Professional Development Courses (PDCs)
(Course listings at bottom of page)


Sunday PDCs
| Monday PDCs

Do you want to broaden and strengthen your skills and knowledge, optimize your manufacturing processes, and integrate the latest advances in materials and technologies to maintain your strength in today’s competitive global market? The Technical Committee of IMAPS is pleased to present a comprehensive offering of professional development courses that provide detailed information on topics of immediate interest to the Microelectronics and Packaging community. So please be sure to choose from the thirteen full day and two half-day in-depth technical workshops taught by recognized industry experts. You will discover the following key ways you will benefit…

· Better understand the industry’s fundamental skills and knowledge.
· Be exposed to the rapidly expanding developments in new materials and technologies.
· Consult with renowned authorities about your current R&D or manufacturing problems and challenges.
· Learn new ways to identify, think about, and address your problems and opportunities.
· Great opportunities to interact with industry experts and other course attendees.
· Certificate of Attendance and much more…

Included in Your PDC Registration Fee:

  • Lunch on the day of your course
  • Refreshment breaks
  • All course materials
  • PDC Reception on Sunday evening (for Attendees & Instructors only)
  • Certificate of Attendance

PDC Cancellation policy


IMAPS reserves the right to cancel a course if the number of attendees is not sufficient. We shall then refund you the corresponding amount.

All PDCs held on Sunday, November 14 or Monday, November 15
All PDCs run 9am - 5pm unless otherwise noted.

Sunday PDCs

S2 - Flip Chip and CSP Technologies – Constructions, Materials, Assembly and Reliability

S3 - The Integrated Circuit – The Packaging, Assembly, and Interconnections

S4 - Microwave & Millimeter Wave Packaging; Basics, Materials and Processes (New Course)

S5 - Design and Process for Advanced SMT Manufacturing Cancelled

S6 - An Engineer’s Training Guide to Successful Wire Bonding and Pull Testing Cancelled

S7 - 1/2 Day: 9am - noon
Lead-Free System: Drop-in Implementation & Production

S8 - 1/2 Day: 1pm - 5pm
Lead-Free System: Lead-Free Electronic Packaging and Assembly - Reliability & Manufacturing

Monday PDCs

M1 - Wire Bonding in Microelectronics

M2 - Advanced Thermal Management Materials

M3 - Technology of Screen Printing

M4 - An Introduction to Microelectronics Packaging Technology

M5 - Introduction to Advanced Packaging

M6 - Low Temperature Co-fired Ceramics (LTCC)

M7 - Hermeticity Testing and Issues with RGA

 

 

 

IMAPS - International Microelectronics And Packaging Society
611 2nd Street, NE -- Washington, DC 20002
imaps @ imaps.org | 202.548.4001