IMAPS 2009 - 42 International Symposium on Microelectronics - San Jose, CA  
 
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Interactive Forum (Poster Session)


WP6
Interactive Forum (Poster Session)
Wednesday, November 4, 2009 Session 1:35 pm - 5:25 pm

Chairs: Lee Levine, Process Solutions Consulting; Thomas J. Green, TJ Green Associates LLC

One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.

Deposition of Thick Film Fine Line Patterns by Direct Writing
Ivan Szendiuch, Jiri Hladik, Jan Istvanek, Brno University of Technology

The Cleaning Effectiveness in Electronics Assembly Process
Ivan Szendiuch, Vladimir Sitko, Michal Saffer, Martin Bursik, Brno University of Technology

A New Technique for Testing Copper Stud Bumps
Stephen Clark, Alan King, Dage Precision Industries

What is Halide Free and Why Should I Care?
John Vivari, EFD, Inc.

Hardware Design for Intelligent Power Grid
John Browne, Sean Devens, Sean Jainarine, Orlando Gonsalves, Joan Delalic, Son Nguyen, Temple University

An Investigation of Materials Selection and Manufacturing Process on Resulted Device Alpha Emissivity Levels
Peng Su, Rick Wong, Shi-Jie Wen, Xiaoting Nu, Cisco Systems, Inc.; Andy Tseng, Jimmy Chen, Simon Li, Advanced Semiconductor Engineering, Inc.

A Process to Produce Low Cost Solder Balls in Custom Sizes
Fred Haring, Jacon Baer, Syed Sajid Ahmad, Aaron Reinholz, NDSU CNSE

Design and Integration of a Planar EBG for UWB Applications
Ivan N. Ndip, Micha Bierwirth, Ege Engin, Stephan Guttowski, Herbert Reichl, Fraunhofer Institute for Reliability and Microintegration (IZM)

The Design and Integration of a Quasi-Distributed Tunable UHF Filter
Eric E. Hoppenjans, William J. Chappell, Purdue University

Electromigration and Annealing Kinetics of Cu Pillar Bump
Young-Bea Park, Myeong-Hyeok Jeong, Jae-Won Kim, Gi-Tae Lim, Andong National University

Evaluation of the Ball Grid Array (BGA) Technology with a view to the Space-use Application
Koichi Shinozaki, Norio Nemoto, Tsuyoshi Nakagawa, Yoshihiro Tokue, Japan Aerospace Exploration Agency

A New Type of Reconfigurable Antenna for Multi-Band Wireless Communications
Chang-Chih Liu, Chang-Sheng Chen, Kuo-Chiang Chin, Li-Chi Chang, Wei-Ting Chen, Industrial Technology Research Institute

Pb-Free Alloy Selection: Decision Matrix as a Valuable Tool
Pedro O. Quintero, Ricky Valentin, David Ma, University of Puerto Rico-Mayaguez

Modeling and Analysis of Electromagnetic Field Distribution in Vicinity of Patch Antennas at Millimeter-Wave Frequencies
Florian Ohnimus, Ivan Ndip, Stephan Guttowski, Herbert Reichl, Fraunhofer Institute for Reliability and Microintegration, IZM

Develop a Cost Effective Assembly Process and Substrate Solutions for Cu Pillar Flip Chip
Shannon Pan, Scott Morris, Jon Chadwick, Terry Glascock, John Czarnowski, Mike Ferrara, RF Micro Devices

 


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