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Images courtesy of:
Natel, Hesse & Knipps, and the San Jose Convention and Visitor Bureau. |
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2009 Exhibiting Companies
IMAPS 2009 exhibiting companies will have the opportunity
to impact the largest number of industry customers in one venue, introduce
new products and concepts to this highly competitive market, network to
enhance relationships with existing customers and be recognized as an industry
leader.
Reserve
your booth online before it's too late
Home | Exhibition
Information | Floorplan | 2008
Exhibitors
Here are the companies
that have already reserved exhibit space:
| COMPANY |
BOOTH NUMBER(S) |
|
Accumet Engineering Corp.
|
1123 |
|
Accu-Tech Laser Processing, Inc.
|
420 |
|
AdTech Ceramics
|
1110 |
|
Advanced Packaging/SMT
|
312 |
|
AI Technology, Inc.
|
812 |
|
Air-Vac Engineering Co.
|
929 |
|
All Flex Flexible Circuits
|
832 |
|
ALLVIA
|
821 |
|
Amtech Microelectronics, Inc.
|
530 |
|
Asahi Glass Company
|
513 |
|
ASM Pacific
|
520 |
|
Azimuth Electronics, Inc.
|
416 |
|
BE Semiconductor Industries NV
|
532-34 |
|
Blue Oceans LLC
|
526 |
|
CAD Design Software
|
904 |
|
Chapter Booth - Northern California Chapter
|
1131 |
|
Chapter Booth - Purdue University
|
1033 |
|
Chapter Booth - Temple University
|
1034 |
|
Chapter Booth - University of Arkansas
|
1032 |
|
Chapter Booth - University of Idaho
|
932 |
|
Chapter Booth - University of South Florida
|
1031 |
|
Chip Supply
|
630 |
|
Cicorel SA
|
823 |
|
Coining, Inc.
|
629 |
|
Co-Planar, Inc.
|
609-11 |
|
CPS Technologies
|
1016 |
|
Crane Aerospace & Electronics
|
516 |
|
Cyber-Technologies
|
824 |
|
Dage Precision Industries, Inc.
|
814 |
|
Deweyl Tool Company, Inc.
|
512 |
|
DPA Components International
|
430 |
|
DuPont Electronic Technologies
|
615 |
|
EFD, Inc.
|
509 |
|
Epoxy Technology, Inc.
|
902 |
|
ES Components
|
521 |
|
ESL ElectroScience
|
819 |
|
F & K Delvotec, Inc.
|
1025 |
|
Ferro Electronic Material Systems
|
724-26 |
|
Finetech, Inc.
|
515 |
|
Flex Interconnect Technologies
|
632 |
|
FRT of America, LLC
|
529 |
|
Geib Refining Corporation
|
906 |
|
Haiku Tech, Inc.
|
1115 |
|
Harrop Industries, Inc.
|
731 |
|
Henkel Electronics
|
829-31 |
|
Heraeus Thick Film Division
|
710-12 |
|
Heraeus-SMT
|
714 |
|
Hesse & Knipps
|
612 |
|
Hi-Rel Laboratories
|
924 |
|
Indium Corporation
|
816 |
|
Infinite Graphics, Inc.
|
1121 |
|
INTA Technologies
|
631 |
|
Integra Technologies
|
525 |
|
Interconnect Systems, Inc.
|
1133 |
|
Interplex Engineered Products, Inc.
|
1014 |
|
Kyocera America, Inc.
|
514 |
|
Kyzen Corp.
|
1022 |
|
Laser Tech, Inc.
|
522 |
|
Lintec Corp.
|
1023 |
|
MAIREC Edelmetallgesellschaft GmbH
|
414 |
|
Matech
|
732 |
|
Metallix Refining, Inc.
|
822 |
|
MicroConnex Corporation
|
1013 |
|
Micropac Industries, Inc.
|
1129 |
|
MicroScreen LLC
|
810 |
|
Micross Components Corp.
|
1021 |
|
Minco Technology
|
926 |
|
Mini-Systems, Inc.
|
613 |
|
Multek Flexible Circuits Inc
|
931 |
|
Mundt & Associates, Inc.
|
912 |
|
Murakami Co., Ltd.
|
923 |
|
NAMICS Technologies, Inc.
|
510 |
|
NanoDynamics
|
411 |
|
nanosystec, GmbH
|
524 |
|
NATEL
|
804 |
|
Newport Corporation
|
1109 |
|
NorCom Systems, Inc.
|
811 |
|
NTK
|
1020 |
|
NuSil Technology
|
909 |
|
Orthodyne Electronics
|
921 |
|
Pac Tech USA
|
1125 |
|
Pacific Aerospace & Electronics
|
1215 |
|
Palomar Technologies, Inc.
|
410 |
|
Panasonic Factory Solutions Company
|
730 |
|
Perfection Products, Inc.
|
913 |
|
Photochemie AG
|
823 |
|
Precision Ferrites and Ceramic, Inc. (PFC)
|
1005 |
|
Quik-Pak
|
1211 |
|
Reinhardt Microtech AG
|
825 |
|
Reldan Metals, Co.
|
519 |
|
Riv, Inc.
|
729 |
|
Rogers Corporation
|
1024-26 |
|
Royce Instruments, Inc.
|
821 |
|
SEFAR Printing Solutions, Inc.
|
1010 |
|
Semi Dice, Inc.
|
1111 |
|
Semiconductor Equipment Corp.
|
720 |
|
Semiconductor Packaging Materials (SPM)
|
1014 |
|
SET
|
930 |
|
Sierra Circuits, Inc.
|
914 |
|
Sikama International, Inc.
|
623 |
|
Sims Recycling Solutions
|
326 |
|
SMT/ Advanced Packaging Magazine
|
312 |
|
Sonoscan, Inc.
|
809 |
|
SST International
|
619-21 |
|
Stellar Industries Corp.
|
413 |
|
Stellar Microelectronics Inc.
|
625 |
|
Superior Technical Ceramics
|
631 |
|
Taconic
|
1112 |
|
Tango Systems, Inc.
|
1029 |
|
TDK Corporation of America
|
1209 |
|
Technic, Inc.
|
722 |
|
Teledyne Microelectronics
|
920-22 |
|
Toray Engineering Co., Ltd.
|
314 |
|
Torrey Hills Technogies LLC
|
716 |
|
Towa Corporation
|
523 |
|
Trebor Instrument Corp.
|
1012 |
|
Tresky Corporation
|
830 |
|
Unichem Industries, Inc.
|
1119 |
|
VIOX Corporation
|
1019 |
|
West-Bond, Inc.
|
813-15 |
|
Williams Advanced Materials
|
1030 |
|
YESTech, Inc.
|
1116 |
|
YXLON International, Inc.
|
412 |
|
Media Sponsors:
|
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International Microelectronics And Packaging Society - IMAPS
www.imaps.org | imaps@imaps.org
1-202-548-4001
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