Welcome to IMAPS 2006 in San Diego, California.
While you are here, take some time to enjoy the sunny
beaches, attractions, culture and culinary delights of
this city as well as the intellectual and interactive
opportunities provided by this International Symposium.
have a full Technical Program with over 250 papers
covering current and future trends in electronic
packaging. The papers have been organized into 29
technical sessions, a translated Japanese to English
session, two Interactive Poster Sessions, and a Student
Poster Session. In addition, we are offering an expanded
selection of the excellent Professional Development
Courses for which IMAPS is widely recognized.
This year we are introducing three sessions focused
on rapidly evolving industries that are vital to the
San Diego area: RF and Wireless Packaging, Packaging
for Military Applications and Biomedical Packaging.
The remainder of the Technical Program is organized
into Technology Tracks for System/Design, Materials,
Reliability, Interconnect and Advanced Technologies.
Specific session topics include Nano Materials, Cu/Low-k,
Flip Chip Interconnection and Reliability, 3D Packaging,
Sensors and MEMS, Thermal Management, Electrical Design/Modeling,
High Density Boards, Advanced Ceramics and Metals,
ROHS Compliance and Outsourcing, Integrated Passives,
Pb-Free Solders, LED/SiC Packaging, Wire Bonding, Photonic/Optoelectronic
Packaging, and Emerging Technologies. The Japanese
to English translated session on Tuesday afternoon
will focus on the nano technologies for next generation
While you are at the conference, please plan on speaking
with the authors and reviewing some of the interesting
papers that will be presented in the Interactive Poster
sessions on Wednesday and Thursday morning, and the
Student Poster Session on Wednesday afternoon. On Wednesday
evening, the Global Business Council (GBC) has again
organized the popular session on business issues in
the packaging industry. With authors from Europe, the
Pacific Rim and the Americas, this is truly an International
Symposium. We believe you will enjoy and be enlightened
by this Technical Program. We take great pleasure in
presenting it to you.
We would like to thank the IMAPS National Technical
Committee for an outstanding job of reviewing abstracts
and setting up sessions. It was a difficult task; this
year there were more excellent abstracts submitted
than we could accommodate at the symposium. Andy Strandjord,
our Technical Vice President, has greatly improved
the infrastructure and process for reviewing, selecting,
and organizing sessions. We would also like to thank
our Session Champions who have been instrumental in
identifying experts in their fields and soliciting
abstracts, as well as chairing many sessions. Finally,
none of this could happen without the invaluable help
from our IMAPS staff members, in particular Brian Schieman
and Jackki Morris-Joyner. Thank you all. We hope you
enjoy the Symposium.
Sandia National Laboratories
Honeywell Solid State Electronics Center