IMAPS 2004 Exhibitors
(as of November 8, 2004)

Booth space is selling fast. Make sure you reserve your spot today!

Reserve your booth online before it's too late

Here are the companies that have already reserved exhibit space:

BOOTH NUMBER COMPANY
521 Accu-Tech Laser Processing, Inc.
439 AdTech Ceramics
631 Advanced Packaging/Pennwell Corp.
242 Aeroflex
146 AI Technology, Inc.
556 ALLVIA
540 American Technical Ceramics
819 AMI/Presco
832-34 Anaren Ceramics
438 Ansen Corporation
151 Anter Corporation
628 Applied Laser Technology, Inc.
250 ARINC Engineering Services
361 Asada Mesh USA
924 Asymtek
635 ATV Technology, Inc.
150 Austin Semiconductors, Inc.
543 Azimuth Electronics, Inc.
527 Barry Industries, Inc.
530 Brush Ceramic Products
624 BTU International
836 CAD Design Software
740 Central Semiconductor Corp.
355 Centrotherm Technologies
428 Ceramics Process Systems Corp.
429 Ceratek LLC
731 Chip Supply, Inc.
647 Cobehn Systems, Inc.
453 Coining of America LLC
831 Cookson Electronics Assembly Materials
713 CoorsTek, Inc.
432-34 Co-planar, Inc.
533 Cyber Technologies USA
425 Dage Precision Industries, Inc.
149 Dakota Consulting
340 Datacon North America, Inc.
840 Deweyl Tool Company, Inc.
237 Disco Hi-Tec America, Inc.
553 Dow Corning Corporation
554 DPA Labs Components International
641 DuPont Microcircuit Materials
638 Dyconex AG.
361 Dynamesh, Inc.
436 Egide USA, Inc
613 Electro Scientific Industries, Inc.
441 Emerson & Cuming
353 Enerdyne Solutions
525 Epoxy Technology, Inc.
537 EPP
636 ES Components, Inc
846 ESEC (USA), Inc.
718 ESL Electro-Science
248 Espec Corp.
746 F&K Delvotec, Inc.
618 Ferro Electronic Material Systems
626 Finetech, Inc.
427 Flow Autoclave Systems, Inc.
538 Formosa Teletek Corp.
137 G. Bopp USA Inc.
642 Gaiser Tool Co.
141 Gannon & Scott
743 Geib Refining Corporation
739 Gelest Inc.
333 Graphite Concepts, Inc.
534-36 GSI Lumonics
633 Haiku Tech, Inc.
541 Halcyon Microelectronics, Inc.
738 Harrop Industries, Inc.
649 HCC Industries, Inc.
552 HEI, Inc.
918 Henkel Technologies
812 Heraeus Incorporated-Circuit Materials Division
813 Hesse & Knipps, Inc.
336 Honeywell Electronic Materials
843 Hover-Davis, Inc.
343 Hybrid Screen Technologies, Inc.
634 Hytek Microsystems, Inc.
148 Hytel Group, Inc.
337 IJ Research, Inc.
649 Indium Corporation of America
433 Innovative Fabrication, Inc.
431 Integri-Test Corporation
249 Interconnect Systems, Inc.
451 ITT Industries - Microelectronics Center
235 Kester Solder - Northrop Grumman Corp.
456 Kulicke & Soffa Industries, Inc.
456 Kulicke & Soffa Industries, Inc.
619 Kyocera America, Inc.
827 Kyzen Corp.
258 Labtech Limited
433 Laser Process Mfg., Inc.
741 Laser Tech, Inc.
920 Laserage Technology Corp.
338 LEW Techniques Ltd.
260 Life Line Packaging, Inc.
750 Lifescape Design
542 Litron, Inc.
256 M/A-COM
526 Marpet Enterprises, Inc. (MEI)
539 Mesago Messe Frankfurt GmbH
435 Metallix, Inc.
826 Micro Hybrid Dimensions, Inc.
629 Micro Printing Systems
430 MicroConnex Corporation
839 Micropac Industries, Inc.
841 MicroScreen LLC
749 Micross Components Corp.
253 Minco Technology Labs, Inc.
550 Mini-Systems, Inc.
829 Mitsui Chemicals America, Inc.
535 Morgan Advanced Ceramics - GBC Materials
652 Mundt & Associates, Inc.
632 NAMICS Technologies, Inc.
719 Natel Engineering Co., Inc.
327 Newport Corporation
437 Nikko Company
942 Nippon Steel Chemical Corp.
254 NorCom Systems, Inc.
946 Noritake Co., Inc.
532 Northeast Electronics Corp.
630 NTK Technologies, Inc.
725 Orthodyne Electronics
732 Pac Tech Packaging Technologies USA
346 Pacific Aerospace & Electronics
529 Palomar Technologies, Inc.
547 Panasonic Factory Automation Company
737 Paradigm Hybrid Microelectronics
838 Photofabrication Engineering, Inc.
357 Photonics Spectra Magazine/Laurin Publishing
143 Plasma Etch, Inc.
339 Polaris Electronics Corp.
730 Polese Company
637 Q-Tech Corporation
639 Reactive NanoTechnologies
837 Reinhardt Microtech AG
524 Reldan Metals, Inc.
847 Remtec, Inc.
442 Rigsby Screen & Stencil, Inc.
747 Riv, Inc. - Thick Film Screens
335 Sandvik Osprey
457 Sanyu Rec Co., Ltd
830 Sarnoff Corp. - Thin Film Technology Center
742 SatCon Electronics
142 Schneeberger Linear
454 Scientific Tec, Inc.
251 Sea Ceramic Technology, Inc.
616 SEFAR America/MEC Division
824 Semi Dice, Inc.
352 Semiconductor Equipment Corp.
531 Semiconductor International
236-38 Semiconductor Packaging Materials
241 SierraTherm Production Furnaces, Inc.
262 Sikama International, Inc.
735 Silicon Cert, Ltd.
452 Solid State Equipment Corp.
334 Sonix, Inc.
247 Sonoscan, Inc.
156 South Dakota State University
331 Spectra-Mat Inc.
517 SST International
651 & 653 Stellar Microelectronics Inc.
640 Sumitomo Electric USA, Inc.
729 SUSS MicroTec
828 Sypris Test & Measurement, Inc.
455 Tandex Labs.
243 Tecan Ltd.
350 Technic, Inc.
625 Teledyne Microelectronic Technologies
625 Teledyne Printed Circuit Technology
835 Thermoset - Metech, Lord Corp.
162 Thin Film Technology, Inc.
459 Thinky Corporation
329 Trebor Instrument Corp.
341 Tresky Corporation
853 UltraSource, Inc.
140 Unichem Industries, Inc.
825 Unitek Benchmark, Inc.
154 University of Buffalo
152 University of Maryland
147 Utz Technologies, Inc.
528 Viox Corporation
239 Webcom Communications Corp.
724 West-Bond, Inc.
246 Williams Advanced Materials
833 Xsil, Ltd.
426 Yield Engineering Systems, Inc.
252 Zymet, Inc.

 

IMAPS - International Microelectronics And Packaging Society
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