IMAPS 2008 Homepage IMAPS 2008 Program-at-a-Glance IMAPS 2008 Exhibit Information IMAPS 2008 Registration Information IMAPS 2008 Hotel/Transportation Information IMAPS 2008 Activities IMAPS 2008 National Symposium Committee  

Image courtesy of Natel

Image courtesy of Panasonic Factory Solutions Company of America

Image courtesy of Hesse & Knipps

Images courtesy of:
Natel, Panasonic and Hesse & Knipps.

National Symposium Committee

A Special Thank you to this dedicated team of volunteers for helping assemble one of the strongest symposia IMAPS has experienced over the past 41 years!

Message from the General Chair | Message from the Technical Chairs

General Chair
Larry Rexing, Heraeus Inc. Thick Film Division

Technical Co-Chair
John Olenick, ENrG Incorporated

Technical Co-Chair
Ken Gilleo, ET-Trends LLC

Professional Development Course (PDC) Chair
Thomas Green, TJ Green Associates LLC

VP of Technology
Lee Levine, Process Solutions Consulting

Marketing Co-Chair
Michael Salloum, R&D Assembly, Inc.

Marketing Co-Chair
Jon Medernach, MRSI, A Newport Corporation Company

VP of Marketing and Membership
Laurie Roth, Consultant

Student Program Chair
Z. Joan Delalic, Temple University

Student Interface Co-Chair
Rita Mohanty, Speedline Technologies

Student Interface Co-Chair
Janet Lumpp, University of Kentucky

Local Liaison Chair
Jim King, RainDance Technologies, Inc.

Marketing Forum/GBC Co-Chair
Howard Imhof, Metalor Technologies USA

Marketing Forum/GBC Co-Chair
Greg Caswell, Reactive Nano Technologies, Inc. (RNT)

Foundation Golf Co-Chair
Howard Imhof, Metalor Technologies USA

Foundation Golf Co-Chair
Gary Hemphill, Technic, Inc.

Exhibit Co-Chair
Tania Keefe, Riv Inc. - Thick Film Screens

Exhibit Co-Chair
Leo Garvey, LFG Micro

David Virissimo, Semiconductor Packaging Materials

Companion Tour Co-Chair
Sue Bokil

Companion Tour Co-Chair
Judy Eicher

Joe McCabe, Epoxy Technology, Inc.

IMAPS President
Steven Adamson, Asymtek

IMAPS 2009 General Chair
Jeff Demmin, Tessera Inc.

IMAPS Executive Director
Michael O’Donoghue, IMAPS


Media Sponsors:


Advanced Packaging - Media Sponsor
Antennas Online - Media Sponsor
Chip Scale Review - Media Sponsor
Equipment Protection - Media Sponsor
Global SMT & Packaging - Media Sponsor
LED Journal - Media Sponsor
Photonics Spectra - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

Top of Page

Premier Sponsors:

Natel - Premier Sponsor, Platinum

Panasonic Factory Solutions - Premier Sponsor, Gold

Hesse & Knipps - Premier Sponsor, Silver

Contributing Sponsors:

Speaker/Chair Gifts, Session Notepads, Hotel Key Cards:Heraeus - Event Sponsor, Speaker/Chair Gifts, Session Notepads, Hotel Key Cards

Wireless Internet:
Metalor - Event Sponsor, Wireless Internet

Wireless Internet:
Umicore - Event Sponsor, Wireless Internet

Event Sponsors:

Sefar - Event Sponsor, Lanyards

Refreshment Breaks :Teledyne Microelectronics - Event Sponsor, Refreshment Breaks

Final Program:
Ticona Engineering Polymers - Final Program Sponsor

Final Program:Indium Corporation - Final Program Sponsor

Bag Inserts :

Reactive NanoTechnologies (RNT) - Event Sponsor, Bag Inserts

Golf Sponsors:

VIOX Corporation - Golf Sponsor

Technic - Golf Sponsor

Barry Industries - Golf Sponsor

Gannon & Scott - Golf Sponsor

Colt Refining - Golf Sponsor