on design for high
· Power Amplifier modules, Transmit modules, and Radio-on-a-Package
· Package electrical, thermal, and mechanical modeling
in support of design verification and process development
· Review of MCM-L materials, processes, and manufacturing
· Discuss quality and reliability concerns with RF MCM-Ls
The class will be run informally and interaction with the attendees
is encouraged. Questions and tangential discussions will be invited.
Who should attend?
The course is intended for both the packaging expert (Electrical
and Mechanical Engineers) as well as persons new to the field.
The course will concentrate on extending the existing organic
substrate infrastructure capability to GHz high volume packaging
applications. The information presented will include the theoretical
background with practical methods for implementing a design. These
same techniques can be applied to other high frequency single
or multichip package designs.
Hassan Hashemi is Executive Director of Advanced
Packaging & Product Development at Mindspeed Technologies,
a Conexant Systems Business in Newport Beach, California. He is
currently managing design and development of single and multi-chip
packages for broadband digital, mixed-signal, and RF devices used
in infrastructure communication and storage applications. He holds
a Masters degree in electrical engineering from the University
of Texas at Austin, and has over 18 years of experience in microelectronics
package design, manufacturing, and product development. Prior
to joining Conexant, he was a senior member technical staff at
Microelectronics and Computer Corp. and Advanced Micro Devices.
He holds 14 US patents, has authored three book chapters and over
40 technical papers in the areas of high-speed package electrical
and thermal design and implementation.
RF/Microwave Hybrids: Basics, Materials and Processes
Richard Brown, Richard Brown Associates, Inc.
In recent years, the demands for high frequency systems and products
have been growing at a rapid pace. Coupled with the continuing
development of monolithic integrated circuits, MMICs, are new
materials and process refinement of hybrids. As a result, system
and product designers are faced with the choice between hybrids
and MMICs; i.e., complete system on a chip vs. hybrids with discrete
devices, or more often, somewhere in-between. This course will
begin with a short, non-mathematical review of high frequency
basics. Next a comparison of MMICs and hybrids is presented. The
transmission line as the basic circuit component of RF and microwave
hybrids will be reviewed. Hybrid "waveguide" structures
will be compared as they relate to transmission line properties.
The basic materials (conductors, dielectrics and substrates) and
their properties will be introduced. Their effect on impedance,
circuit properties and performance will be discussed. Processing
technologies suitable for RF/microwave hybrids will be reviewed.
Selected packaging protocols, such as vias and bonding wires,
will be discussed in light of their influence on RF/microwave
performance. At the completion of this course, attendees will
have a better understanding of many of the critical materials
and processing factors affecting high frequency circuit performance.
Who should attend?
This introductory course will benefit those associated with the
RF and microwave arena. In particular this course will benefit
those with responsibility for design and manufacturing of RF/microwave
hybrids. Supervisors, engineers and technicians involved in product
development, design and manufacture are encouraged to attend.
Special Course Materials:
All attendees will receive a set of course notes and a copy of
the Mr. Brown's text "RF/Microwave Hybrids: Basics, Materials
Richard Brown is a technical and engineering
consultant in hybrids, with more than 30 years experience, encompassing
thin and thick film, electroplating and substrate technologies.
He began his career at Bell Telephone Laboratories. After joining
RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave
Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa
Electronic Packaging technology team as program manager to implement
thin film on high temperature co-fired ceramic for MCMs. He has
published extensively, authoring a chapter on Thin Film for Microwave
Hybrids in "Handbook of Thin Film Technology," McGraw-Hill,
NY, 1998, A. Elshabini-Riad, Ed. In 1995, ISHM awarded him the
prestigious John A. Wagnon, Jr., Technical Achievement Award.
His text "Materials and Processes for Microwave Hybrids"
was published in 1991 by ISHM, Reston, VA, and most recently,
RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer
Academic Press, 2002
Overview of MEMS, MOEMS and Nano Technology
Dr. Ken Gilleo, Cookson Electronics
1/2 Day Course - AM
S9 runs 9 AM - Noon
New Developments for Electronic Packaging and Assembly
Dr. Jennie S. Hwang, H-Technologies Group, Inc.
