IMAPS 2006 - 39th International Symposium on Microelectronics - Bringing Together the Entire Microelectronics Supply Chain!
IMAPS 2006 Home IMAPS 2006 Programs IMAPS 2006 Exhibition IMAPS 2006 Registration Information IMAPS 2006 Activities IMAPS 2006 National Symposium Committee

PLATINUM SPONSOR:

Natel - Platinum Sponsor

GOLD SPONSOR:

Panasonic Factory Solutions - Gold Sponsor

SILVER SPONSOR:

Hesse & Knipps - Silver Sponsor

 

Professional Development Courses (PDCs)
All PDCs run 9:00 am - 5:00 pm, unless otherwise noted

2006 PDCs | Included with PDC | Cancellation Policy

Do you want to broaden and strengthen your skills and knowledge, optimize your manufacturing processes, and integrate the latest advances in materials and technologies to maintain your strength in today’s competitive global market? The Technical Committee of IMAPS is pleased to present a comprehensive offering of Professional Development Courses that provide detailed information on topics of immediate interest to the Microelectronics and Packaging community. So please be sure to choose from the sixteen in-depth Professional Development Courses taught by recognized industry experts. You will discover the following key ways that will benefit you.

• Better understand the skills and knowledge necessary in today’s industry.
• Be exposed to the rapidly expanding developments in new materials and technologies.
• Consult with renowned authorities about your current R&D or manufacturing problems and challenges.
• Learn new ways to identify, think about, and address your problems and opportunities.
• Great opportunities to interact with industry experts and other course attendees.
• Certificate of Attendance and much more…

Your PDC Registration Fee Includes:
• Lunch on the day of your course
• Refreshment breaks
• All course materials
• PDC Reception on Sunday evening (for Attendees & Instructors only)
• Certificate of Attendance

PDC Cancellation Policy:
IMAPS reserves the right to cancel a course if the number of attendees is not sufficient. You can transfer to a different course or we will refund you the corresponding amount.

2006 PDCs:
Click the dates below to see the complete PDC offerings on each day or click the PDC title below to directly to that PDC description.

Sunday, October 8, 2006 Monday, October 9, 2006
S1 - Plating Processes for High Rel Microelectronic Devices M1 - Wire Bonding in Microelectronics
S2 - RF/Microwave Hybrids: Principles, Materials and Processes M2 - Advanced Thermal Management and Packaging Materials
S3 - Practical Electronics Reliability – An Overview M3 - Low Temperature Co-fired Ceramics (LTCC)
S4 - Technology of Screen Printing M4 - Hermeticity Testing, RGA and “Near Hermetic” Packaging Concepts
S5 - Application of Nanomanufacturing for Microelectronics and Related Microsystems Packaging
M5 - Adhesion Fundamentals in Microelectronic Packaging
S6 - Introduction to Microelectronics Packaging Technology M6 - Introduction to Integrated Circuit Packaging, Assembly, and Interconnections
S7 - Lead-Free Reliability & Manufacturing
1/2 Day Course: 9 am - Noon
M7 - Biomedical Materials, Devices and Packaging
1/2 Day Course: 9 am - Noon
S8 - Six Sigma Applications in Microelectronics Packaging
1/2 Day Course: 1:00 pm - 5:00 pm
M8 - Guide to Component Chip Attach - Including Flip Chip
1/2 Day Course: 1:00 pm - 5:00 pm

 

 

 

 

 

EVENT SPONSORS:

Heraeus TFD - Cafe Sponsor

Sefar - Lanyards Sponsor

Teledyne Microelectronics - Cafe Sponsor

Indium - Final Program Sponsor

NXGen Electronics - Final Program Sponsor

GOLF SPONSORS:

Component Surfaces, Inc - Golf Sponsor

Quik-Pak - Golf Sponsor


SPM - Golf Sponsor


Stellar Microelectronics - Golf Sponsor


Technic - Golf Sponsor


Kulicke & Soffa - Golf Sponsor

AGC Electronic Materials - Golf Sponsor

Kyocera - Golf Sponsor

Shoei Chemical - Golf Sponsor

Torrey Hills Technologies, LLC
Torrey Hills Tech


Virtex Assembly

Emerson & Cuming

SPONSORING PUBLISHERS:

Antenna Systems & Technologies - Publishing Sponsor

Equipment Protection - Publishing Sponsor

LED Journal - Publishing Sponsor

Materials Engineering News - Publishing Sponsor

 IMAPS 2006
 39th International Symposium
 on Microelectronics
 www.imaps2006.org
 October 8-12, 2006
 San Diego Convention Center
 San Diego, California USA
 


International Microelectronics And Packaging Society
Everything in Electronics Between the Chip and the System!
611 2nd St, NE | Washington, DC 20002
imaps@imaps.org | www.imaps.org | +1-202-548-4001