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Image courtesy of Natel

Image courtesy of Panasonic Factory Solutions Company of America

Image courtesy of Hesse & Knipps

Images courtesy of:
Natel, Panasonic and Hesse & Knipps.

Translated Track (Chinese to English and Japanese to English)

Tuesday, November 4, 2008
Morning Session: 8:00 AM - 11:10 AM

TA4 - Microelectronics Packaging in China (Chinese to English Translation)
Chairs: Randy Klein, WC Heraeus – HMTS; Charles Luo, Heraeus Materials Technology Shanghai Ltd.
Session cancelled on October 20 due to visa rejections

Tuesday, November 4, 2008
Afternoon Session: 1:50 PM - 5:40 PM

Technology Drivers Trends of High Density Packaging for Mobile Electronics (Japanese to English Translation)
Chairs: Kishio Yokouchi, FUJITSU Interconnect Technologies LTD.; Jim Drehle, Robert Lloyd & Associates

The ultra high density packaging technologies for mobile equipment have been achieving a remarkable breakthrough in Japanese industry-wide trend. In this session, High density substrate and assembly reliability will be discussed, regarding 3D, Ultra Thin Packaging for notebook PC and cell phones.

Recent Advance on Board-Level Optical Interconnection (50 mins)
Osamu Mikami, Tokai University

Ultra Thin Packaging Technology for Cell Phones
Takaaki Yoshihiro, NEC Corporation

Packaging Technology for Recent Notebook PCs
Ryo Kanai, Fujitsu Advanced Technologies Limited

Study of Stress to Solder Joint by Underfill Filling
Akira Tanaka, Toshiba Corporation Personal Computer & Network Company

High Reliable Resin Core Bump Technology for 20um Pitch COG (Chip on Glass) Interconnection
Haruki Ito, SEIKO EPSON Corporation

Media Sponsors:


Advanced Packaging - Media Sponsor
Antennas Online - Media Sponsor
Chip Scale Review - Media Sponsor
Equipment Protection - Media Sponsor
Global SMT & Packaging - Media Sponsor
LED Journal - Media Sponsor
Photonics Spectra - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor

Top of Page

Premier Sponsors:

Natel - Premier Sponsor, Platinum

Panasonic Factory Solutions - Premier Sponsor, Gold

Hesse & Knipps - Premier Sponsor, Silver

Contributing Sponsors:

Speaker/Chair Gifts, Session Notepads, Hotel Key Cards:Heraeus - Event Sponsor, Speaker/Chair Gifts, Session Notepads, Hotel Key Cards

Wireless Internet:
Metalor - Event Sponsor, Wireless Internet

Wireless Internet:
Umicore - Event Sponsor, Wireless Internet

Event Sponsors:

Sefar - Event Sponsor, Lanyards

Refreshment Breaks :Teledyne Microelectronics - Event Sponsor, Refreshment Breaks

Final Program:
Ticona Engineering Polymers - Final Program Sponsor

Final Program:Indium Corporation - Final Program Sponsor

Bag Inserts :

Reactive NanoTechnologies (RNT) - Event Sponsor, Bag Inserts

Golf Sponsors:

VIOX Corporation - Golf Sponsor

Technic - Golf Sponsor

Barry Industries - Golf Sponsor

Gannon & Scott - Golf Sponsor

Colt Refining - Golf Sponsor