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Sunday PDCs
Sunday, November 16, 2003

All PDCs run 9 am - 5 pm, unless otherwise noted.
All PDCs will be held at the Hynes Convention Center.

PDC Reception
Sunday, November 16
5 pm - 6 pm
(for Attendees & Instructors only)

S3 | S4 | S5 | S6 | S7 | S8 | S9 | S10

Flip Chip and CSP Technologies - Constructions, Materials, Assembly and Reliability
Course Leader:
R. Wayne Johnson, Ph.D., Auburn University

Course Description:
The increasing number of I/O per semiconductor chip combined with the product driven requirements of thinner, smaller and lighter weight have lead the electronics packaging and assembly industry to chip scale packages and flip chip (Flip Chip in Package (FCiP) and Flip Chip on Laminate (FCoL)) technologies. In fact, many CSPs use FCiP constructions. This course will begin by examining the drivers for flip chip and CSP technologies then examine the options, their construction and trade-offs. 3-D CSPs will also be examined. Substrate design requirements will be discussed including routing, and pad design. Major assembly issues are flux selection for flip chip, solder paste printing for CSPs, under filling, if necessary, and inspection. Under filling which is not a traditional SMT assembly process is required for flip chip and often for CSPs. The under fill process and material options for flip chip and CSP will be examined. Recently, wafer applied under fill material concepts for FCoL assemblies have been discussed and this new technology concept will be explored. The replacement of leads by solder spheres impacts reliability, particularly in thermal cycling and bending, and must be considered prior to implementing these technologies. The course will conclude with a discussion of reliability.

Who should attend?
This Course is intended for those individuals soon to be responsible for implementing flip chip assembly, suppliers of materials and equipment for flip chip assembly and others interested in flip chip implementation.

Dr. Johnson is an Alumni Professor of Electrical Engineering at Auburn University and Director of the Laboratory for Electronics Assembly and Packaging (LEAP). At Auburn, he has established teaching and research laboratories for advanced packaging and electronics assembly. Research efforts are focused on materials, processing, and reliability for electronics assembly. He has worked in MCM design, MCM-L, -C and -D substrate technology as well as advanced SMT, wire bond and flip chip assembly techniques. He has published and presented numerous papers at workshops and conferences and in technical journals. He has also co-edited one IEEE book on MCM technology and written two book chapters in the areas of silicon MCM technology and MCM assembly. He received the 1997 Auburn Alumni Engineering Council Senior Faculty Research Award for his work in electronics packaging and assembly. Dr. Johnson is the current Technical Vice President of IMAPS and was the 1991 President of the Society. He received the 1993 John A. Wagnon, Jr. Technical Achievement Award from ISHM, was named a Fellow of the Society in 1994 and received the Daniel C. Hughes Memorial Award in 1997. He is also a member of IEEE, SMTA, and IPC. Dr. Johnson received the B.E. and M.Sc. degrees in 1979 and 1982 from Vanderbilt University, Nashville, TN, and the Ph.D. degree in 1987 from Auburn University, Auburn, AL, all in electrical engineering. He has worked in the microelectronics industry for DuPont, Eaton, and Amperex.

Low Temperature Co-fired Ceramics (LTCC)
Course Leaders:
Fred D. Barlow and Aicha Elshabini, University of Arkansas

Course Description:
This course is a one-day PDC focusing on the materials, processes, design, and applications of Low Temperature Co-fired Ceramics (LTCC). The course will begin with a brief history and background of the technology. A detailed discussion of the process flow and processes will cover each step used in the fabrication of LTCC substrates. A discussion of the material properties and design guidelines and considerations will also be covered in detail. Finally, a discussion of the technical advances and the technical applications of the technology will outline the relative strengths of LTCC for a number of target markets.

· History of LTCC and Background
· LTCC Process
· Material Properties
· Design Considerations
· Technical Advances
· Applications

Who should attend?
Engineers, managers, and technicians, who desire to expand their background or strengthen their understanding of the technology. The course will not assume any prerequisite background.

