IMAPS 2009 - 42 International Symposium on Microelectronics - San Jose, CA  
 
IMAPS 2009 Homepage IMAPS 2009 Program-at-a-Glance IMAPS 2009 Exhibit Information IMAPS 2009 Registration Information IMAPS 2009 Hotel/Transportation Information IMAPS 2009 Activities IMAPS 2009 National Symposium Committee  
 
 

Images courtesy of:
Natel, Hesse & Knipps, and the San Jose Convention and Visitor Bureau.

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   Gold Premier Sponsor:    Silver Premier Sponsor:

   Presidential Sponsor:

Natel - Premier Sponsor, Platinum
Hesse & Knipps - Premier Sponsor, Gold
Heraeus Thick Film Division - Premier Sponsor, Gold
Metalor - Presidential Sponsor


IMAPS 2009
42nd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

November 1-5, 2009
San Jose Convention Center - San Jose, California, USA

Conference and Exhibition:
November 3-5, 2009
Professional Development Courses:
November 1-2, 2009

Early Registration Deadline: September 24, 2009
Hotel Deadline: September 24, 2009


We would like to thank everyone who participated in the 42nd International Symposium on Microelectronics in San Jose, California. We brought together another strong Technical Program featuring 26 sessions containing 200 presentations and posters addressing all aspects of microelectronics packaging - “everything in electronics between the chip and the system.”

We hope to see you all in Research Triangle next year for IMAPS 2010

IMAPS 2009 featured...

Complimentary Exhibit Hall Passes Exhibits Passes were Free this year for all attendees. This complimentary registration allowed participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Marketing Forum, and the Electronics/Energy Tutorial. (PDCs, Sessions, Proceedings and Lunch were not included)
Two World-Renown Keynote Presentations
Dr. Bradley McCredie
Dr. Paul Franzon
Dr. Bradley McCredie
IBM Fellow and Vice President
IBM Systems and Technology Group

Dr. Paul Franzon
Distinguished Alumni Professor
North Carolina State University
12 Professional Development Courses Intro to Microelectronics Packaging...; TSV...3D IC Integration and WLP; Lead-Free...; Advanced Thermal...; Wire Bonding...; Design and Analysis of Experiments (DoE); ... and many more.
An Unmatched, Global Technical Program
26 Sessions, 200+ Papers and Posters
5-6 Concurrent Technical Tracks
addressing:
Focused Session Areas; Systems/Design; Materials; Relability; Advanced Technologies; and Emerging Technologies
Program at a Glance | Interactive Track | Download Program PDF (13mb)
State-of-the-Art Exhibition and Technology Showcase Dedicated exhibit hall displaying new products and concepts.
Complimentary Tutorial on Electronics, Energy and the Environment: An Overview Free to all attendees
Global Business Council Marketing Forum Recovery of the Semiconductor Market
Invaluable Student Program Student Industry Panel/Reception, Cisco Plant Tour, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections.

...and that's only the technical side of the Symposium! There are also a lot of other exciting activites planned for you -- the 15th Annual Golf Classic, the Welcome Reception, to name only a few.

We hope you enjoyed the 42nd International Symposium on Microelectronics - IMAPS 2009, San Jose!

 


 





Media Sponsors:
3D InCites - Media Sponsor
Advanced Packaging - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Semiconductor International - Media Sponsor
SolidState Technology - Media Sponsor
SMT - Media Sponsor
Thermal News - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor
   


International Microelectronics And Packaging Society - IMAPS
www.imaps.org | imaps@imaps.org
1-202-548-4001