Student Program

We cordially encourage and invite you to attend the 40th International Symposium on Microelectronics (IMAPS 2007), which will be held at San Jose Convention Center, San Jose, California - USA on November 11 - 15, 2007.  We have exciting activities waiting for you.  The following program highlights the student activities offered throughout IMAPS 2007.

We are very pleased to inform you that IMAPS student members can enjoy the reduced symposium registration fee. In addition, IMAPS student members and chapter faculty advisors may be eligible for travel support as well.

Dr. Jianbiao “John” Pan, Cal Poly State University,
San Luis Obispo
IMAPS 2007 Student Activities Co-Chair

Best Student Paper Competition:  Student papers will be judged by a committee consisting of industry experts and university professors. The author(s) of the Best Student Paper selected will receive a cash reward and recognition in IMAPS’ Advancing Microelectronics magazine.

Student Industry Panel/Reception:  The Student Industry Panel gives students a chance to learn career development insights from top-level industry professionals.  Experts from the microelectronics industries and academics will describe and discuss how their education and career experiences led to their current positions.  Students will also learn current industry expectations and what they should be doing now for their long-term career development.  A reception will immediately follow where students will have the opportunity to network one-on-one with industry panelists and each other. Join us on Tuesday, November 13th, 3:30 pm to 5:30 pm.

Student Plant Tour:  This year we are excited that Flextronics Corporation, San Jose, CA, will host the student plant tour. Register on-line or by using the registration form on page 47, to be a part of the plant tour. A signed non-disclosure agreement is required to attend the tour. As a result of the recent Solectron acquisition, Flextronics has the broadest worldwide EMS capabilities, from design resources to end-to-end vertically integrated global supply chain services, which enhance its ability to design, build, and ship complete packaged products for its OEM customers. Operating in 35 countries, with a world-class workforce that includes approximately 3,500 design engineers, Flextronics annual revenue following the October 1st Solectron close now exceeds US$ 30 billion across seven well-diversified customer market segments and four major business units. For more information, visit Plant tour is scheduled for Wednesday, November 14th, 9:00 am to 12:00 noon. Tour site subject to change.

Student Chapter Booth Competition:  Each student chapter is encouraged to enter a booth and exhibit on the main floor. These booths are free to student chapters and allow chapters to demonstrate their activities to the microelectronics industry. Student officers at participating student chapters may be eligible for travel reimbursement. Booth judging will be on Tuesday, November 13th, 1:30 pm to 2:30 pm. Please contact Brian Schieman ( for more information or to reserve your booth. Plan to also attend the Student Chapter Meeting on Tuesday at 2:30 pm.

Professional Development Course (PDC) Monitor:  Students have the opportunity to serve as a PDC Monitor and attend the course free of charge. Monitors are assigned on a first-come basis. Sign up early to get the PDC of your choice by emailing Jackki Morris-Joyner ( with your top three choices no later than October 5th.

Employment Center:  The IMAPS Employment Center will provide you with information on employment opportunities and will be open Tuesday, November 13th - Thursday, November 15th.

Student/Faculty Travel Expenses:  In accordance with Section 15.10.2 of IMAPS Policy and Procedure Manual, a student whose paper is accepted for presentation as part of the regular Technical Session of the Annual IMAPS Symposium may be considered for reimbursement of expenses incurred in conjunction with travel and hotel accommodations only.  All other expenses, including meals and conference registration, remain the responsibility of the individual student.  All requests for travel reimbursement must be submitted a minimum of 30 days in advance of the Symposium and must be pre-approved by Elizabeth Keller at or 202-548-8716 prior to booking.  For complete guidelines on travel expense reimbursement, visit

Student / Exhibitor Interchange
IMAPS is pleased to announce an exciting new activity at this year’s 40th Anniversary Symposium. Students from Evergreen Valley High School, a prestigious high school in South San Jose, under the guidance of Angela Cornelius, the Associate Principal, will tour our Exhibition. Their activity will start with a short presentation on what it is like to work in the microelectronics field, presented by Ephraim Suhir. The students will also tour the exhibit hall, after which each student will be assigned to a specific exhibitor to learn more about what the company provides to our industry. Each student will then write a report on their experience and the two students with the best  write-ups will each receive an iPOD. It is IMAPS’ intent to involve the EVHS students in learning more about science and microelectronics in a very exciting, fun-filled and rewarding manner.

Platinum Sponsor:
NATEL - Platinum Sponsor
Gold Sponsor:
Panasonic Factory Solutions - Gold Sponsor
Silver Sponsor:
Hesse & Knipps - Silver Sponsor
40th Anniversary
Hospitality Sponsor:

Heraeus, Thick Film Div. - 40th Anniversary Hospitality Host


Event Sponsor - Keynote:
Cisco - Keynote Presentation Sponsor

Teledyne Microelectronics - Keynote Presentation Sponsor

Event Sponsor -
Speaker Gifts,
Memory Sticks:

Kingston Technology - Speaker Gifts, Memory Sticks

Event Sponsor - Lanyards:
Sefar - Event Sponsor, Lanyards
Event Sponsor - Cafe:
TT APSCO - Event Sponsor, IMAPS Cafe
Event Sponsor - Cafe:
PacTech - Event Sponsor, IMAPS Cafe

Event Sponsor - Cafe:
Kyocera - Event Sponsor, IMAPS Cafe

Event Sponsor - Bag Inserts:
Ticona Engineering Polymers - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Advanced Chemical Technology (ACT), Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Barry Industries, Inc. - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Chip Supply - Event Sponsor, Bag Inserts
Event Sponsor - Bag Inserts:
Gannon & Scott - Event Sponsor, Bag Inserts

Final Program Sponsor:
Indium Corporation - Final Program Sponsor

Golf Sponsors:
NXGen Electronics - Golf Sponsor
VIOX Corporation - Golf Sponsor
Ed Fagan, Inc. - Golf Sponsor

Emerson & Cuming - Golf Sponsor

GDSI - Golf Sponsor

Metalor - Golf Sponsor

SENTEC E&E - Golf Sponsor

Torrey Hills Technology, a G Tech Systems Group - Golf Sponsor
Torrey Hills Tech.

SPM - Golf Sponsor

Zentrix Technologies - Golf Sponsor

Media Sponsors:

Advanced Packaging - Media Sponsor

Global SMT & Packaging - Media Sponsor
Photonics Spectra - Media Sponsor

Chip Scale Review - Media Sponsor

Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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Organized by the International Microelectronics And Packaging Society (IMAPS)
611 2nd St, NE - Washington, DC 20002 - 202-548-4001
© IMAPS 2007. All Rights Reserved.

Unless otherwise noted, all photos courtesy of IMAPS.
Thin Si 2007 courtesy of Charles Banda, Lab for Physical Sciences & R. Wayne Johnson, Auburn University. Cell phone circa 1997 courtesy of Nokia. SMT Computer Module circa 1987 courtesy of Greg Caswell, VirTex Assembly Services. Hybrid Assembly circa 1977 courtesy of Bruce Romenesko, JHU/APL. Hybrid circa 1967 courtesy of Alan Hirschberg, Northrup Grumman.