Aicha Elshabini is Professor of Electrical and Computer Engineering. She obtained a B.Sc. in Electrical Engineering at Cairo University, 1973, in both Electronics and Communications areas, a Masters in Electrical Engineering at University of Toledo, 1975, in Microelectronics, and a Ph.D. Degree in Electrical Engineering at the University of Colorado, 1978 in Semiconductor Devices and Microelectronics. Currently, she is serving the position of Professor and Department Head for the Electrical Engineering Department at University of Arkansas (since July 1, 1999), and Interim Department Head for Computer Science & Computer Engineering Department (since July 1, 2000). She has been serving as the faculty advisor for IMAPS student society at both institutions since 1980 to present time. Elshabini is a Fellow member of IEEE/CPMT Society (1993) Citation for 'Contribution to Hybrid Microelectronics Education and to Hybrid Microelectronics to Microwave Applications', a Fellow member of IMAPS Society (1993), The International Microelectronics and Packaging Society, Citation for 'Continuous Contribution to Microelectronics and Microelectronics Industries for numerous years'. Dr. Elshabini was awarded the 1996 John A. Wagnon Jr., Technical Achievement Award from IMAPS. She has served as the Editor of the IMAPS International Journal of Microcircuits & Electronic Packaging for 10 years.

Fred Barlow earned a Bachelors of Science in Physics and Applied Physics from Emory University in 1990, a Masters of Science in Electrical Engineering from Virginia Tech in 1994, and a Ph.D. in Electrical Engineering from Virginia Tech in 1999. He is currently working as Assistant Professor in the Electrical Engineering Department at University of Arkansas. Dr. Barlow has published widely on electronic packaging and electronic materials evaluation and is Co-Editor of The Handbook of Thin Film Technology (McGraw Hill, 1998). In addition, he has written several book chapters including two chapters on thin films and one on components and devices. He has achieved the Outstanding Contribution Award with IMAPS in recognition of his efforts in developing and implementing the CD-ROM project for IMAPS publications, IMAPS home page on the Internet, and for his technical contributions. He currently serves on the IMAPS national technical committee for power packaging. His research interests include electronic packaging for power electronic and microwave applications as well as RF and microwave design.

Fundamentals of Fabrication and Packaging of MEMS, Related Micro and Nano Systems
Course Leader:
Ajay P. Malshe, Ph.D., High Density Electronics Center (HiDEC), University of Arkansas

Course Description:
Fabrication and application specific packaging of micro electromechanical systems (MEMS) is a subject of immense interest. Their application specific packaging with other components is challenging and unlike IC packaging, has a different set of demands from releasing, dicing-to-interconnection at chip-scale and manufacturing at wafer-level. This globally taught course will address silicon and non-silicon micro fabrication processes and related design details, and packaging of silicon and non-silicon MEMS and related microsystems. The course will use a range of novel applications to advocate the use of various fabrication and packaging processes. The course will also introduce a new area on the horizon - "nano packaging and manufacturing."
In the broader scope of the subject, for the 21st century packaging community infusion of signals (electrical, optical, chemical, mechanical, etc.), domains (hermetic, vacuum, fluidic, optical, etc.) and scales (nano-to-micro-macro) are of significant importance for designing and developing next generation engineered micro and nano products as well as for adding value / functions to the existing products. Particularly, key words, namely MEMS, micro systems and nano technology, have the captured attention of technology leaders. MEMS and related micro systems are typically divided into two application areas: sensors and actuators. These are applied for a range of applications such as automotive, biomedical, optical, RF, etc. Examples of systems, devices and related application specific packages, are accelerometers, gyros, DMDâ, lab-on-a-chip, SMART drugs, etc. Further, with the major investment and key advancements in nanotechnology, nano integrated MEMS and related micro devices and packages are of major importance to the next generation of engineered electronic systems.

Course Notes:
(1) Chapter by "Packaging of MEMS and MOEMS: Challenges and A Case Study" by Drs. Malshe and O'Conner, (2) copies of the transparencies on MEMS and Nanomanufacturing, and (3) publication- "NSF-EC Workshop on Nanomanufacturing and Processing: A Summary Report," Malshe et al., SPIE International Symposium on Smart Materials, Nano-, and Micro-Smart Systems, Melbourne, Australia, December 2002.

Specific Topics Covered:
Morning Session (Module I): Introduction, Fabrication, Testing, Reliability and Services.
Afternoon Session (Module II): An Introduction to M4 and MEMS, their Packaging and Assembly, and Nano Packaging and Manufacturing.

Who should attend?
The course is meant for industry and academic leaders and investors in science and engineering with interest in MEMS and related micro and nano systems. Highly recommended for R&D scientists, engineers and managers involved in sensors, actuators, instrumentation and systems related to micro and nano systems technology. Graduate students with special interest in the above areas will also find it useful.

