Together the Entire
Microelectronics Supply Chain...
each IMAPS technical event you will see a pyramid unique
the event to better help you understand how to participate
and what involvement to expect from each level of the respective
industry supply chain. With the rapid globalization of world
economies and markets, many electronics companies are now
outsourcing many of their manufacturing steps to subcontractors
the world. Both the technical and business people realize
they must look at their product and manufacturing processes
a broader perspective. IMAPS facilitates this discussion
by organizing its technical programs to match this 4- tiered
supply chain model. Communications among all 4 tiers of the
microelectronics and packaging supply chain are critical
to the success of innovation and new product developments.
IMAPS International Symposium, as well as the many workshops
and topical conferences held throughout the year, are being
structured to include presentations in all four of these
categories. The IMAPS PYRAMID depicts these 4 tiers and
vision and ideas for end products and technology needs
initiate at the INDUSTRY level. RF/Wireless, Biomedical,
Military and other end user areas constitute the industry
level. The next tier, which enables the electronic functioning
of these products, is the SYSTEMS & APPLICATIONS tier.
The microelectronic product design for mobile phones, automotive
engine managements systems, defibrillators, and other end-
user products start here. The next tier is DESIGN. This level
brings together the desire of the product concept with the
reality of how the microelectronic subsystems and components
get laid out, designed, simulated and integrated into packages
and subsystems. Last, the MATERIALS & PROCESS tier supplies
individual component and material technology to the SYSTEMS
in order to specify and build the end product.