Interactive
Poster Sessions
Poster
Session I (Wed. Morning) | Student
Poster Session (Wed Afternoon) | Poster Session II (Thurs. Morning)
Wednesday, October 11, 2006
8:00 AM - 11:30 AM
WA7
Interactive Forum I (Poster Session)
Chairs: Keith Easler, Kyocera America, Inc.; Ron Barnett,
GeoMat Insights LLC
One-on-One Interactive Forum. This is your chance for detailed
interaction with authors whose work is too good to miss.
Performance, Production, and Applications of Advanced Metal Diamond Composite Heat Spreader
Ravi Bollina, J. Landgraf, H. Wagner, R. Wilhelm, S. Knippscheer, B. Tabernig, Plansee SE
Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems
Lizheng Zhang, Jin Yang, Charles Ume, Georgia Institute of Technology
Unique Joint Mater ial of Coin Shape for Thinner Modules
Nobuyuki Okinaga, Masaki Okuda, Kiyoto Matsushita, Sekisui Chemical Co., Ltd.
Warpage Improvement of FCBGA using Low CTE Thin Core Material
Chang-Gun Oh, Hwa Young Lee, Seung Hyun Cho, Shin Woo Ji, Cheol Ho Choi, Samsung Electro-Mechanics Co., Ltd.
Lead-Free Die-Attach Material for Power Electronics
Muriel Thomas, Klaus Schaack, Umicore AG & Co. KG
Challenges in Cooling of High Power-Density LSI Packages
Jie Wei, Fujitsu Limited
Flip Chip Process using Local Heat Transfer from Induction Heating Body
Tae-Sung Oh, Kwang-Yong Lee, Yoon-Hee Lee, Boo-Yang Jung, Teck-Su Oh, Hongik University
The Effect of Lattice Mismatch on the Piezoresponse of Barium Titanate (BaTiO3) Thin Films on Magnesium Oxide (MgO) Substrates
B. Liu, A. Bhattacharyya, University of Arkansas at Little Rock
Advanced Cleaning Fluid Design and Process for Cleaning Flip Chip Packages
Mike Bixenman, Kyzen Corporation
Status of Heat Sinking Materials for Electronic Packaging in China
Zhifa Wang, Guosheng Jiang, Datian Cui, Saneway Electronic Materials, Co. Ltd.; Ken Kuang, Torrey Hills Technologies, LLC
Parametric Study of Contact Force with NCA Attached Dies
Kimmo Kaija, Janne Kiilunen, Sampsa Kuusiluoma, Pekka Heino, Tampere University of Technology
Impact of Application Surface on the Development of Thermal Interface Materials
Martin W. Weiser, Devesh Mathur, Ravi Rastogi, Honeywell Electronic Materials
Reliability Study of MCM-L with High I/Os Flip Chip and Laminated Board with Stacked vias in Build-Up Layers
Le Luo, Yingjun Cheng, Gaowei Xu, Shanghai Institute of Microsystem and Information Technology, CAS
Solvent Resistance of Silicones used for Electronic Packaging Applications
Michelle Velderrain, Scott Duffer, Bill Riegler, NuSil Technology LLC
Wednesday,
October 11, 2006
3:30 PM - 5:00 PM
WP7
Student Poster Session
Chairs: Jianbiao John Pan, California Polytechnic State;
Eric Tiezheng Li, San Diego State University
Trampoline Fabry-Perot Optical Accelerometer
Brian Schmaltz, San Diego State University
Wafer-Bonded Fabry-Perot Optical Accelerometer
Brian Schmaltz, San Diego State University
Gas Sensor based on Inelastic Electron Tunneling Spectroscopy
for Electronic Noise Applications
Sachin Bhandari, James W. Galipeau, Roby Behenan, South Dakota
State University
Effect of Board Finish on Lead Free Solder Joint Drop Test
Reliability
Edward L. Clements, Visente I. Simental, James P. Webster,
Jianbiao Pan, California Polytechnic State
Finite Element Analysis of Board Flexing during Lead Free
Solder Joint Drop Test
Visente I. Simental, Edward L. Clements, Jianbiao Pan, California
Polytechnic State
Assembly and Characterization of Surface Mount Components
on Silicon Substrate
Brian S. Wright, Richard Savage, Jianbiao Pan, California
Polytechnic State
A Pseudo-Noise Code Synchronizer Circuit Design DS-DQPSK
Spread Spectrum Receiver with 0.6 um CMOS
Aghang Saeb, Islamic Azad University
Scanned Electrical Probe Characterization of Carrier Transport
behavior in InAs Nanowires
Xiaotian Zhou, University of California, San Diego
Thursday,
October 12, 2006
8:00
am - 11:55 am
THA 7
Interactive Forum II (Poster Session)
Chairs: Keith Easler, Kyocera America, Inc.; Ron Barnett,
GeoMat Insights LLC
One-on-One Interactive Forum. This is your chance for detailed
interaction with authors whose work is too good to miss.
Novel Techniques for Inspection and Failure Analysis of Mounted and Underfilled Flip Chip Devices
Roger M. Devaney, Hi-Rel Laboratories
High Productivity DRIE Solutions for 3D-SiP and MEMS Volume Manufacturing
M. Puech, JM Thevenoud, N. Launay, N. Arnal, P. Godinat, B. Andrieu, JM Gruffat, Alcatel Vacuum Technology
Process Development and Reliability for None Lead Bump Array (NBA) Package
Liang Yi Hung, Yu Wei Lin, Yu Po Wang, F.D. Tang, C.S. Hsiao, Siliconware Precision Industries Co., Ltd.
Fully Wafer-Level Packaged RF MEMS Switch using Low Voltage Operated Piezoelectric Actuator for the Application to Reconfigurable Antenna
Jae-Hyoung Park, Hee-Chul Lee, Yong-Hee Park, Yong-Dae Kim, Hyouk Kwon, Hyo-Jin Nam, Jong-Uk Bu, LG Electronics Institute of Technology
Improvement of the Flip Chip BGA Defects using Atmospheric Pressure Plasma Surface Treatment Equipment
Sun Joong Ryu, Kum Ro Lee, Yong Dae Kim and Oh Hi Lee, Samsung Electro-Mechanics Co. Ltd.
Bump Interconnect of IC using Plating Technology
Yasuhide Ohno, Keisuke Taniguchi, Yasuhiro Kimiya, Katsuaki Fukunaga, Kumamoto University
“Total System Accuracy”TM For a Dispensing System
Rita Mohanty, Brian Prescott, Speedline Technologies
Fabrication and Characterization of Three Dimensional Interconnection Structures for System in Packages
Tae-Sung Oh, Kwang-Yong Lee, Teck-Su Oh, Hongik University
Performance Definition of a B-Stageable Adhesive for a Near Hermetic LCP Package Solution
Andrew Collins, Dave Gibson, Matthew Eveline, Emerson & Cuming
Sub Micron Cleaning of Microelectronics Devices via Vacuum Cavitational Cleaning Process, VCS
Charlotte Frederick, HyperFlo, LLC; Donald Gray, University of Rhode Island
Design Features and Reliability Analysis of a New Fine-Pitch Packaging Interconnect
Ilyas Mohammed, Tessera, Inc.
Void Reduction During Low Pressure Lamination of Electronic Assemblies
David C. Timpe, Jr., Andy Cloud, Arlon - Silicone Technologies Division
Stability of Alternative Metallizations for Adhesively Bonded Heat Sinks
David L. Gibson, Emerson & Cuming
