IMAPS 2006 - 39th International Symposium on Microelectronics - Bringing Together the Entire Microelectronics Supply Chain!
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PLATINUM SPONSOR:

Natel - Platinum Sponsor

GOLD SPONSOR:

Panasonic Factory Solutions - Gold Sponsor

SILVER SPONSOR:

Hesse & Knipps - Silver Sponsor

 

Industry Focused Track


IMAPS 2006 will offer three separate plenary sessions that will focus on key international industries located on the Pacific Coast and in the Southwest US. These sessions are presented in addition to 200+ technical papers, 16 Professional Development Courses, and 50 posters that are also being offered at IMAPS 2006.

RF/Wireless "Focused Sessions" | Military "Focused Session" | Biomedical "Focused Session"


RF/Wireless Industry "Focused Session"

RF/Wireless "Focused Sessions"
The IMAPS 2006 Symposium is featuring two special sessions on microelectronics and advanced packaging technologies for the RF/Wireless Industry. The RF/Wireless "Focused Sessions" will highlight Industry/OEMs participation, systems/applications, design and materials/process papers. Presentations will highlight major contributions in the RF-related and Wireless Industries. These sessions will serve to fill in the gaps within the RF/Wireless technical manufacturing “Pyramid.”

 

Tuesday, October 10, 2006, 8:00 AM - 10:50 AM

TA1 - Advanced Packaging in RF and Wireless Applications I
Chairs: Ron Barnett, GeoMat Insights LLC; Aicha Elshabini, University of Idaho

Cutting edge RF, Microwave, and Millimeter packaging is the subject of this focused session, where you will see papers on MMwave Ball-Grid-Arrays, a novel method of eliminating bypass capacitors, a 3D plastic-based system-system-in-a-package, and several new innovative low cost Microwave packaging systems.

Microwave Performance of Ball Grid Array Packages
Rick Sturdivant, Microwave Packaging Technology, Inc.

A Novel Wideband Embedded Decoupling Structure for Power Supply Distribution in RF and Microwave Circuits that Eliminates Bypass Capacitors by Controlling Resonances
Thomas A. Jerse, The Citadel; Ron Barnett, GeoMat Insights LLC

Advanced Thick Film Technology Enabling Three-Dimensional Microwave Microcircuits
Lewis Dove, Agilent Technologies, Inc.

Wall-Grid Array Laminate Multi-Chip Module
Paul Cassanego, Brian Hutchison, Robin Zinsmaster, Donald Estreich, Matt Schwiebert, Bob Fullmer, Jim P. Stephens, Connie Van Schaick, Dave Dascher, Agilent Technologies

High Performance Thick Film Ball Grid Array Package
Donald E. Schott, Agilent Technologies

Compact and High Density Hermetic Modules for Microwave and Millimeter Wave Applications
Anh-Vu Pham, University of California, Davis


Tuesday, October 10, 2006, 1:45 PM - 5:30 PM

TP1 - Advanced Packaging in RF and Wireless Applications II
Chairs: Ron Barnett, GeoMat Insights LLC; John Gipprich, Northrop Grumman Electronic

Innovative RF, Microwave, and Millimeter wave packaging is presented in this session, where you will see papers on multi-disciplined module/system-in-a-package design, including mmWave plastic, Low-loss High Temperature Co-fired Ceramic (HTCC), mmWave Low Temperature Co-fired Ceramic (HTCC), RF MEMS on high resistivity Silicon, and inexpensive high performance packaging.

System-Level Design requirements for Wireless RF Module Design
Keith Felton, Cadence Design Systems Inc.

Photoimageable Thick-Film Circuits up to 100 GHz
Manju Henry, Charles E. Free, University of Surrey

Millimeter-Wave Performance of Alumina High Temperature Cofired Ceramics IC Packages
Rick Sturdivant, Microwave Packaging Technology, Inc.

Packaged Microwave Components for Multimedia Satellite Communication
Reinhard Kulke, Olaf Kersten, Josef Winkler, Carsten Günner, Matthias Rittweger, IMST GmbH

Hybrid Wafer-Level Packaging for RF-MEMS Applications
Marian Bartek, S. Sosin, J. Tian, J. Iannacci, Delft University of Technology, ECTM/DIMES

mm-Wave Packaging: A Low-Cost Solution Based on a Leadless Plastic Package
Mario Engl, Klaus Pressel, Jochen Dangelmaier, Horst Theuss, Werner Simbuerger, Herbert Knapp, Robert Weigel, Infineon Technologies AG

Reducing LTCC losses at High Millimetre-Wave Frequencies
M. Henry, C. Free, University of Surrey; Quentin Reynolds, Stefan Malkmus, Jim Wood, Heraeus Circuit Materials Division

 

 


Military Industry "Focused Session"

Military "Focused Session"
The IMAPS 2006 Symposium is featuring a special session on microelectronics and advanced packaging technologies for the Military Industry. The Military "Focused Session" will highlight Industry/OEMs participation, systems/applications, design and materials/process papers. Presentations will feature the latest military, aerospace, space and homeland security electronic devices, systems, and applications, with particular emphasis on design, fabrication, assembly, testing, and materials selection operations. This session will serve to fill in the gaps within the Military technical manufacturing “Pyramid.”

