Technical Program

Thursday, September 29, 2005
*All Technical Sessions will be held in the Pennsylvania Convention Center. Room locations will be made available closer to the show date.

THA1 | THA2 | THA3 | THA4 | THA5 | THA6 | THA7 | THA8
THP1 | THP2 | THP3 | THP4
Tuesday Sessions | Wednesday Sessions

Register On-line


THA1
Wirebonding (Gold)
Chairs: Lee Levine, Kulicke & Soffa Industries Inc.; Bruce Romenesko, The Johns Hopkins University/APL
8:00 am – 8:50 am

Papers cancelled; one paper moved to WA6


THA2
Power Packaging (Si and SiC)
Chairs: Doug Hopkins, University at Buffalo; Herb Dwyer, SATCON Electronics
8:00 am – 9:15 am

Packing power into a small area has provided many challenges. Listen how planar interconnect techniques can offer higher performance and functionality for Si devices. Take the gloves off for very high power density and drive SiC devices up to 300C. Listen to the latest in high temperature packaging and interconnection metallurgy.

Titanium-Tungsten (Ti10 W90) as a Diffusion Barrier on AlN and SiN Substrates for SiC Power Devices
Habib Abul Mustain, Alexander B. Lostetter, William D. Brown, University of Arkansas

Power Device Assembly Materials and Processes for Extreme Environments
Yi Liu, Cai Wang, R. Wayne Johnson, Auburn University

Electroplated Nickel Phosphorous for use in Wire Bonding Applications
Michael J. Brouillard, Sumco Incorporated


THA3
Reliability II (Test Methods)
Chairs: Changhan Yun, Analog Devices Inc.; Harry K. Charles, Jr., The Johns Hopkins University/APL
8:00 am – 9:15 am

This session on Reliability addresses failure mechanisms in both devices and packages. There are presentations on the studies of the failure mechanisms themselves, testing for failure and lifetime modeling. This session focuses on the mechanisms and test methods.

MEMS Reliability Assessment Program for DOD Activities
James Zunino, Donald Skelton, Robert Mason, U.S. Army ARDEC

Systematic Study of the Digital Image Correlation Technique through a Paired One-to-One Comparison with Moiré Interferometry
Pat Kelly, Liam Keogh, Vincent Guenebaut, Optical Metrology Innovations (OMI); Mike Mello, Steve Cho, Intel Corporation

Dynamic Response of a Portable Electronic Product subjected to an Impact Load
Jiang Zhou, Manish P. Stilani, Lamar University


THA4
Substrate Advances in Packaging
Chairs: Warren Dyckman, IBM, Tim Mobley, DuPont Electronic Technologies
8:00 am – 9:15 am

New and innovative substrate packaging technologies are continuously being developed to keep up with market needs for increased performance, reliability, miniaturization, and lower cost. This session looks at some of the latest advances in microvia technology, fine line interconnects, chip first strategies, elastomeric interconnect, high temperature ceramics, and multilayer interconnect strategies. The relationship of these areas is examined relative to system integration, reliability testing, and performance.

Environmental Evaluation of Vertical RF Interconnections for T/R-Modules for Multirole Phased Array Systems
Lovisa Bjorklund, Mattias Nilsson, Klas Axelsson, Mikael Johansson, Ericsson Microwave Systems AB

Thick Film Copper Metallization in Ambient Air using Selective Laser Sintering
Edward Kinzel, Hjalti Sigmarsson, Xianfan Xu, William Chappell, Purdue University

Microvia-in-Pad Technology Challenges on BGA Package Performance
Wendy Chet Ming Ngoh, Intel Products (M) Sdn Bhd.


THA5
3D Packaging & High Density Substrates
Chairs: Rajen Chanchani, Sandia National Laboratories; Daniel Amey, DuPont Microcircuit Materials
9:45 am – 11:00 am

This session will be focusing on the latest developments in 3D packaging in high density interconnect substrates.