Ajay P. Malshe is an Associate Professor at the Department of Mechanical Engineering, Director of SERC for Durable Micro and Nano Systems, and an adjunct faculty at the High Density Electronics Center (HiDEC), Department of Electrical Engineering, University of Arkansas, USA. His three distinct fields of research and educational interest are integration and advanced packaging of micro and nano systems, nanomanufacturing, and surface engineering of materials for advanced manufacturing. He has edited two proceedings, and authored two book chapters including one on MEMS Packaging; over one hundred referred publications, holds five patents and four pending. He is currently an active Executive Council member of International Microelectronics And Packaging Society (IMAPS) through the organization of Advanced Technology Workshops (ATW) on MEMS Packaging. Currently, he is Chairman of Thermal Management Technical Sub-committee and also National Chair of Topical Technology Workshops for IMAPS. In addition he is an active member of ASME, IEEE, MRS and AVS.

Advanced Organic Substrate Package Design & Manufacturing for RF & Broadband Applications
Course Leader:
Hassan Hashemi, Conexant Systems

Course Description:
The objectives of this course are to review design and manufacturing practices and tradeoffs affecting current and next generation RF & GHz Packaging using laminate substrate technologies in single or multiple die packaging format. The course material is primarily based upon the instructor's experience on current practices used for Wireless & GHz IC packaging for internet infrastructure applications. The course is designed for engineers or engineering managers who want to understand more about laminate single or multi chip modules, and the unique requirements for assuring that packages can be manufactured in a high volume commercial application and meet stringent electrical and thermal performance requirements.

Course Content:
· Overview of Multi Chip packages and their benefits
· Review RF laminate packages designed to use Chip On Board, embedded passives, & SMD
· RF MCM-L design issues with emphasis on design for high volume manufacturing
· Power Amplifier modules, Transmit modules, and Radio-on-a-Package modules
· Package electrical, thermal, and mechanical modeling in support of design verification and process development
· Review of MCM-L materials, processes, and manufacturing issues
· Discuss quality and reliability concerns with RF MCM-Ls

The class will be run informally and interaction with the attendees is encouraged. Questions and tangential discussions will be invited.

Who should attend?
The course is intended for both the packaging expert (Electrical and Mechanical Engineers) as well as persons new to the field. The course will concentrate on extending the existing organic substrate infrastructure capability to GHz high volume packaging applications. The information presented will include the theoretical background with practical methods for implementing a design. These same techniques can be applied to other high frequency single or multichip package designs.

Hassan Hashemi is Executive Director of Advanced Packaging & Product Development at Mindspeed Technologies, a Conexant Systems Business in Newport Beach, California. He is currently managing design and development of single and multi-chip packages for broadband digital, mixed-signal, and RF devices used in infrastructure communication and storage applications. He holds a Masters degree in electrical engineering from the University of Texas at Austin, and has over 18 years of experience in microelectronics package design, manufacturing, and product development. Prior to joining Conexant, he was a senior member technical staff at Microelectronics and Computer Corp. and Advanced Micro Devices. He holds 14 US patents, has authored three book chapters and over 40 technical papers in the areas of high-speed package electrical and thermal design and implementation.

RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader:
Richard Brown, Richard Brown Associates, Inc.

Course Description:
In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with the continuing development of monolithic integrated circuits, MMICs, are new materials and process refinement of hybrids. As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete devices, or more often, somewhere in-between. This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented. The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid "waveguide" structures will be compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance. At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit performance.

Who should attend?
This introductory course will benefit those associated with the RF and microwave arena. In particular this course will benefit those with responsibility for design and manufacturing of RF/microwave hybrids. Supervisors, engineers and technicians involved in product development, design and manufacture are encouraged to attend.

Special Course Materials:
All attendees will receive a set of course notes and a copy of the Mr. Brown's text "RF/Microwave Hybrids: Basics, Materials and Processes."

Richard Brown is a technical and engineering consultant in hybrids, with more than 30 years experience, encompassing thin and thick film, electroplating and substrate technologies. He began his career at Bell Telephone Laboratories. After joining RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology team as program manager to implement thin film on high temperature co-fired ceramic for MCMs. He has published extensively, authoring a chapter on Thin Film for Microwave Hybrids in "Handbook of Thin Film Technology," McGraw-Hill, NY, 1998, A. Elshabini-Riad, Ed. In 1995, ISHM awarded him the prestigious John A. Wagnon, Jr., Technical Achievement Award. His text "Materials and Processes for Microwave Hybrids" was published in 1991 by ISHM, Reston, VA, and most recently, RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer Academic Press, 2002

Overview of MEMS, MOEMS and Nano Technology
Course Leader:
Dr. Ken Gilleo, Cookson Electronics


1/2 Day Course - AM
S9 runs 9 AM - Noon

New Developments for Electronic Packaging and Assembly
Course Leader:
Dr. Jennie S. Hwang, H-Technologies Group, Inc.

