IMAPS 2009 - Program-at-a-Glance

IMAPS 2009 - 42 International Symposium on Microelectronics - San Jose, CA

Images courtesy of:
Natel, Hesse & Knipps, and the San Jose Convention and Visitor Bureau.

Platinum Premier Sponsor:	Gold Premier Sponsor:	Silver Premier Sponsor:	Presidential Sponsor:

Program-at-a-Glance

Use the program grid below to quickly access information about IMAPS 2009. Most areas below are linked to the details for each item you are interested in. Or link directly to the Technical Program, PDCs, Poster Sessions, Student Program, Exhibitor Information or GBC.

Sunday, November 1
9:00 am - 5:00 pm	Professional Development Courses
5:00 pm - 6:00 pm	Professional Development Course Reception (Registrants and Instructors Only) Sponsored by Hesse & Knipps
Monday, November 2
9:00 am - 5:00 pm	Professional Development Courses
5:00 pm - 7:30 pm	Welcome Reception (All are invited)
	Focused Sessions Track	Systems/Design Track	Materials Track	Reliability Track	Advanced Technologies Track	Emerging Technology Track
Tuesday, November 3
8:00 am - 11:10 am	Biomedical, Portable, and Consumer Applications	Electromagnetic Interference (EMI)	Advanced Materials	Pb-Free Solder Materials and RoHS, Processes and Reliability 1	MEMS Packaging
11:00 am - 5:30 pm	Exhibit Hall Open
11:25 am - 11:40 am	Annual Business Meeting
11:40 am - 12:00 pm	Awards Ceremony
12:00 pm - 12:45 pm	Keynote Presentation Dr. Bradley McCredie, IBM
12:50 pm - 1:50 pm	Lunch Kiosks (Food not provided by IMAPS)
	Focused Sessions Track	Systems/Design Track	Materials Track	Reliability Track	Advanced Technologies Track	Emerging Technology Track
1:55 pm - 5:40 pm	Automotive, Industrial, Harsh Environment Electronics Applications	Design Elements and Modeling	Ceramic and LTCC Packaging	Pb-Free Solder Materials and RoHS, Processes and Reliability 2	Wirebonding and Stud Bumping
Wednesday, November 4
8:00 am - 11:40 am	Optoelectronics	Thermal Management Materials	Wafer Level/CSP Packaging Requirements	Packaging Reliability Testing	3D Packaging Approaches	Emerging Technologies
9:00 am - 5:30 pm	Exhibit Hall Open
11:45 am - 12:30 pm	Keynote Presentation Dr. Paul Franzon
12:30 pm - 1:30 pm	Lunch in the Exhibit Hall (Provided by IMAPS)
	Focused Sessions Track	Systems/Design Track	Materials Track	Reliability Track	Advanced Technologies Track	Interactive Track
1:35 pm - 5:25 pm	Packaging for Extreme Environments	Microwave and RF Applications	Invited session on Intelligent Uses of Precious Metals in Microelectronics	Design for Reliability	3D Packaging Approaches: Applications, Assembly and Design	Tutorial on Electronics, Energy and the Environment Interactive Forum (Poster Session)
5:35 pm - 7:00 pm	Global Business Council (GBC) Marketing Forum (INCLUDED WITH YOUR FULL SYMPOSIUM REGISTRATION)
7:00 pm - 7:45 pm	GBC Networking Reception
Thursday, November 5
	Focused Sessions Track	Systems/Design Track	Materials Track	Reliability Track	Advanced Technologies Track	Emerging Technology Track
8:00 am - 12:00 pm	LED and Photovoltaic Cell Packaging	Electrical Modeling, Signal & Power Integrity	Printed Electronics	Flip Chip and Wafer Bumping: Processes and Reliability	High Performance Interconnects and Boards
9:00 am - 12:00 pm	Exhibit Hall Open
9:00 am - 12:00 pm	IMAPS 2010 Booth Selection in the Exhibit Hall

Media Sponsors:

International Microelectronics And Packaging Society - IMAPS
www.imaps.org | imaps@imaps.org
1-202-548-4001