IMAPS 2006 - Industry "Focused Sessions" on Biomedical, Military and RF/Wireless

Industry Focused Track

IMAPS 2006 will offer three separate plenary sessions that will focus on key international industries located on the Pacific Coast and in the Southwest US. These sessions are presented in addition to 200+ technical papers, 16 Professional Development Courses, and 50 posters that are also being offered at IMAPS 2006.

RF/Wireless "Focused Sessions" | Military "Focused Session" | Biomedical "Focused Session"


	RF/Wireless "Focused Sessions" The IMAPS 2006 Symposium is featuring two special sessions on microelectronics and advanced packaging technologies for the RF/Wireless Industry. The RF/Wireless "Focused Sessions" will highlight Industry/OEMs participation, systems/applications, design and materials/process papers. Presentations will highlight major contributions in the RF-related and Wireless Industries. These sessions will serve to fill in the gaps within the RF/Wireless technical manufacturing “Pyramid.”
Tuesday, October 10, 2006, 8:00 AM - 10:50 AM TA1 - Advanced Packaging in RF and Wireless Applications I Chairs: Ron Barnett, GeoMat Insights LLC; Aicha Elshabini, University of Idaho Cutting edge RF, Microwave, and Millimeter packaging is the subject of this focused session, where you will see papers on MMwave Ball-Grid-Arrays, a novel method of eliminating bypass capacitors, a 3D plastic-based system-system-in-a-package, and several new innovative low cost Microwave packaging systems. Microwave Performance of Ball Grid Array Packages Rick Sturdivant, Microwave Packaging Technology, Inc. A Novel Wideband Embedded Decoupling Structure for Power Supply Distribution in RF and Microwave Circuits that Eliminates Bypass Capacitors by Controlling Resonances Thomas A. Jerse, The Citadel; Ron Barnett, GeoMat Insights LLC Advanced Thick Film Technology Enabling Three-Dimensional Microwave Microcircuits Lewis Dove, Agilent Technologies, Inc. Wall-Grid Array Laminate Multi-Chip Module Paul Cassanego, Brian Hutchison, Robin Zinsmaster, Donald Estreich, Matt Schwiebert, Bob Fullmer, Jim P. Stephens, Connie Van Schaick, Dave Dascher, Agilent Technologies High Performance Thick Film Ball Grid Array Package Donald E. Schott, Agilent Technologies Compact and High Density Hermetic Modules for Microwave and Millimeter Wave Applications Anh-Vu Pham, University of California, Davis Tuesday, October 10, 2006, 1:45 PM - 5:30 PM TP1 - Advanced Packaging in RF and Wireless Applications II Chairs: Ron Barnett, GeoMat Insights LLC; John Gipprich, Northrop Grumman Electronic Innovative RF, Microwave, and Millimeter wave packaging is presented in this session, where you will see papers on multi-disciplined module/system-in-a-package design, including mmWave plastic, Low-loss High Temperature Co-fired Ceramic (HTCC), mmWave Low Temperature Co-fired Ceramic (HTCC), RF MEMS on high resistivity Silicon, and inexpensive high performance packaging. System-Level Design requirements for Wireless RF Module Design Keith Felton, Cadence Design Systems Inc. Photoimageable Thick-Film Circuits up to 100 GHz Manju Henry, Charles E. Free, University of Surrey Millimeter-Wave Performance of Alumina High Temperature Cofired Ceramics IC Packages Rick Sturdivant, Microwave Packaging Technology, Inc. Packaged Microwave Components for Multimedia Satellite Communication Reinhard Kulke, Olaf Kersten, Josef Winkler, Carsten Günner, Matthias Rittweger, IMST GmbH Hybrid Wafer-Level Packaging for RF-MEMS Applications Marian Bartek, S. Sosin, J. Tian, J. Iannacci, Delft University of Technology, ECTM/DIMES mm-Wave Packaging: A Low-Cost Solution Based on a Leadless Plastic Package Mario Engl, Klaus Pressel, Jochen Dangelmaier, Horst Theuss, Werner Simbuerger, Herbert Knapp, Robert Weigel, Infineon Technologies AG Reducing LTCC losses at High Millimetre-Wave Frequencies M. Henry, C. Free, University of Surrey; Quentin Reynolds, Stefan Malkmus, Jim Wood, Heraeus Circuit Materials Division

