Global Business Council
Presented its
Annual Marketing Forum

“Lighting Your Path to the Future-LED, FPD & IC Market Analysis, Supply Chain Opportunities & Emerging Technology”

INCLUDED WITH YOUR IMAPS 2007 FULL SYMPOSIUM REGISTRATION


Wednesday, November 14, 2007

San Jose Convention Center
5:15 pm - 6:45 pm

Chairs:
Howard Imhof, Metalor Technologies USA & Laurie Roth, Laurie S. Roth Marketing

This GBC-Marketing Forum was a business session for all IMAPS 2007 attendees who wished to participate. Speakers discussed market trends, supply chain opportunities and insights into current and emerging technology. A Networking Reception followed from 6:50 pm to 7:30 pm.



Keynote Speaker: M. George Craford, Chief Technology Officer, Philips LumiLeds Lighting Company

Title: Lighting Your Path to the Future

Dr. Craford obtained a Ph.D. degree in physics from the University of Illinois in 1967. He began his professional career as a research physicist at Monsanto Chemical Company, and became Technical Director of the Electronics Division, before joining the Hewlett Packard Company in 1979.  He is currently the Chief Technology Officer of Philips LumiLeds Lighting Company. His research has been mainly focused on the development of visible LEDs using a variety of compound semiconductor materials. He developed nitrogen-doped GaAsP technology in the early 1970s, which became one of the dominant commercial LED technologies. At Hewlett Packard, Dr. Craford’s group pioneered the development of AlInGaP LEDs, and also developed AlGaAs and InGaN products.  He is a fellow of the IEEE and a member of the National Academy of Engineering. He has received technical achievement awards from a variety of organizations and received the 2002 National Medal of Technology from the President of the United States. 

 

Speaker: Risto Puhakka, President, VLSI Research Inc.

Title: Current Semiconductor Forecast and Leading Indicators

As President of VLSI Research Inc., Risto Puhakka has responsibility for subscription services, sales, marketing, and business development.  Mr. Puhakka oversees and contributes to ongoing research projects and also spearheads product launches.  He manages VLSI’s advisory activities and regularly supplies advice and analysis to leading companies in the chip making industry, the financial community, the press, as well as various government agencies. Joining VLSI in 1995, Mr. Puhakka has been an important contributor to VLSI’s success. Starting as a senior analyst in Chip Making Markets, he has expanded his role through all critical positions within the company. He has served as President since 2004. Mr. Puhakka’s prior experience includes sales, marketing, and engineering activities with a global capital equipment manufacturer in Finland. He has earned his MBA from UC Berkeley and MS in Mining and Process Engineering from Helsinki University of Technology in Finland.

 

Speaker: Mark Harney, Chief Technical Officer, US Display Consortium

Title: The US Display Consortium Program on Flexible, Printed, and Organic Electronics

Dr. Mark Hartney joined USDC in June 2007 as Chief Technical Officer.  As CTO, Mark manages all technical activities of the USDC, including:  working with industry on the proposal and selection process of technical projects; management of project contracts; communication with government sponsors; chairing the USDC Technical Council; and all other activities involved with fulfilling the organization’s technical mission. 

Prior to this, Mark worked at Silicon Image, a video semiconductor manufacturer in a variety of technical marketing and business development roles, and at dpiX, a display and sensor company in similar roles. He is also a principal in Table Talk Consulting.

From 1992 to 1996, Mark worked in a variety of positions in Washington DC executing federal policy and managed projects on both semiconductor manufacturing and displays, at the Defense Advanced Research Projects Agency (DARPA) and the White House’s Office of Science and Technology Policy (OSTP).   Mark also previously held research and development positions at MIT Lincoln Labs and AT&T Bell Labs.

Mark is a graduate of MIT (B.S. and M.S.) and earned his doctoral degree at University of California at Berkeley, all in chemical engineering.  He has over 60 technical publications, 100 conference presentations and 4 issued patents.

 

 

 

 

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.