(All PDCs run 9am - 5pm)
PDCs | PDC General Info
*All PDCs will be
held in the Pennsylvania Convention Center. Room locations
will be made available closer to the show date.
Plating for Electronics: From the Plating Solutions to the
Fred Mueller, Consultant, ASEF Instructor
• Provide a thorough overview of the use of nickel, gold, and
other precious metals that are electroplated for a variety
of applications in the field of electronics;
• Review electroless chemistries for copper, nickel, gold and
• Present methods for conservation (and reuse) of precious metals,
as well as pollution prevention and waste treatment methods;
• Case histories and bath troubleshooting will be presented;
• Understand the use of Laboratory controls including the Hull
Cell and other plating cells to test solutions;
• Highlight engineering differences in plating processes.
Who should attend?
This course is intended as an introductory to intermediate
level course for process engineers, quality engineers, and
managers responsible for Electronic Finishing.
Mr. Mueller is a consultant and serves as a national certified instructor
for the American Electroplaters and Surface Finishing Society (AESF).
He has over twenty-five years experience in the plating industry in
printed circuits and plating for electronics. He is currently the National
Quality Manager at General Magnaplate, Linden, NJ. As a Chemist, Fred
has conducted experiments and presented technical papers at SurFin on
various topics in electroplating. He is very active in AESF currently
serving as First Vice President on the National Board. He is Chairman
of the Quality in Surface Finishing Committee and the Electro-forming
Committee of the AESF.
Flip Chip and CSP Technologies – Constructions, Materials, Assembly
R. Wayne Johnson, Ph.D., Auburn University
The increasing number of I/O per semiconductor chip combined
with product driven requirements of thinner, smaller and lighter weight
have lead the electronics packaging and assembly industry to chip
scale packages and flip chip (Flip Chip in Package (FCiP) and Flip
Chip on Laminate (FCoL)) technologies. In fact, many CSPs use FCiP
constructions. This course will begin by examining the drivers for
flip chip and CSP technologies then will examine options, their construction
and trade-offs. 3-D CSPs will also be examined. Substrate design requirements
will be discussed including routing, and pad design. Major assembly
issues are flux selection for flip chip, solder paste printing for
CSPs, underfilling, if necessary, and inspection. Underfilling which
is not a traditional SMT assembly process is required for flip chip
and often for CSPs. The underfill process and material options for
flip chip and CSP will be examined. Recently, wafer applied underfill
material concepts for FCoL assemblies have been discussed and this
new technology concept will be explored. The replacement of compliant
leads by solder spheres impacts reliability, particularly in thermal
cycling and bending, and must be considered prior to implementing
these technologies. Reliability including lead free will be discussed.
Who should attend?
This course is intended for those individuals soon to be responsible
for implementing flip chip assembly, suppliers of materials and equipment
for flip chip assembly and others interested in flip chip implementation.
Dr. Johnson is a Ginn Professor of Electrical Engineering at Auburn
University and Director of the Laboratory for Electronics Assembly and
Packaging (LEAP). At Auburn, he has established teaching and research
laboratories for advanced packaging and electronics assembly. His research
efforts are focused on electronics manufacturing, advanced packaging
and extreme environment electronics. He has published and presented
numerous papers at workshops and conferences and in technical journals
as well as book chapters on MCM technology and electronics assembly.
Dr. Johnson was the Technical Vice President of IMAPS (2000-2004) and
was the 1991 President of the Society. He received the 1993 John A.
Wagnon, Jr. Technical Achievement Award from ISHM, was named a Fellow
of the Society in 1994 and received the Daniel C. Hughes Memorial Award
in 1997. He is also a member of SMTA, and IPC and a Fellow of IEEE.
Dr. Johnson received the B.E. and M.Sc. degrees in 1979 and 1982 from
Vanderbilt University, Nashville, TN, and the Ph.D. degree in 1987 from
Auburn University, Auburn, AL, all in electrical engineering. He has
worked in the microelectronics industry for DuPont, Eaton, and Amperex.
The Integrated Circuit - The Packaging, Assembly, and Interconnections
William J. Greig, Greig Associates
This course provides an overview of electronics/microelectronics
manufacturing and addresses the impact of both Integrated
Circuit and End Product requirements for “smaller, better, cheaper.” It
covers IC packaging, chip assembly, and HDI packages and
substrates. It focuses on packaging trends, in particular area array, the
the CSP, and Flip Chip and its counterpart the Wafer Level
CSP. It includes discussions on the advantages of alternative packaging
including multichip packaging (MCP) and Chip On Board (COB).
