IMAPS 2007 exhibiting companies will have the opportunity to impact the largest number of industry customers in one venue, introduce new products and concepts to this highly competitive market, network to enhance relationships with existing customers and be recognized as an industry leader. IMAPS 2007 Exhibitors will also have preference in choosing their booths for IMAPS 2008 in Providence, Rhode Island.

Reserve your booth online before it's too late

Here are the companies that have already reserved exhibit space:

COMPANY BOOTH NUMBER(S)
Accumet Engineering Corp. 832 
Accu-Tech Laser Processing, Inc. 913 
AdTech Ceramics 1207 
Advanced Packaging 421 
AI Technology, Inc. 709 
AIM Products 1109 
AkroMetrix, LLC 431 
ALLVIA 1013 
American Beryllia Inc. 307 
American Technical Ceramics 724 
AMI/Presco 1201-03 
Amkor Technology, Inc. 524 
Anaren Ceramics, Inc. 1027-29 
Anrich Microscreens, Inc. 1020 
Antares Advanced Test Technologies 1130 
Anter Corp. 420 
Asymtek 1017 
Avure Autoclave Systems, Inc. 1002 
Azimuth Electronics, Inc. 911 
Barry Industries, Inc. 714 
BE Semiconductor Industries NV 818 
Bennington Microtechnology Center 507 
BI Technologies Corporation 429 
Bruker AXS Inc. 420 
Bullen Ultrasonics, Inc. 1227 
Central Semiconductor Corp. 929 
Centrotherm Thermal Solutions GmSH 610 
Chip Scale Review 1328 
Chip Supply, Inc. 920 
Cicorel SA 528 
CMC Interconnect Technologies 530 
Cobehn Systems, Inc. 612 
Coining of America LLC 1021 
Compex Corp. 1029 
Compunetics 308 
Co-planar, Inc. 1212-14 
Crane Aerospace & Electronics 407 
Cyber Technologies USA 927 
D2M Technologies 1227 
Dage Precision Industries, Inc. 608 
Deweyl Tool Company, Inc. 1111-13 
DuPont Microcircuit Materials 521-523 
Dyconex AG. 819 
Dynamesh Inc. 307-309 
Dynamesh, Inc. 307-09 
EFD, Inc. 1218 
Electronic Polymers Inc. 1220-22 
Emerson & Cuming 512-14 
Endicott Interconnect Technologies, Inc. 428 
Epoxy Technology, Inc. 914 
ES Components, Inc 423 
ESL ElectroScience 1012-14 
Excelta Corp 419 
F&K Delvotec, Inc. 1107-09 
Ferro Electronic Material Systems 609-11 
Finetech, Inc. 727 
Five Star Technologies, Inc. 508 
Flip Chip International, LLC 720 
Fotofab 1010 
FRT of America, LLC 510 
Gaiser Tool Co. 1303 
Gannon & Scott 1123 
Geib Refining Corporation 613 
Global SMT & Packaging 930 
GPD Global 1327 
GSI Group Inc. 928 
H.C. Starck 418 
Haiku Tech, Inc. 517 
Harrop Industries, Inc. 1121 
HEI, Inc. 317 
Heraeus Thick Film Division 808-10 
Hesse & Knipps, Inc. 708 
Hi-Rel Laboratories 1209 
HTA Photomask 1108 
IKO International, Inc. 214 
Indium Corporation of America 813 
Infinite Graphics, Inc. 1311 
Innov-X Systems 1307 
Interconnect Systems, Inc. 1213 
Intersurface Dynamics, Inc. 932 
JCET 322 
Korea Computer Inc. 1308 
Kulicke & Soffa Industries, Inc. 511 
Kyocera America, Inc. 519 
Kyocera Industrial Ceramics Corp. 309 
Kyzen Corp. 1030 
L. Gordon Packaging 1019 
Laser Tech, Inc. 408 
Laserage Technology Corp. 1027 
Laserod 509 
LINTEC Corporation 1310 
Manufacturing Technology 1312 
Marubeni Chemix Corp. 228 
Maxtek Components Corporation 1103 
Micro Hybrid Dimensions, Inc. 909 
Micro Printing Systems 827 
