Technical Program

*All Technical Sessions will be held in the Pennsylvania Convention Center. Room locations will be made available closer to the show date.

Use the following Session List below to link to a particular Day or directly to a Session:

Tuesday, September 27, 2005

Morning Sessions:
TA1 - 3D Packaging
TA2 - Thermal Management
TA3 - Reliability I (Issues in Packaging)
TA4 - Sensor and MEMS Packaging

Afternoon Sessions:
TP1 - 3D Packaging
TP2 - Thermal Management
TP3 - Reliability I (Issues in Packaging)
TP4 - Sensor and MEMS Packaging
TP5 - Emerging Technologies
TP6 - Attachment Technologies - Solder and Conductive Pastes
TP7 - Manufacturing I: Packaging Processes & Quality Assessments
TP8 - Photonics/Optoelectronics Packaging

Wednesday, September 28, 2005

Morning Sessions:
WA1 - Emerging Technologies
WA2 - Attachment Technologies - Solder and Conductive Pastes
WA3 - Manufacturing I: Packaging Processes & Quality Assessments
WA4 - Photonics/Optoelectronics Packaging
WA5 - Advanced Technology & Production Trend on Lead-Free Soldering in Japan (Japanese to English Translation)
WA6 - Fine Pitch Interconnect Technologies
WA7 - Flip Chip Reliability (Underfill, Cleaning, & Rework)
WA8 - Manufacturing II: Thin Substrates & Embedded Components
WA9 - LTCC Technology
WA10 - Advanced Technology & Production Trend on Lead-Free Soldering in Japan (Japanese to English Translation)

Afternoon Sessions:
WP1 - Interactive Forum (Poster Session)
WP2 - Fine Pitch Interconnect Technologies
WP3 - Flip Chip Reliability (Underfill, Cleaning, & Rework)
WP4 - Manufacturing II: Thin Substrates & Embedded Components
WP5 - LTCC Technology
WP6 - Wirebonding (Gold)
WP7 - Power Packaging (Si and SiC)
WP8 - Reliability II (Test Methods)
WP9 - Substrate Advances in Packaging

Thursday, September 29, 2005

Morning Sessions:
THA1 - Wirebonding (Gold)
THA2 - Power Packaging (Si and SiC)
THA3 - Reliability II (Test Methods)
THA4 - Substrate Advances in Packaging
THA5 - 3D Packaging & High Density Substrates
THA6 - Flip Chip (Solder Attach)
THA7 - Manufacturing III: Polymer & Solder Processes
THA8 - Sensors and MEMS

Afternoon Sessions:
THP1 - 3D Packaging & High Density Substrates
THP2 - Flip Chip (Solder Attach)
THP3 - Manufacturing III: Polymer & Solder Processes
THP4 - Sensors and MEMS

 

 

 

 

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IMAPS - International Microelectronics And Packaging Society
and Sidney J. Stein Educational Foundation
611 2nd Street, NE -- Washington, DC 20002
imaps @ imaps.org | 202.548.4001 | 202.548.6115 (fax)