Activities


In addition to the technical program and exhibition, the Symposium Committee has been hard at work planning other exciting activities for you, your colleagues and family while you're in town for IMAPS 2007.

Our annual Golf Classic will take place at the Coyote Creek Golf Club and offers not only a great day of fun on the golf course, but also supports The Microelectronics Foundation.

The opening ceremonies will feature the Annual Business Meeting, the Awards Ceremony and the first of three Keynote Presentations. This is a good opportunity to here what's going on with your Society and to show your appreciation for the list of your peers that have been recognized with Society Awards this year.

We have 3 keynote presentations: Stephen M. R. Covey, the author of the recently published “The Speed of Trust;” James R. Miller, Vice President, Product Operations for Cisco Systems; and Dongkai Shangguan, Vice President for Assembly Technology and Platform Realization for Flextronics.

Sponsorship is an integral part of such a large undertaking. Welcome Back to our platinum - NATEL, gold - Panasonic Factory Solutions, and silver - Hesse & Knipps sponsors. In addition, Heraeus has signed on as the 40th Anniversary Hospitality/Logo Caps sponsor and Sefar is repeating as the Lanyard sponsor. Thanks to all of our sponsors for their support. 

Paul and Amanda Van Loan have created a wonderful spouse/companion program with a one-day trip to the Monterey Aquarium, the city of Carmel and a ride down the “Seventeen Mile Drive.”  The 2nd day will feature a trip to the redwood country, Santa Cruz for lunch and the Bonny Doon Winery.

Another new activity this year involves having students from two local schools tour the Exhibit Hall to meet with our exhibitors. This will provide them with an educational experience and possibly launch them toward a career in microelectronics.

On top of all of this activity, we will also be celebrating the 40th Anniversary of IMAPS as a professional society.  Celebration activities are underway. 

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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Organized by the International Microelectronics And Packaging Society (IMAPS)
611 2nd St, NE - Washington, DC 20002 - 202-548-4001
© IMAPS 2007. All Rights Reserved.

Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.