IMAPS 2006 - 39th International Symposium on Microelectronics - Bringing Together the Entire Microelectronics Supply Chain!
IMAPS 2006 Home IMAPS 2006 Programs IMAPS 2006 Exhibition IMAPS 2006 Registration Information IMAPS 2006 Activities IMAPS 2006 National Symposium Committee

PLATINUM SPONSOR:

Natel - Platinum Sponsor

GOLD SPONSOR:

Panasonic Factory Solutions - Gold Sponsor

SILVER SPONSOR:

Hesse & Knipps - Silver Sponsor

 

Bringing Together the Entire
Microelectronics Supply Chain...


For each IMAPS technical event you will see a pyramid unique to the event to better help you understand how to participate and what involvement to expect from each level of the respective industry supply chain. With the rapid globalization of world economies and markets, many electronics companies are now outsourcing many of their manufacturing steps to subcontractors around the world. Both the technical and business people realize they must look at their product and manufacturing processes with a broader perspective. IMAPS facilitates this discussion by organizing its technical programs to match this 4- tiered global supply chain model. Communications among all 4 tiers of the microelectronics and packaging supply chain are critical to the success of innovation and new product developments. The IMAPS International Symposium, as well as the many workshops and topical conferences held throughout the year, are being structured to include presentations in all four of these categories. The IMAPS PYRAMID depicts these 4 tiers and the interrelations between each.

Typically, the vision and ideas for end products and technology needs initiate at the INDUSTRY level. RF/Wireless, Biomedical, Military and other end user areas constitute the industry level. The next tier, which enables the electronic functioning of these products, is the SYSTEMS & APPLICATIONS tier. The microelectronic product design for mobile phones, automotive engine managements systems, defibrillators, and other end- user products start here. The next tier is DESIGN. This level brings together the desire of the product concept with the reality of how the microelectronic subsystems and components get laid out, designed, simulated and integrated into packages and subsystems. Last, the MATERIALS & PROCESS tier supplies individual component and material technology to the SYSTEMS in order to specify and build the end product.

 

 

 

EVENT SPONSORS:

Heraeus TFD - Cafe Sponsor

Sefar - Lanyards Sponsor

Teledyne Microelectronics - Cafe Sponsor

Indium - Final Program Sponsor

NXGen Electronics - Final Program Sponsor

GOLF SPONSORS:

Component Surfaces, Inc - Golf Sponsor

Quik-Pak - Golf Sponsor


SPM - Golf Sponsor


Stellar Microelectronics - Golf Sponsor


Technic - Golf Sponsor


Kulicke & Soffa - Golf Sponsor

AGC Electronic Materials - Golf Sponsor

Kyocera - Golf Sponsor

Shoei Chemical - Golf Sponsor

Torrey Hills Technologies, LLC
Torrey Hills Tech


Virtex Assembly

Emerson & Cuming

SPONSORING PUBLISHERS:

Antenna Systems & Technologies - Publishing Sponsor

Equipment Protection - Publishing Sponsor

LED Journal - Publishing Sponsor

Materials Engineering News - Publishing Sponsor

 IMAPS 2006
 39th International Symposium
 on Microelectronics
 www.imaps2006.org
 October 8-12, 2006
 San Diego Convention Center
 San Diego, California USA
 


International Microelectronics And Packaging Society
Everything in Electronics Between the Chip and the System!
611 2nd St, NE | Washington, DC 20002
imaps@imaps.org | www.imaps.org | +1-202-548-4001