Members Only
Events Calendar
Online Store
Global Business Council
Industry News
IMAPS Microelectronics Foundation
Contact Us

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:

   Presidential Sponsor:

Natel - Premier Sponsor, Platinum
Hesse & Knipps - Premier Sponsor, Gold
Heraeus Thick Film Division - Premier Sponsor, Gold
Metalor - Presidential Sponsor

IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

2010 Symposium Committee

A Special Thank you to this dedicated team of volunteers for helping assemble one of the strongest symposia IMAPS has experienced over the years!

Message from the General Chair | Message from the Technical Chairs

General Chair
David Seeger
IBM Corporation

Technical Chair
Sara Paisner
LORD Corporation

Technical Co-Chair - Europe
Georg Meyer-Berg
Infineon Technologies AG

Technical Co-Chair - Asia
Jin Yu

Technical Co-Chair - USA
Urmi Ray
Qualcomm Inc.

Professional Development Course Chair
Thomas Green
TJ Green Associates LLC

VP of Technology
Lee Levine
Process Solutions Consulting

Marketing Co-Chair
Hugh Roberts

Student Activities Chair
Robert Evans
Cisco Systems / NCSU

Student Activities Co-Chair
Joan Delalic
Temple University

GBC Chair
Arne Knudsen
Kyocera America

Foundation Chair
Steve Adamson

Foundation Golf Chair
Sam Horowitz
Retired / DuPont

Foundation Golf Co-Chair
Scott Gordon

Local Technical Outreach Chair
Glenn Oliver

Local Technical Outreach Co-Chair
Scott Morris

IMAPS President
Howard Imhof
Metalor Technologies USA

IMAPS President-Elect
Rajen Chanchani
Sandia National Laboratories

IMAPS Past President
Delip (Doug) Bokil
Namark Process Design LLC

IMAPS Treasurer
David Virissimo

IMAPS 2011 General Chair
Mark Hoffmeyer
IBM Corporation

IMAPS Executive Director
Michael O’Donoghue

Event Sponsors

Logo Bags, Final Program, Internet Café and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags and Final Program:
Hesse & Knipps - Premier Sponsor, Gold
Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Thick Film Division - Premier Sponsor, Gold
President Reception, Wireless and Lanyards :
Metalor - Presidential Sponsor
GBC Reception:
Dow Electronic Materials - GBC Sponsor
Exhibit Hall Lunch:
RFMD - Lunch Sponsor
Refreshment Breaks:
LORD Corporation - Refreshment Breaks Sponsor
Bag Inserts:
Terra Universal - Bag Insert Sponsor
Golf Sponsors
Golf Luncheon and Hole:
LORD Corporation - Golf Luncheon and Hole Sponsor
Technic Inc. - Golf Sponsor
VIOX Corporation - Golf Sponsor
Media Sponsors
Meptec - Media Sponsor
US Tech - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Thermal News - Media Sponsor

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001