Interactive Forums (Poster Sessions)

One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.
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WP7 - Wednesday, November 14, 2007, 1:30 pm - 4:55 pm
Interactive Forum I (Poster Session)

Chairs: Ron Barnett, Giga-Tronics, Inc.; Ray Alexander, Teradata, a division of NCR

Anisotropic Conductive Film with a Low Melting Point Solder
Yong-Sung Eom, Jong-Tae Moon, Electronics and Telecommunications Research Institute; Ji-Won Baek, Jae-Do Nam, SungKyunKwan University; Jong-Min Kim, ChungAng University

An Investigation of the Properties of New-Developed LTCC Materials for their use in UWB Application
Kazunari Watanabe, Yasuko Osaki, Katsuyoshi Nakayama, Kazuhiko Niwano, Fuminori Watanabe, Koji Ikawa, Asahi Glass Co., Ltd.

Self-Powered Microsystem with PVDF Based Microgenerator
Janicek Vladimir, Husak Miroslav, FEE CTU

Investigation of Advanced Via Plating Process for Via Interconnection Enhancement
Jung-Hwan Park, Joon-Sik Shin, Sang-Youp Lee, Ho-Sik Park, Keung-Jin Sohn, Samsung Electro-Mechanics Co., Ltd.

The Interactions of Geometric Periodicity and Lattice Mismatch on the Electromechanical Response of Piezoelectric Thin Films
B. Liu, A. Bhattacharyya, University of Arkansas at Little Rock

Examination of Thermal Via Design within LTCC Structures
T. Vincent, B. Pierce, M. Ehlert, Barry Industries

Lowering the Cost of Flip Chip Interconnections using a Single Chamber, Multi-Metal, Bump Plating Tool
Lee R. Levine, Steven Cho, Solomon Basame, Surfect Technologies, Inc.

Experimental Investigation of Vapor Chamber
Yuan-Chin Chiang, Chinese Culture University; Chiao-Hung Cheng, Yu-Wei Chang, Chun-Liang Lai, Sih-Lin Chen, National Taiwan University

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.