In this exciting and changing time, the microelectronics industry
has responded and will continue to respond to the needs of competitive
products in the global marketplace. The course will provide a
capsule view of key segments of electronics hierarchy in market
needs and new technology development. The key areas in chip level,
package level and board level as well as critical supporting materials,
processes and infrastructure will be highlighted.
What will you learn?
· Industry driving forces and technological drivers
· Chip level, General trends and market
· IC package, Evolution & market
· CSP, BGA types and characteristics
· General comparison of CSP, BGA, flip chip and fine pitch
· Array package solder bumping
· Passive components, trends & market
· Technologies for high density PCB
· SMT assembly trends and issues
· General materials, equipment and management issues
Special Course Materials:
All attendees will receive a textbook entitled: "Ball Grid
Array and Fine Pitch Peripheral Interconnections," published
by Electrochemical Publications, LTD, Great Britain, (List Price
US$149) and a workbook.
Who should attend?
This capsule view will provide attendees in managerial, marketing,
engineering and research capacity a broad understanding of the
industry as well as the quick grasp of the technological thrusts.
Dr. Hwang received her doctorate in Materials
Science & Engineering from Case Western Reserve University
and two masters from Columbia University and Kent State University's
Liquid Crystal Institute She has been a major contributor to Surface
Mount Technology since its inception. Serving as an advisor to
major OEMs/ODMs, U.S. government and contract manufacturers, she
has provided solutions to many challenging production-floor problems
in the last 20-years of SMT establishment, including U.S. F-22
program. Among her many honors and awards, Dr. Hwang is elected
to the National Academy of Engineering, inducted to the WIT International
Hall of Fame, and received Distinguished Alumni Award from her
alma maters. She also received the U.S. Congressional Certificate
of Recognition, YWCA Women of Achievement Award, and was named
one of the 28 R&D-Stars-to-Watch by Industry Week. She has
held various "Woman pioneering" capacities. She is an
invited lecturer/keynote speaker worldwide and the author of over
200 publications, including the sole authorship of five internationally
used textbooks and a co-author of several books related to electronic
packaging and assembly technologies. She writes a monthly column
for SMT Magazine. Contributing to corporate governance, education
and community, Dr. Hwang has served on various corporate, educational,
and civic boards. She is a member of various professional organizations,
having served as the National President of Surface Mount Technology
Association. She has held executive positions with Lockheed Martin,
SCM and IEM Corp., currently the president of H-Technologies Group
Inc., providing technology and business solutions to the electronics
S10 FOR STUDENTS ONLY! -
Microsystems Packaging: Technologies, Markets and Careers
1/2 Day Course PM o 1 PM - 5:00 PM
Instructors: Prof. Rao R. Tummala, Petit Chair Professor,
Director NSF-PRC, GRA Scholar, Georgia Institute of Technology;
Janet K. Lumpp, University of Kentucky; Leyla Conrad, Georgia
Institute of Technology
Information technology involves hardware, software, applications
and services. This industry has become the largest industry surpassing
agriculture that lasted more than a millennium and steel that
lasted more than a century. It is becoming the driving engine
for science, technology, manufacturing and services paving the
way for unparalleled prosperity of people and countries that participate
in it. Better than 80% of all millionaires in the U.S. during
the last five years have been attributed to this industry.
Microelectronics systems packaging involves all the technologies
in forming electronic systems for consumer, telecom, computer,
automotive, aerospace and medical industries. These technologies
typically involve all the components and their interconnections
to form system level boards to provide system level functions.
Microelectronics packaging is the ultimate cross-disciplinary
technology that involves engineers from various backgrounds. For
example: electrical design typically performed by Electrical or
Electronic and Computer Engineers; thermo-mechanical design by
Mechanical Engineers; development of new materials that provide
the required functions by Materials Engineers; fabrication of
components by Chemical Engineers; electrical test by Electrical
or Electronic Engineers; IC and board assembly by Mechanical or
Materials Engineers; thermal management and reliability by Mechanical
Engineers; and so on. Working together as a team from all these
disciplines, packaging engineers design, fabricate, integrate,
test, cool and assure reliability of the entire microelectronic
This four-hour course will present the global microelectronics
market, past and future technologies that constitute this market,
the educational opportunities that are available and career prospects
for a lifelong career around the world in various industries.