Photo-Formable Tape-on-Substrate Material System for Multilayer Hybrid Manufacturing
Christopher R. Needes, Barry E. Taylor, Larry A. Bidwell, Michael A. Skurski, Michael A. Champ, Anthony T. Orzel, K. Mani Nair, Mark F. McCombs, Richard R. Draudt, DuPont Company

Development of High Density 3D-Stacked Package for SiP
Yoshimichi Sogawa, NEC Corporation

Aligned Fusion Wafer Bonding for Wafer-Level-Packaging and 3D Integration
Thorsten Matthias, Viorel Dragoi, Shari Farrens, Paul Lindner, EV Group


THA6
Flip Chip (Solder Attach)
Chairs: Roupen Keusseyan, DuPont Microcircuit Materials; Jamin Ling, Kulicke & Soffa Industries Inc.
9:45 am – 11:25 am

Most flip chip devices are interconnected by solder joints. The development and reliability of the solder interconnection is the focus of this session.

Microstructure Study of Electroless Nickel Gold Under Bump Metallurgy Pb-Free Solder Bumps
Mohamed Mohd Salleh, Universiti Kebangsaan Malaysia

Effects of Solder Bump UBM Reliability and Electromigration Characteristics of Flip Chip Package
Rick Yu, Tom Tai, Kelly Lee, Jowel Taguibao, Mars Tsai, Homing Tong, Advanced Semiconductor Engineering, Inc. (ASE)

Uniformity Control of Solder Ball Heights in Stencil Printing Process for Flip Chip Bumped Wafer for High Speed Memory
Jin-Woo Lee, J.-D. Kim, Samsung Techwin Co., Ltd.

Gold Stud Bumped Flip Chips: Surface Mounting and Joint Integrity with Thermal Cycling
Nagadeepthi Kurra, Z. J. Delalic, Temple University; Terence Clark, Visteon Corp.; Lee Levine, K&S Industries Inc.


THA7
Manufacturing III: Polymer & Solder Processes
Chairs: Lyndon Larson, Dow Corning; Raymond Pearson, Lehigh University
9:45 am – 11:00 am

Understanding material characteristics and material interfaces is key to proper application of a material in electronics packaging. This session focuses on understanding or improving the interfaces and the characteristics of polymers and solder used in electronics assembly.

Process Modeling of Underfill Cure in Flip-Chip Packaging
Rajesh R. Gomatam, John P. Coulter, Lehigh University

Application Performances of Glob-top Encapsulants
John Cheng, Randy Hamm, Jim Sim, Honeywell Federal Manufacturing & Technologies

Upper and Lower Bound Theoretical Analysis in Characterizing Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
Jiang Zhou, Lamar University


THA8
Sensors and MEMS
Chairs: Janet Lumpp, University of Kentucky; David Galipeau, South Dakota State University
9:45 am – 11:25 am

Sensors and MEMS development continues to be an area of high national and international interest due to the need for improved homeland security. This session highlights new developments in gas and pressure sensors as well as MEMS resonators and switches.

Effect of Temperature, Percentage of Polymer Content and Substrate on Gas Sensing Properties of NiO Based Materials
Khalil Arshak, Ibrahim Gaidan, University of Limerick

Effect of Changing Finger Number and Spacing of Interdigitated Electrodes on the Sensitivity of Oxide/Polymer Gas Sensors
Khalil Arshak, Ibrahim Gaidan, University of Limerick

Packaging and RF Telemetry System for Biocompatible Wireless Pressure Sensor
Shankaran Janardhanan, Joan Z. Delalic, Michael Ruggieri, Alan Braverman, Temple University; Jeffrey Catchmark, Penn State University

Q-Factor Enhancement for MEMS Devices: The Role of the Getter Film
Giorgio Longoni, A. Bonucci, A. Conte, M. Moraja, M. Amiotti, SAES Getters Italy; W. Reinert, FhG-ISIT


THP1
3D Packaging & High Density Substrates
Chairs: Rajen Chanchani, Sandia National Laboratories; Daniel Amey, DuPont Microcircuit Materials
12:30 pm – 1:45 pm

This session will be focusing on the latest dvelopments in 3D packaging in high density interconnect substrates.