Additionally emerging 3-D packaging initiatives rapidly entering mainstream
examined at both the chip and package levels, i.e., both
die and package stacking. High Density Interconnect (HDI) packages/substrates
process technologies are reviewed including Thick Film, Co-fired
Ceramic, and Thin Film that support Level 1.0 SCP and MCP, and Level 2.0
In the latter case, significant developments in the PWB process
technology are presented including Build Up Technology (BUT) that offers
wiring density, fine lines and spaces, and microvias. Throughout
the course technical issues will be emphasized and reliability concerns
addressed where appropriate.
Who should attend?
The course is effectively a primer covering primarily the microelectronic
packaging arena. It is intended for a variety of individuals, technical
and non-technical, whether directly or indirectly involved with electronic
product manufacturing. It will serve as a review of current and emerging
technologies for the experienced engineer and technician or as an
introduction for anyone new to the industry. It should be of special
interest to materials and equipment suppliers and those in support
activities such as procurement, quality assurance, marketing and sales,
by providing an adequate technology base for evaluating, planning
Special Course Material:
All attendees will receive a complimentary copy of the “Hybrid
Microcircuit Technology Handbook,” by J. Licari and L. Enlow,
2nd edition, Noyes Publications, 1998 (List Price $148).
Bill Greig is currently an independent consultant specializing in microelectronic
packaging and assembly. His previous work experiences include RCA Semiconductor,
General Electric Co., Lockheed Electronics, and contract consultant
to NASA. His areas of expertise cover semiconductor wafer processing
and assembly, hybrid circuit manufacture, and printed wiring board fabrication.
He has been granted 6 patents and has published or presented numerous
papers at various technical symposia. He has presented courses at various
national symposia and participated in CEE programs at U. of Wisconsin,
Lehigh University and Rutgers University. He is a member of SMTA and
IMAPS in which he is a Fellow, and Past President of the Garden State
RF/Microwave Hybrids; Basics, Materials and Processes
Richard Brown, Richard Brown Associates, Inc.
In recent years, the demands for high frequency systems and
products have been growing at a rapid pace, driven by wireless communication
and automotive applications. Coupled with the continuing development
of monolithic integrated circuits, MMICs are new materials and technologies
for hybrids. As a result, system and product designers are faced with
the choice between hybrids and MMICs; i.e., complete system on a chip
vs. hybrids with discrete devices, or more often, somewhere in-between.
The constant mantra for smaller packages is tempered by the more important
necessity for impedance matching, which defines transmission line
geometries, as well as the need for overall low system losses. As
such, the design and manufacture of high frequency circuits are governed
by materials and process strategies.
This course will begin with a short, non-mathematical review
of high frequency basics. Next a comparison of MMICs and hybrids
is presented. The transmission line as the basic circuit
component of RF
and microwave hybrids will be reviewed. Hybrid “waveguide” structures
will be compared as they relate to transmission line properties.
The basic materials (conductors, dielectrics and substrates)
and their properties
will be introduced. Their effect on impedance, circuit properties
and performance will be discussed. Processing technologies
and strategies suitable for RF/microwave hybrids will be reviewed. Selected
protocols, such as vias and bonding wires, will be discussed
in light of their influence on RF/microwave performance. At
this course, attendees will have a better understanding of
many of the critical materials and processing factors affecting
high frequency circuit
Who should attend?
This introductory course will benefit those associated with
the RF and microwave arena. In particular this course will benefit
those with responsibility for design and manufacturing of RF/microwave
hybrids. Supervisors, engineers and technicians involved in product
development, design and manufacture are encouraged to attend.
Special Course Materials:
All attendees will receive a set of course notes and a copy
of RF/Microwave Hybrids: Basics, Materials and Processes, by Richard
Brown, Kluwer Academic Publishers, 2003 (List Price $185).
Brown is a technical and engineering consultant in hybrids, with
30 years experience,
thin and thick film,
electroplating and substrate technologies. He began his career
at Bell Telephone Laboratories. After joining RCA Solid State
in 1968, he transferred
in 1979 to the RCA Microwave Technology Center in Princeton.