Course Description:
In this exciting and changing time, the microelectronics industry has responded and will continue to respond to the needs of competitive products in the global marketplace. The course will provide a capsule view of key segments of electronics hierarchy in market needs and new technology development. The key areas in chip level, package level and board level as well as critical supporting materials, processes and infrastructure will be highlighted.

What will you learn?
· Industry driving forces and technological drivers
· Chip level, General trends and market
· IC package, Evolution & market
· CSP, BGA types and characteristics
· General comparison of CSP, BGA, flip chip and fine pitch QFP
· Array package solder bumping
· Passive components, trends & market
· Technologies for high density PCB
· SMT assembly trends and issues
· General materials, equipment and management issues

Special Course Materials:
All attendees will receive a textbook entitled: "Ball Grid Array and Fine Pitch Peripheral Interconnections," published by Electrochemical Publications, LTD, Great Britain, (List Price US$149) and a workbook.

Who should attend?
This capsule view will provide attendees in managerial, marketing, engineering and research capacity a broad understanding of the industry as well as the quick grasp of the technological thrusts.

Dr. Hwang received her doctorate in Materials Science & Engineering from Case Western Reserve University and two masters from Columbia University and Kent State University's Liquid Crystal Institute She has been a major contributor to Surface Mount Technology since its inception. Serving as an advisor to major OEMs/ODMs, U.S. government and contract manufacturers, she has provided solutions to many challenging production-floor problems in the last 20-years of SMT establishment, including U.S. F-22 program. Among her many honors and awards, Dr. Hwang is elected to the National Academy of Engineering, inducted to the WIT International Hall of Fame, and received Distinguished Alumni Award from her alma maters. She also received the U.S. Congressional Certificate of Recognition, YWCA Women of Achievement Award, and was named one of the 28 R&D-Stars-to-Watch by Industry Week. She has held various "Woman pioneering" capacities. She is an invited lecturer/keynote speaker worldwide and the author of over 200 publications, including the sole authorship of five internationally used textbooks and a co-author of several books related to electronic packaging and assembly technologies. She writes a monthly column for SMT Magazine. Contributing to corporate governance, education and community, Dr. Hwang has served on various corporate, educational, and civic boards. She is a member of various professional organizations, having served as the National President of Surface Mount Technology Association. She has held executive positions with Lockheed Martin, SCM and IEM Corp., currently the president of H-Technologies Group Inc., providing technology and business solutions to the electronics industry.

Microsystems Packaging: Technologies, Markets and Careers
1/2 Day Course PM o 1 PM - 5:00 PM

Instructors: Prof. Rao R. Tummala, Petit Chair Professor, Director NSF-PRC, GRA Scholar, Georgia Institute of Technology; Janet K. Lumpp, University of Kentucky; Leyla Conrad, Georgia Institute of Technology

Information technology involves hardware, software, applications and services. This industry has become the largest industry surpassing agriculture that lasted more than a millennium and steel that lasted more than a century. It is becoming the driving engine for science, technology, manufacturing and services paving the way for unparalleled prosperity of people and countries that participate in it. Better than 80% of all millionaires in the U.S. during the last five years have been attributed to this industry.

Microelectronics systems packaging involves all the technologies in forming electronic systems for consumer, telecom, computer, automotive, aerospace and medical industries. These technologies typically involve all the components and their interconnections to form system level boards to provide system level functions. Microelectronics packaging is the ultimate cross-disciplinary technology that involves engineers from various backgrounds. For example: electrical design typically performed by Electrical or Electronic and Computer Engineers; thermo-mechanical design by Mechanical Engineers; development of new materials that provide the required functions by Materials Engineers; fabrication of components by Chemical Engineers; electrical test by Electrical or Electronic Engineers; IC and board assembly by Mechanical or Materials Engineers; thermal management and reliability by Mechanical Engineers; and so on. Working together as a team from all these disciplines, packaging engineers design, fabricate, integrate, test, cool and assure reliability of the entire microelectronic system.

This four-hour course will present the global microelectronics market, past and future technologies that constitute this market, the educational opportunities that are available and career prospects for a lifelong career around the world in various industries.


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