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IMAPS 2008
41st International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!
The call for paper for IMAPS 2008 has closed. We are currently finalizing the technical program and should have the program published to this site around late-May or early-June. Please continue to check back for program details.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions about the technical program.
The 41st International Symposium on Microelectronics will be held at the Rhode Island Convention Center, Providence, Rhode Island – USA and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The 41st Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Sessions are tentatively planned to highlight the major contributions of the work in each these four areas of concentration.
General Chair:
Larry Rexing, Heraeus Inc. - TFD
larry.rexing@heraeus.com
Technical Program Co-Chair:
John Olenick
ENrG Inc.
JOlenick@ENrG-Inc.com |
Technical Program Co-Chair:
Ken Gilleo
ET-Trends LLC
ken@et-trends.com |
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Bringing Together the Entire
Microelectronics Supply Chain!
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Planned
Sessions Include:
| Industry “Focused” |
• Biomedical
• Telecom Packaging and Optoelectronics
• Military Applications
• Consumer Electronics
• Automotive Electronics
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| Systems Packaging/Applications/Design |
• EMI/Signal Integrity/Electrical Modeling
• Thermal and Power Management
• Manufacturing, Outsourcing and Quality Assessment
• High Performance Interconnects and Boards
• MEMS and Sensors
• Emerging Technologies
• Microwave & RF Applications
• Design and Modeling |
Translated
(Invited Speakers Only) |
• Japanese (Japanese
to English translation)
• Chinese (Chinese to English translation) |
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| Advanced
Processing and Materials |
• 3D Packaging and High Density Substrates
• Electro-Static Protection
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Flip-Chip and Bumping: Processes, Reliability
• Packaging for Extreme Environments
• Package Reliability
• Wirebonding and Stud Bumping
• Ceramic, LTCC, Polymer, and Conductive Materials
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials
• Advanced Packaging
• Packaging Technologies
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| Interactive Poster Session |
Outstanding papers that
do not fit in planned or created
sessions will be considered for this interactive session. |
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Abstract notifications will be emailed on May 23, 2008
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions about the technical program. Please contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717 if you have questions about the exhibition.
Hotel Information:
Housing for IMAPS 2008 is now open and making hotel reservations has never been easier. Make your reservations as early as possible. The IMAPS 2008 room block will sell out quickly!
Book On-line:
Visit http://event.expobook.com/?eventid=136 to book your IMAPS 2008 hotel reservations today!
Book by Phone, Email or Fax:
If you prefer, you may also contact the housing bureau directly with hotel questions or to make reservations::
IMAPS 2008 Housing Office
c/o EXPOVISION
3141 Fairview Park Drive, Suite 550
Falls Church, VA 22042
PHONE: (866) 766-0910 or (703) 770-3919
FAX: (703) 205-0235
Speaker Dates/Information:
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Abstract(s) due to IMAPS: April 25, 2008
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Speaker Notification/Confirmation emailed: May 23, 2008
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Final Manuscripts (papers) due: September 5, 2008
- Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 25 minutes (20 to present; 5 for Q&A)
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