Heraeus ELD

   Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:

   Presidential Sponsor:

Natel - Premier Sponsor, Platinum
Hesse & Knipps - Premier Sponsor, Gold
Heraeus Thick Film Division - Premier Sponsor, Gold
Metalor - Presidential Sponsor

IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

October 31 - November 4, 2010
Raleigh Convention Center
500 South Salisbury Street
Raleigh, North Carolina 27601 - USA

Conference and Exhibition:
November 2-4, 2010
Professional Development Courses:
October 31 - November 1, 2010

Early Registration Deadline: September 24, 2010
Hotel Deadline: September 24, 2010


Technical Program


The 43rd International Symposium on Microelectronics was held at the Raleigh Convention Center, Research Triangle, North Carolina, USA, and was managed by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2010 featured technical tracks on 3D Packaging/Interconnect, Design, Reliability, Advanced Packaging and Material. 25 technical sessions were featured this year including sessions on: 3D IC at RTP, 3D Packaging, 3D Systems Integration, 3D TSV Processes, Materials, Ceramics/LTCC, Flip Chip, WL/CSP, LED, MEMS, Modeling & Design, Pb-Free Solder, Printed/3D Structural Electronics, Thermal, Wire Bonding and more. The 2010 symposium offered you 17 professional development courses, a GBC Marketing Forum on Photovoltaics and 3D, and keynote presentations from Dr. John Edmond, co-founder CREE Research, and Dr. Rao Tummala, Georgia Tech.

IMAPS 2010 features...

Complimentary Exhibit Hall Passes Exhibits Passes were complimentary this year for all attendees. This complimentary registration will allow participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Marketing Forum. (PDCs, Sessions, Proceedings and Lunch are not included)
Two World-Renown Keynote Presentations
Dr. John Edmond, CREE
Dr. John Edmond
Co-Founder
CREE Research, Inc.

Dr. Rao Tummala, GA Tech
Dr. Rao Tummala
Professor and Director of 3D Systems Packaging Research Center
Georgia Institute of Technology

17 Professional Development Courses Intro to Microelectronics Packaging...; TSV...3D IC/Si Integrations; Wire Bonding...; 3D Integration and Packaging...; 3D IC Integration...; Signal/Power Integrity; MEMS Reliability...; LED Packaging...; Polymers for Electronic Packaging (NEW); and many more.
An Unmatched, Global Technical Program
25 Sessions, 160+ Papers and Posters
5 Concurrent Technical Tracks
addressing:
NEW 3D Packaging/Integration Track with 5 sessions/panel
Other Tracks on: Modeling/Reliability; Next Gen. Materials; Assembly & Packaging; Advanced Technologies
Program at a Glance | Interactive Track | Download Final Program PDF
State-of-the-Art Exhibition and Technology Showcase Dedicated exhibit hall displaying new products and concepts.
Global Business Council Marketing Forum Materials for Photovoltaics and 3D Packaging
Invaluable Student Program Student Industry Panel/Reception, DuPont Plant Tour, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections.

...and that's only the technical side of the Symposium! There are also a lot of other exciting activites planned for you -- the 16th Annual Golf Classic, the Welcome Reception and opening ceremonies, a Foundation Ca-Si-No Night, to name only a few.

We hope you enjoyed the 43rd International Symposium on Microelectronics - IMAPS 2010, Research Triangle!
We hope to see you in Long Beach for IMAPS 2011.

 

 


Event Sponsors

Logo Bags, Final Program, Internet Café and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags and Final Program:
Hesse & Knipps - Premier Sponsor, Gold
Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Thick Film Division - Premier Sponsor, Gold
President Reception, Wireless and Lanyards :
Metalor - Presidential Sponsor
GBC Reception:
Dow Electronic Materials - GBC Sponsor
Exhibit Hall Lunch:
RFMD - Lunch Sponsor
Refreshment Breaks:
LORD Corporation - Refreshment Breaks Sponsor
Bag Inserts:
Terra Universal - Bag Insert Sponsor
Golf Sponsors
Golf Luncheon and Hole:
LORD Corporation - Golf Luncheon and Hole Sponsor
Technic Inc. - Golf Sponsor
VIOX Corporation - Golf Sponsor
Media Sponsors
Meptec - Media Sponsor
US Tech - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Thermal News - Media Sponsor
 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • Canon
  • Corning
  • Honeywell
  • Indium
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Natel
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  • Quik-Pak
  • Specialty Coating Systems