In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology
team as program
manager to implement thin film on high temperature co-fired
ceramic for MCMs. He has published extensively, authoring
a chapter on Thin
Film for Microwave Hybrids in “Handbook of Thin Film Technology,” McGraw-Hill,
NY, 1998, A. Elshabini-Riad and F. D. Barlow III, Eds. In 1995, ISHM
awarded him the prestigious John A. Wagnon, Jr., Technical Achievement
Award. His text, “Materials and Processes for Microwave Hybrids,” was
published in 1991 by ISHM, Reston, VA., and most recently, “RF/Microwave
Hybrids; Basics, Materials and Processes,” Kluwer Academic Press,
Practical Electronics Reliability – An Overview
Andrew D. Kostic, Ph.D.
The student will learn basic principles of electronic reliability
testing and measurement.
The class begins with an introduction and explanation of terms
and concepts. After key definitions have been established,
the student will learn fundamental information about failure
reliability, system reliability, Environmental Stress Screening
(ESS) and how they are applied.
The presentation uses actual
examples of issues encountered to help guide the student
and provide a reference for when
they return to their own company.
Students will receive a softcopy of the presentation along
with simple Microsoft Excel reliability software tools that
are demonstrated during the class.
After completing this course you will know how to:
• Understand and evaluate reliability data
• Carry out reliability testing
• Implement effective ESS
• Systematically improve product reliability
Who should attend?
This course is a must for Reliability Engineers, Quality Engineers,
Manufacturing Engineers, Sales & Marketing personnel, Reliability
Technicians, and anyone who wants to gain a basic understanding
of electronic reliability.
Dr. Kostic has been intimately involved in the fields of electronics
product quality and reliability for over 30 years. He has extensive
experience with both semiconductor and system manufacturing. Andy is
an Engineering Fellow in the Product Integrity department of Northrop
Grumman Electronic Systems and an independent consultant. He has held
senior technical leadership positions in Unisys Component Engineering
Procurement Organization, IBM Global Procurement Quality Engineering,
and IBM Microelectronics Corporate Quality. He has taught quality and
reliability improvement classes all over the world since 1988 that have
been highly praised by students as being effective and practical. His
advice has enabled companies to dramatically improve their field reliability
with small investment. Dr. Kostic has an extensive background in reliability
• Reliability modeling and prediction
• Supplier evaluation
• Electrical characterization
• Incoming inspection
• Failure analysis
• Supplier qualification and management
• Component qualification
• Lead-free electronics
Dr. Kostic holds the B. Sc. and M. Sc. degrees in Physics and a Ph.D. in Engineering.
He has over twenty-five publications in the field of quality and reliability
and is the Northrop Grumman representative to JEDEC Solid State Products Quality
and Reliability Committee.
Optoelectronic Packaging for Telecommunications and Biomedical
W. Jeffrey Shakespeare, Ph.D., GlucoLight Corporation
Optoelectronics has emerged over the last 15 years as a powerful
technology with a broad range of applications from the ultra-high
bandwidth telecommunications that link our world to optical coherence
tomography helping physicians and scientists image microscopic structures
in the human body. These technologies would not be possible without
the capability to cost effectively package photonics, optics and electronics
for high volume production and submicron alignment. This course presents
the current state of the art in optoelectronic packaging including
background on optoelectronic devices, basic optics, optical alignment,
light guide fibers, thermal management, MEMS, joining technology,
materials, and automated manufacturing.
Who should attend?
Engineers in R&D, manufacturing, process development, and advanced
technicians. This course is intended as an overview of optoelectronic
Currently Director of
Product Development at GlucoLight Corporation, a biomedical startup
Research Scientist at Lehigh
University’s Center for Optical Technologies, Dr. Shakespeare
has 26 years of optoelectronic and microelectronic packaging experience
in AT&T Bell Laboratories/Lucent Technologies, and T-Networks, Inc.,
with 15 years as a Technical Manager and Director. He has been an innovator
in the design and manufacture of optoelectronics for the past 12 years,
has several patents in the field of high volume, automated optoelectronic
component manufacturing, and a number of technical presentations and
publications in this area. Dr. Shakespeare created and teaches a graduate
level course in Microsystems Packaging as an Adjunct Professor for Lehigh
University and for the past 5 years taught a professional development
course “Fiber Optic Communications and Components” as an
Adjunct Professor for Northampton Community College. He received
the Ph.D. in Mechanical Engineering from Lehigh University.
Business and Technical Issues in Lead Free Conversion -- Cancelled
Ray Prasad, Ray Prasad Consultancy Group
Embedded Organic Passives: Status and Challenges -- Cancelled
Swapan K. Bhattacharya, Georgia Institute of Technology
Sunday, September 25th
5:00 pm - 6:00 pm
PDC Instructors and Attendees only.
PDCs | PDC General Info