Program-at-a-Glance

Use the program grid below to quickly access information about IMAPS 2007. Most areas below are linked to the details for each item you are interested in. Or link directly to the Technical Program, PDCs, Poster Sessions, Program Grid (At-a-Glance), or GBC.

Sunday, November 11
9:00 am -
5:00 pm
5:00 pm -
6:00 pm
Professional Development Course Reception (Registrants and Instructors Only)
Sponsored by Panasonic
Monday, November 12
9:00 am -
5:00 pm
6:30 pm -
8:30 pm
40th Anniversary Celebration & Welcome Reception (All are invited)
Sponsored by Heraeus
 
RF, Automotive and Translated Track"
Systems/Design
Track
Materials Track
Signal Integrity Track
Reliability Track
Advanced Technologies Track
 
Tuesday, November 13
8:00 am -
10:45 am
 
10:00 am -
5:00 pm
11:00 am -
11:15 am
11:15 am -
11:45 am
11:45 am -
12:30 pm
Keynote Presentation
Mr. Stephen M.R. Covey, CoveyLink Worldwide
12:30 pm -
1:45 pm
Lunch Kiosks (Food not provided by IMAPS)
1:45 pm -
4:55 pm
 
Wednesday, November 14
8:00 am -
11:25 am
 
9:00 am -
5:00 pm
11:35 am -
12:30 pm
Keynote Presentation
Mr. James R. Miller, CISCO Systems, Inc.
12:30 pm -
1:30 pm
Lunch in the Exhibit Hall (Provided by IMAPS)
Sponsored by Heraeus
1:30 pm -
4:55 pm
5:15 pm -
6:50 pm
Global Business Council (GBC) Marketing Forum
(INCLUDED WITH YOUR FULL SYMPOSIUM REGISTRATION)
6:50 pm -
7:30 pm
Thursday, November 15
8:00 am -
8:45 am
Keynote Presentation
Dr. Dongkai Shangguan, Flextronics International
8:50 am -
12:00 pm
9:00 am -
12:00 pm
9:00 am -
12:00 pm
IMAPS 2008 Booth Selection in the Exhibit Hall
12:45 pm
Integrated/Embedded Passives Workshop Begins (visit www.imaps/passives, for more information.)

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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611 2nd St, NE - Washington, DC 20002 - 202-548-4001
© IMAPS 2007. All Rights Reserved.

Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.