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IMAPS 2009
42nd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!
November 1-5, 2009
San Jose Convention Center - San Jose, California, USA
Call For Papers
(pdf
version of call for papers)
Abstracts
Deadline Extended to: May 31, 2009
The 42nd International Symposium on Microelectronics will be held at the San Jose Convention Center, San Jose, California – USA and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining microelectronics “between the chip and the system.” The 42nd Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Abstracts should highlight the major contributions of the work in each these four areas of concentration. All abstracts submitted must represent original, previously unpublished work.
General Chair:
Jeff Demmin, Tessera Inc.
jdemmin@tessera.com
Technical Program Chair:
Jie Xue
Cisco Systems
jixue@cisco.com
Technical Program Co-Chair:
Ricky Lee
Hong Kong University of Science and Technology
rickylee@ust.hk |
Technical Program Co-Chair:
Mark Hoffmeyer
IBM Systems and Technology Group
hoffmeyr@us.ibm.com |
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Bringing Together the Entire
Microelectronics Supply Chain!
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Planned
Sessions Include:
| Industry “Focused” |
• Consumer, Portable and Wireless
• Biomedical
• Telecom
• Defense and Security
• Computing and Gaming
• Automotive, Industrial, Harsh Environment Electronics Applications
• Solar and Alternative Energy |
| Systems & Applications |
• Thermal Management
• Power Management
• Cost Reduction, Outsourcing and Supply Chain Management
• Electromagnetic Interference (EMI)
• Sensors and Nano Packaging
• Emerging Technologies
• System Packaging
• Microwave & RF Applications
• Electrostatic Discharge (ESD) Protection
• Photonic / Optoelectronic Packaging
• Packaging for Extreme Environments
• MEMS Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices |
| Interactive Poster Session |
Outstanding papers that
do not fit in planned or created
sessions will be considered for this interactive session. |
Translated
(Invited Speakers Only) |
• Japanese (Japanese
to English translation)
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| Design |
• Electrical Modeling, Signal & Power Integrity
• High Performance Interconnects and Boards
• 3D Packaging Approaches
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials |
| Materials and Process |
• Flip-Chip and Wafer Bumping Processes and Reliability
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Design for Reliability
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed Electronics
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| Invited Session on Intelligent Uses of Precious Metals in Microelectronics |
• Uses of Precious Metals in Microelectronics
• Recovery/Recycling/Refining
• Precious metal trading
• Future outlook for Precious Metal prices
• Cost savings techniques and technologies
• Leasing and pool accounts
• Advantages of Precious Metals over non Precious metals
• Substitute materials
• Volume reduction (diameter, thickness etc)
• New Applications using Precious Metals
More Information... |
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Abstracts
Due: May 31, 2009
Notice of Acceptance: June 12, 2009
Final Manuscripts Due: September 4, 2009
Please send your 250-300
word abstract electronically only on/before May 31, 2009, using the On-line submittal form at: www.imaps.org/abstracts.htm.
All Speakers are required to pay a reduced registration fee.
If you need assistance with the on-line
submittal form, please email Jackki Morris-Joyner jmorris@imaps.org or call 305-382-8433
Cash Awards Offered!
• Best Paper of the Symposium
- One (1)
$2000 Cash Award
• Outstanding Paper - Two (2) $500 Cash Awards
Best Paper of Session - top 5 considered for Best
of Symposium and Outstanding Papers. |
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
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