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   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:

   Presidential Sponsor:

Natel - Premier Sponsor, Platinum
Hesse & Knipps - Premier Sponsor, Gold
Heraeus Thick Film Division - Premier Sponsor, Gold
Metalor - Presidential Sponsor

IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

Message From The General Chair


General Chair, David Seeger

Greetings IMAPS members and other interested parties from the technical community!

I hope you can come and participate at the 43rd Annual International Symposium on Microelectronics, October 31 - November 4, 2010. You can see from the enclosed program that we have a strong technical program in addition to the vendor’s exhibition hall. We’ve enhanced the program with some exciting new additions including a conference-long technical track on 3D packaging, one of the fastest growing areas in microelectronics today.

Note too that this year’s program is in a new venue - the Research Triangle Park (RTP) area in North Carolina, featuring Raleigh’s brand new convention center. RTP offers an abundance of high technology companies, renowned research institutes, consortia and universities that have been famous for the development of the area. One might ask why we would move to a new venue since established venues have infrastructure and history on their side. While it is true that opening this symposium at a new site introduces new challenges for conference organizers, it also offers new opportunities. Most important, it allows the opportunity to expand the scope of those interested in IMAPS. Indeed, as I talk with local folks in the RTP area, many were unaware of the society and are now becoming actively engaged. In addition, it offers current IMAPS members the ability to expand the scope of their contacts in this region of the country, not to mention world famous golfing in the area for golf enthusiasts!


The highlights for this year’s event include:

  • A tremendous technical program with 26 sessions, including excellent coverage of Signal/Power Integrity, Thermal Management, and Wire Bonding, in addition to the aforementioned conference-long technical track dedicated to 3D packaging issues.
  • Two keynote presentations, one by Dr. John Edmond, Co-Founder, from CREE Research, Inc.; the other by Dr. Rao Tummala, Professor and Director, from Georgia Institute of Technology.
  • A line-up of 18 Professional Development Courses providing the chance to brush up on your knowledge or move up the learning curve in a new area.
  • The IMAPS Global Business Council Forum, featuring two talks on “Materials for Photovoltaics and 3D Packaging” by leading industry analysts.
  • Extensive student participation, with cash awards for the two best student papers.
  • Exhibitors providing updates on their products and services.
  • A career center for anyone in the market for a new opportunity.
  • A program for college students that includes a visit to DuPont Microcircuit Material Headquarters.
  • A program with a local high school, giving students a chance to see what the microelectronics industry is all about.
  • A great golf tournament at the Lonnie Poole Golf Course, to help us on the “all work and no play” front.

It’s been a great pleasure serving as general chair of this event. I’m particularly honored to be surrounded by an organizing committee and IMAPS staff that has worked extra hard to line up such a strong program in this new venue. The other challenge has been very different than last year. Last year, the industry was lagging and budgets were tight thus hindering participation. This year, the industry has been on such a ‘tear’ with huge upswings in business that folks are now too busy to participate … a great problem to have! Please take a look at the full committee list on page 4, so you’ll know who to thank!

An event like IMAPS 2010 would not be possible without the support of our sponsors, so I’d like to thank them and highlight NATEL, Hesse & Knipps Semiconductor Equipment, and Heraeus as our Premier Sponsors; along with Metalor as our Presidential Sponsor.

So, take a little time from your very busy schedule to come to this new venue and see the riches of technology available in the RTP area. Come mingle and create new contacts with colleagues in a different and exciting part of the country. And as mentioned, for golfers the Carolinas offer some of the best golfing venues in the country. See you in North Carolina.

See you in North Carolina.

David Seeger
IBM Corporation

seeger@us.ibm.com


Event Sponsors

Logo Bags, Final Program, Internet Café and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags and Final Program:
Hesse & Knipps - Premier Sponsor, Gold
Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Thick Film Division - Premier Sponsor, Gold
President Reception, Wireless and Lanyards :
Metalor - Presidential Sponsor
GBC Reception:
Dow Electronic Materials - GBC Sponsor
Exhibit Hall Lunch:
RFMD - Lunch Sponsor
Refreshment Breaks:
LORD Corporation - Refreshment Breaks Sponsor
Bag Inserts:
Terra Universal - Bag Insert Sponsor
Golf Sponsors
Golf Luncheon and Hole:
LORD Corporation - Golf Luncheon and Hole Sponsor
Technic Inc. - Golf Sponsor
VIOX Corporation - Golf Sponsor
Media Sponsors
Meptec - Media Sponsor
US Tech - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Thermal News - Media Sponsor
 



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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
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Phone: 202-548-4001