IMAPS 2009 - 42 International Symposium on Microelectronics - San Jose, CA  
 
IMAPS 2009 Homepage IMAPS 2009 Program-at-a-Glance IMAPS 2009 Exhibit Information IMAPS 2009 Registration Information IMAPS 2009 Hotel/Transportation Information IMAPS 2009 Activities IMAPS 2009 National Symposium Committee  
 
 

Images courtesy of:
Natel, Hesse & Knipps, and the San Jose Convention and Visitor Bureau.

   Platinum Premier Sponsor:

   Gold Premier Sponsor:    Silver Premier Sponsor:

   Presidential Sponsor:

Natel - Premier Sponsor, Platinum
Hesse & Knipps - Premier Sponsor, Gold
Heraeus Thick Film Division - Premier Sponsor, Gold
Metalor - Presidential Sponsor


2009 Exhibiting Companies


IMAPS 2009 exhibiting companies will have the opportunity to impact the largest number of industry customers in one venue, introduce new products and concepts to this highly competitive market, network to enhance relationships with existing customers and be recognized as an industry leader.

Reserve your booth online before it's too late
Home | Exhibition Information | Floorplan | 2008 Exhibitors

Here are the companies that have already reserved exhibit space:

COMPANY BOOTH NUMBER(S)
Accumet Engineering Corp. 1123 
Accu-Tech Laser Processing, Inc. 420 
AdTech Ceramics 1110 
Advanced Packaging/SMT 312 
AI Technology, Inc. 812 
Air-Vac Engineering Co. 929 
All Flex Flexible Circuits 832 
ALLVIA 821 
Amtech Microelectronics, Inc. 530 
Asahi Glass Company 513 
ASM Pacific 520 
Azimuth Electronics, Inc. 416 
BE Semiconductor Industries NV 532-34 
Blue Oceans LLC 526 
CAD Design Software 904 
Chapter Booth - Northern California Chapter 1131 
Chapter Booth - Purdue University 1033 
Chapter Booth - Temple University 1034 
Chapter Booth - University of Arkansas 1032 
Chapter Booth - University of Idaho 932 
Chapter Booth - University of South Florida 1031 
Chip Supply 630 
Cicorel SA 823 
Coining, Inc. 629 
Co-Planar, Inc. 609-11 
CPS Technologies 1016 
Crane Aerospace & Electronics 516 
Cyber-Technologies 824 
Dage Precision Industries, Inc. 814 
Deweyl Tool Company, Inc. 512 
DPA Components International 430 
DuPont Electronic Technologies 615 
EFD, Inc. 509 
Epoxy Technology, Inc. 902 
ES Components 521 
ESL ElectroScience 819 
F & K Delvotec, Inc. 1025 
Ferro Electronic Material Systems 724-26 
Finetech, Inc. 515 
Flex Interconnect Technologies 632 
FRT of America, LLC 529 
Geib Refining Corporation 906 
Haiku Tech, Inc. 1115 
Harrop Industries, Inc. 731 
Henkel Electronics 829-31 
Heraeus Thick Film Division 710-12 
Heraeus-SMT 714 
Hesse & Knipps 612 
Hi-Rel Laboratories 924 
Indium Corporation 816 
Infinite Graphics, Inc. 1121 
INTA Technologies 631 
Integra Technologies 525 
Interconnect Systems, Inc. 1133 
Interplex Engineered Products, Inc. 1014 
Kyocera America, Inc. 514 
Kyzen Corp. 1022 
Laser Tech, Inc. 522 
Lintec Corp. 1023 
MAIREC Edelmetallgesellschaft GmbH 414 
Matech 732 
Metallix Refining, Inc. 822 
MicroConnex Corporation 1013 
Micropac Industries, Inc. 1129 
MicroScreen LLC 810 
Micross Components Corp. 1021 
Minco Technology 926 
Mini-Systems, Inc. 613 
Multek Flexible Circuits Inc 931 
Mundt & Associates, Inc. 912 
Murakami Co., Ltd. 923 
NAMICS Technologies, Inc. 510 
NanoDynamics 411 
nanosystec, GmbH 524 
NATEL 804 
Newport Corporation 1109 
NorCom Systems, Inc. 811 
NTK 1020 
NuSil Technology 909 
Orthodyne Electronics 921 
Pac Tech USA 1125 
Pacific Aerospace & Electronics 1215 
Palomar Technologies, Inc. 410 
Panasonic Factory Solutions Company 730 
Perfection Products, Inc. 913 
Photochemie AG 823 
Precision Ferrites and Ceramic, Inc. (PFC) 1005 
Quik-Pak 1211 
Reinhardt Microtech AG 825 
Reldan Metals, Co. 519 
Riv, Inc. 729 
Rogers Corporation 1024-26 
Royce Instruments, Inc. 821 
SEFAR Printing Solutions, Inc. 1010 
Semi Dice, Inc. 1111 
Semiconductor Equipment Corp. 720 
Semiconductor Packaging Materials (SPM) 1014 
SET 930 
Sierra Circuits, Inc. 914 
Sikama International, Inc. 623 
Sims Recycling Solutions 326 
SMT/ Advanced Packaging Magazine 312 
Sonoscan, Inc. 809 
SST International 619-21 
Stellar Industries Corp. 413 
Stellar Microelectronics Inc. 625 
Superior Technical Ceramics 631 
Taconic 1112 
Tango Systems, Inc. 1029 
TDK Corporation of America 1209 
Technic, Inc. 722 
Teledyne Microelectronics 920-22 
Toray Engineering Co., Ltd. 314 
Torrey Hills Technogies LLC 716 
Towa Corporation 523 
Trebor Instrument Corp. 1012 
Tresky Corporation 830 
Unichem Industries, Inc. 1119 
VIOX Corporation 1019 
West-Bond, Inc. 813-15 
Williams Advanced Materials 1030 
YESTech, Inc. 1116 
YXLON International, Inc. 412 

 


Media Sponsors:
3D InCites - Media Sponsor
Advanced Packaging - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Semiconductor International - Media Sponsor
SolidState Technology - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor
   


International Microelectronics And Packaging Society - IMAPS
www.imaps.org | imaps@imaps.org
1-202-548-4001