


Images courtesy of:
Natel, Panasonic and Hesse & Knipps.
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2008 Exhibiting Companies
IMAPS 2008 exhibiting companies will have the opportunity
to impact the largest number of industry customers in one venue, introduce
new products and concepts to this highly competitive market, network to
enhance relationships with existing customers and be recognized as an industry
leader.
Reserve
your booth online before it's too late
Home | Exhibition
Information | Floorplan | 2007
Exhibitors
Here are the companies
that have already reserved exhibit space:
| COMPANY |
BOOTH NUMBER(S) |
|
Accumet Engineering Corp.
|
432 |
|
AdTech Ceramics
|
613 |
|
Advanced Chemical Company
|
216 |
|
Advanced Cooling Technologies
|
736 |
|
Advanced Packaging/SMT
|
808 |
|
AI Technology, Inc.
|
605 |
|
AIM Specialty Materials
|
205 |
|
Air-Vac Engineering Co.
|
807 |
|
ALLVIA, Inc.
|
603 |
|
American Beryllia Inc.
|
405 |
|
American Technical Ceramics
|
728 |
|
Ametek HCC
|
223 |
|
AMI/Presco
|
816 - 18 |
|
Anaren Mincrwavs, Inc.
|
106 |
|
ANCeram/IKTS
|
435 |
|
Ansoft Corp.
|
812 |
|
ARC Technologies
|
742 |
|
ASM Pacific
|
438 |
|
Asymtek
|
817 |
|
ASYS Inc.
|
805 |
|
Barry Industries, Inc.
|
312 |
|
BESI/Datacon
|
541 |
|
CAD Design Sofrware
|
617 |
|
Cal Poly State University
|
823 |
|
Central Semiconductor Corp.
|
429 |
|
Chip Scale Review
|
326 |
|
Chip Supply, Inc.
|
424 |
|
Cicorel SA
|
107 |
|
Cobehn Systems, Inc.
|
433 |
|
Coining, Inc.
|
423 |
|
Colt Refining, Inc.
|
535 |
|
Compex Corp.
|
722 |
|
CoorsTek, Inc.
|
624 & 723 |
|
Co-Planar, Inc.
|
502-04 |
|
CPS Technologies
|
122 |
|
Crane Aerospace & Electronics
|
222 |
|
Cyber Technologies USA
|
809 |
|
Dage Precision Industries, Inc.
|
304 |
|
Deweyl Tool Company, Inc.
|
317 |
|
DuPont Electronic Technologies
|
615 |
|
EFD, Inc.
|
201 |
|
Endicott Interconnect Technologies, Inc.
|
638 |
|
Epoxy Technology, Inc.
|
307 |
|
ES Components, Inc.
|
730 |
|
ESL ElectroScience
|
409-411 |
|
F&K Delvotec, Inc.
|
221 |
|
Farmingdale State College
|
825 |
|
Ferro Corporation
|
607-09 |
|
Ferro-Ceramic Grinding, Inc.
|
437 |
|
Finetech, Inc.
|
210 |
|
Florida International University
|
827 |
|
FRT of America, LLC
|
732 |
|
Fuji Film Electronic Material
|
332 |
|
Gannon & Scott
|
627 |
|
Geib Refining Corporation
|
311 |
|
General Metal Finishing Co., Inc.
|
734 |
|
Global SMT & Packaging
|
115-117 |
|
GPD Global, Inc.
|
119 |
|
Graphite Concepts, Inc.
|
425 |
|
Haiku Tech, Inc.
|
108 |
|
Harrop Industries, Inc.
|
426 |
|
HEI Inc.
|
105 |
|
Henkel (Emerson & Cuming)
|
711-13 |
|
Heraeus Thick Film Division
|
506-08 |
|
Heraeus-SMT
|
113 |
|
Hesse & Knipps
|
202 |
|
Hi-Rel Laboratories
|
530 |
|
Hybrid Circuit Works
|
641 |
|
Indium
|
302 |
|
Infinite Graphics, Inc.
|
637 |
|
Innovative Fabrication, Inc.
|
103 |
|
Insight SiP
|
439 |
|
Integra-Technologies, Inc.
|
330 |
|
Interconnect Systems, Inc.
|
821 |
|
International Manufacturing Services, Inc. (IMS)
|
214 |
|
Interplex Engineered Products
|
534 |
|
J-Tech Distributors USA, Ltd.
|
801 |
|
Kyocera America, Inc.
|
803 |
|
Kyzen Corp.
|
610 |
|
Laser Processing Technology, Inc.
|
813 |
|
Laser Services, Inc.
|
726 |
|
Laser Tech, Inc.