	Military "Focused Session" The IMAPS 2006 Symposium is featuring a special session on microelectronics and advanced packaging technologies for the Military Industry. The Military "Focused Session" will highlight Industry/OEMs participation, systems/applications, design and materials/process papers. Presentations will feature the latest military, aerospace, space and homeland security electronic devices, systems, and applications, with particular emphasis on design, fabrication, assembly, testing, and materials selection operations. This session will serve to fill in the gaps within the Military technical manufacturing “Pyramid.”
Wednesday, October 11, 2006, 8:00 AM - 11:30 AM WA1 - Advanced Packaging in Military Applications Chairs: Greg Caswell, VirTex Assembly Services, Inc.; Christo Bojkov, MAXIM-DallasSemi This session will address issues and applications that are affecting the implementation of next generation military electronics, from 3D and novel packaging approaches, to fiberoptics and reliability. A Systems-In-Package Approach for Military and Aerospace Applications using FlipChip and 3-D Packaging Keith Sturcken, BAE SYSTEMS 3D Technologies for Advanced Hybrid/MCM Designs Tom Dlouhy, Gordon Jensen, CAD Design Software High Temperature Generic Electronic Module (GEM) for Aerospace Actuators Bhal R. Tulpule, Richard Millar, Steve Raccio, Carole Teolis, Embedded Systems LLC A Novel IC Packaging Approach Anna Fontanelli, Mentor Graphics Corporation Hot Solder Dip and Minimizing Thermal Gradients Russell T. Winslow, Ganesh R. Iyer, Minerva M. Cruz, Six Sigma; Guna S. Selvaduray, San Jose State University Effect of High Temperature Storage in Vacuum, Air, and Humid Conditions on Degradation of Gold/Aluminum Wire Bonds in PEMs Alexander Teverovsky, QSS Group, Inc. Leveraging the Militarization of COTS Adhesives for Significant Cost Savings of Terrestrial Fiber Optic Cables Gregory T. Daly, Lockheed Martin MS2

	Biomedical "Focused Session" The IMAPS 2006 Symposium is featuring a special session on microelectronics and advanced packaging technologies for the Biomedical Industry. The Biomedical "Focused Session" will highlight Industry/OEMs participation, systems/applications, design and materials/process papers. This session will serve to fill in the gaps within the Biomedical technical manufacturing “Pyramid.”
Thursday, October 12, 2006, 8:00 AM - 12:20 PM THA1 - Advanced Packaging in Biomedical Applications Chairs: Joan Delalic, Temple University; Sharad Bhatt, Shanta Systems The biomedical session is novel to the IMAPS 2006 event. It introduces a new approach to packaging and application of biomedical sensors and micro/nano electronic devices. Aberration Retrieval from the Point Spread Function in Ophthalmic Wavefront Sensors Edward Polkowski, MIEYE LLC Development of Portable Zeolite Based Gas Sensor David M. Kargbo, Z. Joan Delalic, Zameer Hasan, Son Nguyen, Temple University All-Electrical PZT/SiO2 Piezoelectric Microcantilever Mass Sensors with Femtogram/Hz Sensitivity Wan Y. Shih, Zuyan Shen, Wei-Heng Shih, Drexel University Portable Device for Detection of Toxic Chemicals Using Yeast-Based Biosensor Son Nguyen, Sowrabha Vijayanna, Joan Z. Delalic, Danny Dhanasekaran, Temple University Miniature Thin Film Precision Resistors, Capacitors and Inductors for Medical Applications Robert Heistand II, George Korony, AVX Corporation New Leak Test Method Increases Reliability of Hermetic Packages John C. Pernicka, Pernicka Corporation Reliability of Stacked Package Shin Kim, Seo Young Yang, Young Min Lee, Dong Gil Shin, Samsung Electronics