Speaker/Chair Information


Speaker Dates/Information:

  • Early registration and hotel reservation deadlines: October 10, 2007
  • Final Manuscripts Due: September 7, 2007
  • Poster Presenters are also required to submit a Final Manuscript
  • Technical Presentation Time: 20 minutes (15 to present; 5 for Q&A), unless otherwise stated
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to speaker breakfast on the morning of your session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

 

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host

 

Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor


Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.
Threerollmill.com

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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© IMAPS 2007. All Rights Reserved.

Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.