Message from the General Chair

Come join us in San Jose to celebrate the 40th Anniversary of IMAPS.  Our annual symposium will take place from November 11-15, 2007, at the San Jose Convention Center.  Your symposium team has brought together an excellent technical program coupled with an exhibition where we truly represent “everything between the chip and the system.”  You will also enjoy three Keynote presentations, a powerful GBC meeting and 18 Professional Development courses.

Ray Alexander,  Sarosh Patel and Andy Strandjord led a team of volunteers that compiled over 250 abstract submittals, reviewed all of them, and created a very strong technical program featuring 30 sessions that address 3D Packaging and High Density Substrates, Advanced Packaging Technologies, Design and Modeling, Electro-Static Protection, Underfill, Adhesives and Reliability, Pb-Free Solder Materials, Processes, and Reliability, RoHS, Flip-Chip Bumping, Flip Chip Reliability, Packaging for Extreme Environments, Package Reliability including new trends, Wirebonding, LTCC/Ceramic, Polymer, and Conductive Materials, and LED/SiC Packaging.  We will also have special focus sessions on: Biomedical, Military Applications, RF/Microwave, RF/Broadband and Consumer Electronics.  Similarly we will have system level packaging sessions that address:  System Packaging/Design, Power Delivery Techniques, EMI/Signal Integrity, Thermal Management, High Performance Interconnects and Boards, Sensor and MEMS Packaging and Emerging Technologies.  There are also two poster sessions that will be located in the Exhibit area.  Rounding out the technical program will be one Japanese translated session brought together by Fumio Miyashiro-san, and two Chinese translated sessions brought together by Randy Klein, John Zhang, and Ken Kuang. You do not want to miss out on the great learning experience you can have by attending the technical program.

Sponsorship is an integral part of such a large undertaking. Welcome Back to our platinum - NATEL, gold - Panasonic Factory Solutions, and silver - Hesse & Knipps sponsors. In addition, Heraeus has signed on as the 40th Anniversary Hospitality/Logo Caps sponsor and Sefar is repeating as the Lanyard sponsor. Thanks to all of our sponsors for their support. 

We have 3 keynote presentations: Stephen M. R. Covey, the author of the recently published “The Speed of Trust;” James R. Miller, Vice President, Product Operations for Cisco Systems; and Dongkai Shangguan, Vice President for Assembly Technology and Platform Realization for Flextronics.

Tom Green has brought together 18 Professional Development Courses including a 1st time course that focuses on the business side of selling. These courses are a great way to expand your personal knowledge base.

Our annual golf tournament will take place at the Coyote Creek Golf Club and offers not only a great day of fun on the golf course, but also supports our Microelectronics Foundation.

Paul and Amanda Van Loan have created a wonderful spouse/companion program with a one-day trip to the Monterey Aquarium, the city of Carmel and a ride down the “Seventeen Mile Drive.”  The 2nd day will feature a trip to the redwood country, Santa Cruz for lunch and the Bonny Doon Winery.

Another new activity this year involves having students from two local schools tour the Exhibit Hall to meet with our exhibitors. This will provide them with an educational experience and possibly launch them toward a career in microelectronics.

On top of all of this activity, we will also be celebrating the 40th Anniversary of IMAPS as a professional society.  Celebration activities are underway. 

Thank you and I look forward to seeing you there.

Greg Caswell
D2M Technologies
gcaswell@imaps.org

 

 

 

 

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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© IMAPS 2007. All Rights Reserved.

Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.