IMAPS 2009 - 42 International Symposium on Microelectronics - San Jose, CA  
IMAPS 2009 Homepage IMAPS 2009 Program-at-a-Glance IMAPS 2009 Exhibit Information IMAPS 2009 Registration Information IMAPS 2009 Hotel/Transportation Information IMAPS 2009 Activities IMAPS 2009 National Symposium Committee  

Images courtesy of:
Natel, Hesse & Knipps, and the San Jose Convention and Visitor Bureau.

   Platinum Premier Sponsor:

   Gold Premier Sponsor:    Silver Premier Sponsor:

   Presidential Sponsor:

Natel - Premier Sponsor, Platinum
Hesse & Knipps - Premier Sponsor, Gold
Heraeus Thick Film Division - Premier Sponsor, Gold
Metalor - Presidential Sponsor

National Symposium Committee

A Special Thank you to this dedicated team of volunteers for helping assemble one of the strongest symposia IMAPS has experienced over the years!

Message from the General Chair | Message from the Technical Chairs

General Chair
Jeff Demmin, Tessera Inc.

Technical Chair
Jie Xue, Cisco Systems, Inc.

Technical Co-Chair
Mark Hoffmeyer, IBM Corporation

Technical Co-Chair
Ricky Lee, Hong Kong University of Science and Technology

Professional Development Course Chair
Thomas Green, TJ Green Associates LLC

Marketing Chair
Mariel Stoops, NTK Technologies, Inc.

VP of Technology
Lee Levine, Process Solutions Consulting

VP of Marketing and Membership
Laurie Roth, Laurie S. Roth Marketing

Student Activities Chair
Jianbiao (John) Pan, California
Polytechnic State University

Local Liaison / High School Chair
Anwar Mohammed, Infineon

Marketing Forum / GBC Chair
Greg Caswell, Reactive NanoTechnologies Inc. (RNT)

Foundation Golf Chair
Roger Underwood, CCT Laser Services

Foundation Golf Co-Chair
Julius Chew, Infineon Technologies

IMAPS President
Delip (Doug) Bokil, Namark Process Design LLC

IMAPS President-Elect
Howard Imhof, Metalor Technologies USA

IMAPS Past President
Steve Adamson, Asymtek

IMAPS Treasurer
David Virissimo, SPM

IMAPS 2010 General Chair
David Seeger, Semiconductor Research Corporation

IMAPS Executive Director
Michael O’Donoghue, IMAPS


Media Sponsors:
3D InCites - Media Sponsor
Advanced Packaging - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Semiconductor International - Media Sponsor
SolidState Technology - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor

International Microelectronics And Packaging Society - IMAPS |