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Image courtesy of Natel

Image courtesy of Panasonic Factory Solutions Company of America

Image courtesy of Hesse & Knipps

Images courtesy of:
Natel, Panasonic and Hesse & Knipps.

Message From The Technical Chairs


John Olenick

We would like to welcome you to IMAPS 2008 in Providence, Rhode Island, within the Ocean State where you’ll be able to enjoy close proximity to world class beaches, first class seafood restaurants in the downtown area, and the cultural diversity of New England.

Forty-one years ago in May of 1967, the world’s first videogames - as we know them today - made their quiet, humble entrance into the world. It was the same year that IMAPS came into existence. Reflecting back, and as we celebrate IMAPS’ 41st anniversary, both video games and IMAPS have endured the test of time and flourished.

Ken Gilleo

We have brought together a Technical Program with 32 sessions and over 200 presentations addressing all aspects of microelectronics packaging “between the chip and the system.”  We will also have an Interactive Poster session, 19 Professional Development Courses, 2 keynote presentations, a powerful Global Business Council meeting, significant Student participation activities, and an Alternative Energy panel on November 5th.  New challenges and opportunities to enhance our products have been presented with globalization being realized.  This has helped in bringing about a paradigm shift in time-to-value for a myriad of our electronic products. To support the globalization focus, Chinese-to-English and Japanese-to-English translated sessions have been included in the program track.

IMAPS 2008 in Providence promises to be an excellent technical program, with special focus sessions addressing issues that are pertinent to our industry today:  Automotive Electronics, Biomedical Electronics, Consumer Electronics, Military Applications and Telecom Packaging & Optoelectronics.  Besides the previously mentioned Japanese and Chinese translated sessions and interactive poster session, the program contains full sessions on Advanced Materials, Advanced Packaging, Thermal Management, Electrical Modeling and Design, Ceramic, LTCC, Polymer and Conductive Materials, Embedded and Integrated Passives, High Performance Interconnects and Boards, Microwave and RF Applications, Packaging for Extreme Environments, Packaging Process Technologies, two sessions on Pb-Free Solder Materials, RoHS, and Reliability, two sessions on Package Reliability, 3D Packaging and High Density Substrates, Design and Modeling,  MEMS and Sensors, Flip Chip Processes and Flip Chip Reliability, Emerging Technologies, Underfills, Encapsulants and Adhesives, Wafer Level Packaging/CSP, Manufacturing Outsourcing and Quality Assessment, and finally Wirebonding and Stud Bumping.  The highly successful Global Business Council program, which will be held on Wednesday, November 5th, is comprised of presentations that address the “business” side of our society.  A panel discussion on Alternative Energy is also planned prior to the GBC program.

One of the great aspects of attending a technical program of this nature is the ability you will have to meet and converse with folks from all over the world.  IMAPS, a truly international society, will have speakers from a multitude of countries, and attendees from Europe, the Pacific Rim, and the Americas, providing you, the attendee, with an incredible opportunity to network.

We would like to thank the IMAPS Technical Committee for an outstanding job of reviewing abstracts and creating sessions.  Thanks of course also go out to Lee Levine, IMAPS’ Vice President of Technology, and Larry Rexing, 2008 General Chair, for their help in streamlining the process for reviewing, selecting, and organizing sessions.  We would also like to thank our Session Champions and Chairs who have been instrumental in identifying experts in their fields and soliciting abstracts. Finally, none of this could happen without the invaluable help from our IMAPS staff.

As technical co-chairs we are excited about the impact this powerful technical program will have on our society members and their respective businesses.

Hope to see you in Providence.

John Olenick
ENrG Inc.
JOlenick@ENrG-Inc.com
Ken Gilleo
ET-Trends LLC
Ken@ET-Trends.com

 


Media Sponsors:

 

Advanced Packaging - Media Sponsor
Antennas Online - Media Sponsor
Chip Scale Review - Media Sponsor
Equipment Protection - Media Sponsor
Global SMT & Packaging - Media Sponsor
LED Journal - Media Sponsor
Photonics Spectra - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

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Premier Sponsors:

Natel - Premier Sponsor, Platinum

Panasonic Factory Solutions - Premier Sponsor, Gold

Hesse & Knipps - Premier Sponsor, Silver


Contributing Sponsors:

Speaker/Chair Gifts, Session Notepads, Hotel Key Cards:Heraeus - Event Sponsor, Speaker/Chair Gifts, Session Notepads, Hotel Key Cards

Wireless Internet:
Metalor - Event Sponsor, Wireless Internet

Wireless Internet:
Umicore - Event Sponsor, Wireless Internet


Event Sponsors:

Lanyards:
Sefar - Event Sponsor, Lanyards

Refreshment Breaks :Teledyne Microelectronics - Event Sponsor, Refreshment Breaks

Final Program:
Ticona Engineering Polymers - Final Program Sponsor

Final Program:Indium Corporation - Final Program Sponsor

Bag Inserts :

Reactive NanoTechnologies (RNT) - Event Sponsor, Bag Inserts


Golf Sponsors:

VIOX Corporation - Golf Sponsor

Technic - Golf Sponsor

Barry Industries - Golf Sponsor

Gannon & Scott - Golf Sponsor

Colt Refining - Golf Sponsor