IMAPS 2009 - 42 International Symposium on Microelectronics - San Jose, CA  
 
IMAPS 2009 Homepage IMAPS 2009 Program-at-a-Glance IMAPS 2009 Exhibit Information IMAPS 2009 Registration Information IMAPS 2009 Hotel/Transportation Information IMAPS 2009 Activities IMAPS 2009 National Symposium Committee  
 
 

Images courtesy of:
Natel, Hesse & Knipps, and the San Jose Convention and Visitor Bureau.

   Platinum Premier Sponsor:

   Gold Premier Sponsor:    Silver Premier Sponsor:

   Presidential Sponsor:

Natel - Premier Sponsor, Platinum
Hesse & Knipps - Premier Sponsor, Gold
Heraeus Thick Film Division - Premier Sponsor, Gold
Metalor - Presidential Sponsor


Message From The General Chair


General Chair, Jeff Demmin

Greetings fellow IMAPS members!

As you can see in the Advance Program for the 42nd Annual International Symposium on Microelectronics, the IMAPS crew and many dedicated volunteers have put together another excellent program.  Please join us November 1 - 5, 2009 at the San Jose McEnery Convention Center.

I am honored to be serving as General Chair for IMAPS 2009.  It has been a great experience to see how it all comes together.  I can’t say enough about the effort put in by the organizing committee, especially when everyone is as busy as ever in today’s business environment.  Please take a look at the full committee list on page 4, so you know who to thank!


The highlights for this year’s event include:

  • A tremendous technical program with 27 sessions, including excellent coverage of 3D Packaging, Thermal Management, Pb-Free Issues, MEMS Packaging, and Reliability Testing.
  • Keynote talks by IBM Fellow and Vice President, Dr. Bradley McCredie, an expert in high-performance packaging and system design; and Dr. Paul Franzon, a Distinguished Alumni Professor at North Carolina State University who will speak on 3D Integration.
  • A line-up of 15 Professional Development Courses providing the chance to brush up on your knowledge or move up the learning curve in a new area.
  • The IMAPS Global Business Council Forum, featuring two talks on “The Recovery of the Semiconductor Market” by leading industry analysts.
  • Extensive student participation, with cash awards for the two best student papers.
  • Over 100 exhibitors providing updates on their products and services.
  • A career center for anyone in the market for a new opportunity.
  • A program for college students that includes a visit to Cisco Systems to see how their TelePresence system works.
  • A program with two local high schools, giving students a chance to see what the microelectronics industry is all about.
  • A great golf tournament at Cinnabar Hills, to help us on the “all work and no play” front.
  • The Monday evening Welcome Reception to kick the symposium off in style.

An event like IMAPS 2009 would not be possible without the support of our sponsors, so I’d like to thank them and highlight NATEL, Hesse & Knipps Semiconductor Equipment and Heraeus as our Premier Sponsors; along with Metalor as our Presidential Sponsor.

We know that everyone has faced unprecedented challenges in 2009 because of the economy and the resulting transformation of many parts of our industry.  It would be easy to decide to save a bit of money and skip the IMAPS symposium this year, but I strongly encourage you NOT to make that compromise.  In today’s world especially, it’s more important than ever to take advantage of what the symposium has to offer.  Keeping up to date on the latest technology is critical to find new applications for your products or new players in your supply chain.  Networking with colleagues is invaluable these days, with information and connections often being the most useful commodities in the marketplace.  And this year in particular, the Silicon Valley location provides a very high density of people, companies, and opportunities to learn.

With the economic indicators showing signs of a recovery, don’t miss this year’s single best chance to get up to speed on what’s going on in the microelectronics world.  Don’t be left out of the upcoming boom!

See you in San Jose.

Jeff Demmin
Tessera Inc.

jdemmin@tessera.com

 


Media Sponsors:
3D InCites - Media Sponsor
Advanced Packaging - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Semiconductor International - Media Sponsor
SolidState Technology - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor
   


International Microelectronics And Packaging Society - IMAPS
www.imaps.org | imaps@imaps.org
1-202-548-4001