Microcraft 210 
Microlux 1101 
Micropac Industries, Inc. 722 
MicroScreen LLC 817 
Minco Technology Labs, Inc. 513 
Mini-Systems, Inc. 718 
Mitsui Chemicals America, Inc. 728 
Miyachi Unitek Corp. 1004 
Mundt & Associates, Inc. 518-20 
NAMICS Technologies, Inc. 1008 
NanoDynamics 1128 
Natel Engineering Co., Inc. 902 
NETZSCH Instruments, Inc. 707 
Newport Corporation 1022-24 
NIKKO Company 409 
NorCom Systems, Inc. 1023 
Noritake Co., Inc. 410 
Northern California Chapter of IMAPS 835 
NPOS Technologies, Inc. 208 
NTK Technologies, Inc. 628 
NuSil Technology 1313 
NxGen Electronics 812 
Oerlikon ESEC USA, Inc. 729 
Orthodyne Electronics 1202-04 
Pac Tech USA 1102-04 
Pacific Aerospace & Electronics 1229 
Palomar Technologies, Inc. 1117-19 
Panasonic Electric Works Corp. of America 427 
Panasonic Factory Solutions Company 908 
Paricon Technologies Corp. 1306 
Perfection Products Inc. 918 
Petroferm Inc. 1227 
Photo Etch Technology 1309 
Photo Sciences Inc. 311 
Photochemie AG 528 
Photonics Spectra Magazine/Laurin Publishing 630 
Piconics 320 
Plansee Thermal Management Solutions 312 
Precision Process Equipment Inc. 318 
Premier Semiconductor Services 532 
Quantum Leap Packaging 422 
Reactive NanoTechnologies 831 
Reinhardt Microtech AG 619-21 
Reldan Metals, Inc. 824 
Riv, Inc. - Thick Film Screens 923 
Rohm and Haas Electronic Materials 1131 
Royce Instruments, Inc. 632 
SEFAR Printing Solutions, Inc. 907 
Semi Dice, Inc. 412 
Semiconductor Equipment Corp. 623 
Semiconductor Packaging Materials 922-24 
SENTEC E&E Co. Ltd 1211 
SierraTherm Production Furnaces, Inc. 829 
Sikama International, Inc. 614 
Silicon Cert, Ltd. 1224 
Sonix, Inc. 408 
Sonoscan, Inc. 814 
SST International 627-29 
Stellar Industries Corp. 607 
Stellar Microelectronics Inc. 821-23 
Student Booth: Cal Poly State University 935 
Student Booth: San Jose State University 1036 
Student Booth: SDSU 1135 
Student Booth: Temple University 836 
Student Booth: University of Arkansas 1035 
Student Booth: University of Idaho 937 
Student Booth: University of Kentucky 1037 
Student Booth: University of Maryland 936 
SUSS MicroTec 730 
Taconic 310 
TDK Corporation of America 411-13 
Technic, Inc. 617 
Tecnisco Ltd. 1028 
Teledyne Microelectronic Technologies 711-13 
Thin Film Industries, Inc. 1228 
Ticona Engineering Polymers 522 
Toray Engineering Co., Ltd. 212 
Torrey Hills Technologies, LLC 414 
TPT GbR 1318 
Trebor Instrument Corp. 1110 
Tresky Corporation 828 
Umicore AG & Co. Kg 1208-10 
Unichem Industries, Inc. 327 
United Recycling Inds.- Precious Metals Group 314 
VIOX Corporation 1018 
Webcom Communications Corp. 1230 
West-Bond, Inc. 1112-14 
Williams Advanced Materials 424 
Winslow Automation aka Six Sigma 417 
YEStech, Inc. 324 
Zeon Chemicals L.P. 328 
Zymet, Inc. 830 

 

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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Organized by the International Microelectronics And Packaging Society (IMAPS)
611 2nd St, NE - Washington, DC 20002 - 202-548-4001
© IMAPS 2007. All Rights Reserved.

Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.