Keynote Presentations

Mr. Stephen M.R. Covey (Tues.) | Mr. James R. Miller (Wed.) | Dr. Dongkai Shangguan (Thurs.)


Tuesday, November 13, 2007 - 11:45 am

Mr. Stephen M. R. Covey
CoveyLink Worldwide

Stephen M. R. Covey is a sought-after and compelling keynote speaker and advisor on trust, leadership, ethics, and high performance. He is also the founder and CEO of his own consulting firm.

Stephen M. R. Covey is author of The SPEED of Trust, a groundbreaking and paradigm-shifting book that challenges our age-old assumption that trust is merely a soft, social virtue. Instead, the book demonstrates that trust is a hard-edged, economic driver—a learnable and measurable skill that makes organizations more profitable, people more promotable, and relationships more energizing. Covey advocates that nothing is as fast as the speed of trust and that the ability to establish, grow, extend, and restore trust with all stakeholders is the critical leadership competency of the new global economy.


Covey passionately delivers his message and is dedicated to enabling individuals and organizations to reap the dividends of high trust. Audiences and organizations alike resonate with his informed, practical approach to real-time issues that affect their immediate and long-term performance.

Covey is the former CEO of the Covey Leadership Center, which, under his stewardship, became the largest leadership development company in the world. He personally led the strategy that propelled his father’s book, Dr. Stephen R. Covey’s The 7 Habits of Highly Effective People, to one of the two most influential business books of the 20th Century, according to CEO Magazine. A Harvard MBA, Stephen M. R. Covey joined the Covey Leadership Center as a Client Developer, became National Sales Manager, and finally President & CEO.

Under Covey’s direction, the company grew rapidly and profitably, achieving Inc. 500 status. As President & CEO, he nearly doubled revenues to over $110 million while increasing profits by 12 times. During that period, both customer and employee trust reached new highs and the company expanded throughout the world into over 40 countries. This greatly increased the value of the brand and company. The company was valued at only $2.4 million when Covey was named CEO, and, within three years, he grew shareholder value to $160 million in a merger he orchestrated with then-Franklin Quest to form FranklinCovey.

Over the years, Stephen Covey has gained considerable respect and influence with executives and leaders of Fortune 500 companies as well as with mid- and small-sized private sector and public sector organizations he’s consulted. Clients recognize his unique perspective on real-world organizational issues based on his practical experience as a former CEO.

Covey currently serves on the board/advisory board of several entities, including the Human Performance Institute—the leader in energy management technology—where he serves as Advisory Board Chairman.

Stephen M. R. Covey resides with his wife and children in the shadows of the Rocky Mountains.

Wednesday, November 14, 2007 - 11:35 am

Mr. James R. Miller
CISCO Systems, Inc.

Jim Miller is Vice President of Product Operations for Cisco’s worldwide manufacturing organization.  In this role, Miller is responsible for new product introduction (NPI) and product lifecycle management for Cisco’s software and hardware products.

Miller focuses his efforts in three areas:  the development of end-to-end supply product chains for introduction into high-volume manufacturing, the management of the product life cycle through all phases of manufacturing and driving NPI through the strategic implementation of Design for Assembly, Manufacturability, Testability and Reliability design techniques.


Additionally, Miller has responsibility for developing and operating Cisco’s software and appliance supply chain, and he is charged with the management of 3rd party licensed technology.

Prior to his current role, Miller was vice president of the Midrange Plant, where he had manufacturing responsibility for one-third of Cisco’s product revenue while simultaneously running Cisco’s Asian Operations.

Miller joined Cisco in January 2002 as vice president of Supply Chain and Logistics.  Before his tenure with Cisco, Miller served as’s vice president of Supply Chain, where he was responsible for the inception of’s supply chain organization and was a key contributor to Amazon’s rapid growth. Miller has also held key technical and production positions at IBM Corporation, Intel Corporation and Teledesic, a Seattle-based telecommunications startup.

Miller has a Bachelor of Science Degree in Aerospace Engineering from Purdue University and a Master of Science Degree in Mechanical Engineering from the Massachusetts Institute of Technology.  He additionally holds a Master of Science Degree in Management from the Sloan School of Management at the Massachusetts Institute of Technology where he was a “MIT Leaders for Manufacturing” Fellow.

Miller resides in San Jose with his wife and son.

Thursday, November 15, 2007 - 8:00 am

Dr. Dongkai Shangguan
Flextronics International

Dongkai received his BS degree in Mechanical Engineering from Tsinghua University, China, Ph.D. degree in Materials from the University of Oxford, U.K., and MBA degree from the San Jose State University.  He conducted post-doctoral teaching and research at the University of Cambridge and then at The University of Alabama.  He lectured at Wayne State University as Adjunct Faculty and is currently a guest professor at Shanghai University, China.


Dongkai worked for 10 years at Ford Motor Co. / Visteon Corporation in various technical and management functions including advanced electronics manufacturing and supplier quality, before he joined Flextronics International in 2001 where he is currently Vice President for Assembly Technology and Platform Realization with the Corporate Technology Group, responsible for assembly technology, environmental technology, design/manufacturing collaboration and DFX solutions, industrialization and product realization, etc.

Dongkai has published two books and over 200 papers and articles (including many journal publications and several book chapters), and has given numerous technical presentations and keynotes.  He has 20 U.S. and international patents issued and a number of U.S. and international patents pending.

Dongkai is a senior member of IEEE and SME, and a member of the IEEE CPMT Society Board of Governors.  He actively participates in professional organizations and consortia, and has chaired technical sessions and panels at numerous conferences.  He chaired the iNEMI 2007 Roadmap for Board Assembly.  He is currently a regular columnist for the Global SMT & Packaging magazine, and serves on the editorial/advisory board of several technical journals.  Dr. Shangguan is a Distinguished Lecturer for IEEE CPMT.

Dongkai has received a number of recognitions for his contributions to the industry, including the “President’s Award” from IPC, “Total Excellence in Electronics Manufacturing Award” from the Society of Manufacturing Engineers (SME), and the “Soldertec Lead-Free Soldering Award.”



Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host


Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor

Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
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Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.