|
532 |
|
Laserod
|
633 |
|
LINTEC Corporation
|
427 |
|
Matrix Incorporated
|
431 |
|
Maxtek Components Corporation
|
306 |
|
Metachem Resins Corporation (Mereco)
|
635 |
|
Metallix Refining, Inc.
|
811 |
|
Micro Hybrid Dimensions, Inc.
|
611 |
|
MicroConnex Corporation
|
428 |
|
MicroFab Technologies, Inc.
|
542 |
|
Micropac Industries, Inc.
|
631 |
|
MicroScreen LLC
|
401 |
|
Micross Components Corp.
|
527 |
|
Midas Technology, Inc.
|
539 |
|
Minco Technology Labs., Inc.
|
717 |
|
Mini-Systems, Inc.
|
525 |
|
Miyachi Unitek - Benchmark Div.
|
323 |
|
Mundt & Associates, Inc.
|
430 |
|
Murata Power Solutions
|
442 |
|
NAMICS Technologies, Inc.
|
608 |
|
Natel Engineering Co., Inc.
|
402 island |
|
Newport Corporation
|
616-18 |
|
NorCom Systems, Inc.
|
614 |
|
NTK Technologies, Inc.
|
422 |
|
NxGen Electronics
|
316 |
|
Oerlikon ESEC USA, Inc.
|
101 |
|
Oneida Research Services, Inc.
|
716 |
|
Orthodyne Electronics
|
529--31 |
|
Pacific Aerospace & Electronics
|
536 |
|
Pacific Aerospace & Electronics
|
536 |
|
PacTech USA - Packaging Technologies, Inc.
|
102-04 |
|
Palomar Technologies, Inc.
|
322-24 |
|
Panasonic Factory Solutions Co. of America
|
602 |
|
Paricon Technologies Corp.
|
714 |
|
Perfection Products, Inc.
|
523 |
|
Photochemie AG
|
107 |
|
Photofabrication Engineering, Inc.
|
715 |
|
Photonics Media/Laurin Publishing
|
738 |
|
Polaris Electronics Corp.
|
537 |
|
Questech Services Corp.
|
814 |
|
Reactive Nano Technologies
|
528 |
|
Reinhardt Microtech AG
|
212 |
|
Reldan Metals, Co.
|
718 |
|
Remtec, Inc.
|
815 |
|
Riv, Inc. - Thick Film Screens
|
707 |
|
Rogers Corporation
|
708-10 |
|
Rohm and Haas Electronic Materials
|
441 |
|
Royce Instruments, Inc.
|
440 |
|
S.E.T.
|
639 |
|
SEFAR Printing Solutions, Inc.
|
510 |
|
Semi Dice, Inc.
|
318 |
|
Semiconductor Equipment Corp.
|
514 |
|
Semiconductor Packaging Materials (SPM)
|
308-10 |
|
Sikama International, Inc.
|
407 |
|
Silicon Cert, Ltd.
|
724 |
|
Sims Recycling Solutions
|
218 |
|
Sonoscan, Inc.
|
601 |
|
SST Internnational
|
421 |
|
Stellar Industries Corp.
|
702 |
|
Stellar Microelectronics Inc.
|
208 |
|
StratEdge Corporation
|
538 |
|
Superior Technical Ceramics
|
512 |
|
Systems and Technology Int'l Inc.
|
540 |
|
Taconic
|
712 |
|
Task Microelectronics
|
704 |
|
TDK Corporation of America
|
804-06 |
|
Technic, Inc.
|
403 |
|
Technical Materials, Inc.
|
203 |
|
Teledyne Microelectronics
|
516-18 |
|
Temple University
|
831 |
|
Ticona Engineering Polymers
|
802 |
|
Toray Engineering Co., Ltd.
|
612 |
|
Torrey Hills
|
415-417 |
|
Trebor Instrument Corp.
|
706 |
|
Tresky Corporation
|
740 |
|
Twilight Technology, Inc.
|
313 |
|
Umicore AG & Co. Kg
|
522 |
|
Unichem Industries, Inc.
|
124 |
|
University of Arkansas
|
833 |
|
University of Idaho
|
835 |
|
University of Kentucky
|
829 |
|
UTZ, LLC
|
810 |
|
VIOX Corporation
|
622 |
|
Viscom Inc
|
436 |
|
Vishay
|
111 |
|
Webcom Communications Corp.
|
Literature Table |
|
Weiss-Aug Co. Inc.
|
629 |
|
West-Bond, Inc.
|
315-317 |
|
Williams Advanced Materials
|
224 |
|
YESTech, Inc.
|
434 |
|
YXLON International Inc.
|
207 |
|
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