Interconnection of Fine Lines to Micro Vias in High Density Multilayer LTCC Substrates
Gangqiang Wang, Fred Barlow, Aicha Elshabini, University of Arkansas

A Multichip Module Implementation of a Radiation Tolerant Microprocessor for Space Applications
Thomas F. Marinis, Gregory H. Barton, Dariusz R. Pryputniewicz, Draper Laboratory

Low Temperature Co-Fired Ceramics Multi-Layer Substrate Utilized with Ink-Jet Printed Silver Layers
Koji Koiwai, Toshiyuki Sakuma, Yuki Kawamura, Shoko Yamaguchi, KOA Corporation; Kenji Wada, Kazuaki Sakurada, Toshiyuki Kobayashi, Seiko Epson Corporation


THP2
Flip Chip (Solder Attach)
Chairs: Roupen Keusseyan, DuPont Microcircuit Materials; Jamin Ling, Kulicke & Soffa Industries Inc.
12:30 pm – 1:45 pm

Most flip chip devices are interconnected by solder joints. The development and reliability of the solder interconnection is the focus of this session.

The IMC Micro-Structure of Solder Joint to Correlate with Mechanical Drop Performance in SnAgCu CSP Packages
Jeffrey C. B. Lee, Advanced Semiconductor Engineering Group

Effect of Test Conditions on Electromigration Reliability of SnAgCu Flip-Chip Solder Bumps
Yi-Shao Lai, Chiu-Wen Lee, Yu-Hsiu Shao, Advanced Semiconductor Engineering, Inc.

Design Challenges of a Pb-free WLCSP
Glenn A. Rinne, Unitive Electronics Inc.


THP3
Manufacturing III: Polymer & Solder Processes
Chairs: Lyndon Larson, Dow Corning; Raymond Pearson, Lehigh University
12:30 pm – 1:45 pm

Understanding material characteristics and material interfaces is key to proper application of a material in electronics packaging. This session focuses on understanding or improving either the interfaces and the characteristics of polymers and solder used in electronics assembly.

Adhesion Failure Analysis between Photosensitive Solder Mask and Die Attach Adhesive using TOF-SIMS in PBGA Packaging
Min Woo Lee, Chan Yok Park, Amkor Technology Korea, R&D

Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology
Martin J. Burmeister, James Getty, Lou Fierro, Stellar Microelectronics, Inc.

Surface Morphology and Elemental Analysis Study on Non-Wetting Problem at Die Top
Mohamed Mohd Salleh, Universiti Kebangsaan Malaysia


THP4
Sensors and MEMS
Chairs: Janet Lumpp, University of Kentucky; David Galipeau, South Dakota State University
12:30 pm – 1:45 pm

Sensors and MEMS development continues to be an area of high national and international interest due to the need for improved homeland security. This session highlights new developments in gas and pressure sensors as well as MEMS resonators and switches.

Bi-Stable MEMS Switch with Low Actuation Voltage
Narendra V. Lakamraju, Stephen M. Phillips, Arizona State University

An Effective Simplified Way to obtain the Pull-Down Voltage for MEMS Switches
Joshua Liu, Motorola Inc.

Development of a Freon Gas Sensor using a Low Power 700oC Microheater in Low Temperature Cofire Ceramic
W. Kinzy Jones, Mary Ruales, Jain Wang, Florida International University



THA1 | THA2 | THA3 | THA4 | THA5 | THA6 | THA7 | THA8
THP1 | THP2 | THP3 | THP4
Tuesday Sessions | Wednesday Sessions

Register On-line

 

 

 

 

Sponsored in part by:
















Golf Tournament Sponsorsed in part by:
















IMAPS - International Microelectronics And Packaging Society
and Sidney J. Stein Educational Foundation
611 2nd Street, NE -- Washington, DC 20002
imaps @ imaps.org | 202.548.4001 | 202.548.6115 (fax)