Technical Program

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Speaker/Presenter Information

We have brought together a Technical Program with 30 sessions and 200 presentations addressing all aspects of microelectronics packaging “between the chip and the system.”  We will also have two Interactive Poster sessions, 18 Professional Development Courses, 3 keynote presentations, a powerful Global Business Council meeting and a significant Student participation activity.  New challenges and opportunities to enhance our products have been presented with globalization being realized. This has helped in bringing about a paradigm shift in time-to-value for a myriad of our electronic products. To support the globalization focus a Japanese-to-English translated session, and, for the first time, two Chinese-to-English translated sessions have been included in the program track.

 

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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© IMAPS 2007. All Rights Reserved.

Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.