Technical
Program
*All Technical Sessions will be held in the Pennsylvania Convention
Center. Room locations will be made available closer to the
show date.
Use the following Session
List below to link to a particular Day or directly to a
Session:
Tuesday, September
27, 2005
Morning Sessions:
TA1 - 3D
Packaging
TA2 - Thermal Management
TA3 - Reliability
I (Issues in Packaging)
TA4 - Sensor
and MEMS Packaging
Afternoon Sessions:
TP1 - 3D
Packaging
TP2 - Thermal Management
TP3 - Reliability I
(Issues in Packaging)
TP4 - Sensor and MEMS
Packaging
TP5 - Emerging Technologies
TP6 - Attachment Technologies
- Solder and Conductive Pastes
TP7 - Manufacturing
I: Packaging Processes & Quality Assessments
TP8 - Photonics/Optoelectronics
Packaging
Wednesday, September
28, 2005
Morning Sessions:
WA1 - Emerging
Technologies
WA2 - Attachment Technologies
- Solder and Conductive Pastes
WA3 - Manufacturing
I: Packaging Processes & Quality Assessments
WA4 - Photonics/Optoelectronics Packaging
WA5 - Advanced Technology & Production Trend on Lead-Free
Soldering in Japan (Japanese to English Translation)
WA6 - Fine Pitch Interconnect
Technologies
WA7 - Flip Chip Reliability
(Underfill, Cleaning, & Rework)
WA8 - Manufacturing
II: Thin Substrates & Embedded Components
WA9 - LTCC
Technology
WA10 - Advanced Technology & Production
Trend on Lead-Free Soldering in Japan (Japanese to English Translation)
Afternoon Sessions:
WP1 - Interactive
Forum (Poster Session)
WP2 - Fine Pitch Interconnect
Technologies
WP3 - Flip Chip Reliability
(Underfill, Cleaning, & Rework)
WP4 - Manufacturing
II: Thin Substrates & Embedded Components
WP5 - LTCC
Technology
WP6 - Wirebonding (Gold)
WP7 - Power Packaging (Si and
SiC)
WP8 - Reliability II (Test Methods)
WP9 - Substrate Advances
in Packaging
Thursday,
September 29, 2005
Morning Sessions:
THA1 - Wirebonding
(Gold)
THA2 - Power Packaging (Si and SiC)
THA3 - Reliability II (Test Methods)
THA4 - Substrate Advances in Packaging
THA5 -
3D Packaging & High Density Substrates
THA6 -
Flip Chip (Solder Attach)
THA7 -
Manufacturing III: Polymer & Solder Processes
THA8 -
Sensors and MEMS
Afternoon Sessions:
THP1 -
3D Packaging & High Density Substrates
THP2 -
Flip Chip (Solder Attach)
THP3 -
Manufacturing III: Polymer & Solder Processes
THP4 -
Sensors and MEMS