Wednesday, October 11, 2006, 8:00 AM - 11:30 AM

WA1 - Advanced Packaging in Military Applications
Chairs: Greg Caswell, VirTex Assembly Services, Inc.; Christo Bojkov, MAXIM-DallasSemi

This session will address issues and applications that are affecting the implementation of next generation military electronics, from 3D and novel packaging approaches, to fiberoptics and reliability.

A Systems-In-Package Approach for Military and Aerospace Applications using FlipChip and 3-D Packaging
Keith Sturcken, BAE SYSTEMS

3D Technologies for Advanced Hybrid/MCM Designs
Tom Dlouhy, Gordon Jensen, CAD Design Software

High Temperature Generic Electronic Module (GEM) for Aerospace Actuators
Bhal R. Tulpule, Richard Millar, Steve Raccio, Carole Teolis, Embedded Systems LLC

A Novel IC Packaging Approach
Anna Fontanelli, Mentor Graphics Corporation

Hot Solder Dip and Minimizing Thermal Gradients
Russell T. Winslow, Ganesh R. Iyer, Minerva M. Cruz, Six Sigma; Guna S. Selvaduray, San Jose State University

Effect of High Temperature Storage in Vacuum, Air, and Humid Conditions on Degradation of Gold/Aluminum Wire Bonds in PEMs
Alexander Teverovsky, QSS Group, Inc.

Leveraging the Militarization of COTS Adhesives for Significant Cost Savings of Terrestrial Fiber Optic Cables
Gregory T. Daly, Lockheed Martin MS2

 


Biomedical Industry "Focused Session"

Biomedical "Focused Session"
The IMAPS 2006 Symposium is featuring a special session on microelectronics and advanced packaging technologies for the Biomedical Industry. The Biomedical "Focused Session" will highlight Industry/OEMs participation, systems/applications, design and materials/process papers. This session will serve to fill in the gaps within the Biomedical technical manufacturing “Pyramid.”

 

Thursday, October 12, 2006, 8:00 AM - 12:20 PM

THA1 - Advanced Packaging in Biomedical Applications
Chairs: Joan Delalic, Temple University; Sharad Bhatt, Shanta Systems

The biomedical session is novel to the IMAPS 2006 event. It introduces a new approach to packaging and application of biomedical sensors and micro/nano electronic devices.

Aberration Retrieval from the Point Spread Function in Ophthalmic Wavefront Sensors
Edward Polkowski, MIEYE LLC

Development of Portable Zeolite Based Gas Sensor
David M. Kargbo, Z. Joan Delalic, Zameer Hasan, Son Nguyen, Temple University

All-Electrical PZT/SiO2 Piezoelectric Microcantilever Mass Sensors with Femtogram/Hz Sensitivity
Wan Y. Shih, Zuyan Shen, Wei-Heng Shih, Drexel University

Portable Device for Detection of Toxic Chemicals Using Yeast-Based Biosensor
Son Nguyen, Sowrabha Vijayanna, Joan Z. Delalic, Danny Dhanasekaran, Temple University

Miniature Thin Film Precision Resistors, Capacitors and Inductors for Medical Applications
Robert Heistand II, George Korony, AVX Corporation

New Leak Test Method Increases Reliability of Hermetic Packages
John C. Pernicka, Pernicka Corporation

Reliability of Stacked Package
Shin Kim, Seo Young Yang, Young Min Lee, Dong Gil Shin, Samsung Electronics

 

 


 

 

 

 

EVENT SPONSORS:

Heraeus TFD - Cafe Sponsor

Sefar - Lanyards Sponsor

Teledyne Microelectronics - Cafe Sponsor

Indium - Final Program Sponsor

NXGen Electronics - Final Program Sponsor

GOLF SPONSORS:

Component Surfaces, Inc - Golf Sponsor

Quik-Pak - Golf Sponsor


SPM - Golf Sponsor


Stellar Microelectronics - Golf Sponsor


Technic - Golf Sponsor


Kulicke & Soffa - Golf Sponsor

AGC Electronic Materials - Golf Sponsor

Kyocera - Golf Sponsor

Shoei Chemical - Golf Sponsor

Torrey Hills Technologies, LLC
Torrey Hills Tech


Virtex Assembly

Emerson & Cuming

SPONSORING PUBLISHERS:

Antenna Systems & Technologies - Publishing Sponsor

Equipment Protection - Publishing Sponsor

LED Journal - Publishing Sponsor

Materials Engineering News - Publishing Sponsor

 IMAPS 2006
 39th International Symposium
 on Microelectronics
 www.imaps2006.org
 October 8-12, 2006
 San Diego Convention Center
 San Diego, California USA
 


International Microelectronics And Packaging Society
Everything in Electronics Between the Chip and the System!
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