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IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!
October 31 - November 4, 2010
Raleigh Convention Center - Research Triangle, North Carolina, USA
Call For Papers
(pdf
version of call for papers)
Abstracts
Deadline: March 19, 2010
The 43rd International Symposium on Microelectronics will be held at the Raleigh Convention Center, Research Triangle, North Carolina, USA, and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee seeks original papers that present progress on technologies “between the chip and the system.” The 43rd Symposium on Microelectronics will cover four tiers of electronics: Industry, Systems & Applications, Design, and Materials & Process. Abstracts should highlight the major contributions of the work in one or more of these four areas. All abstracts submitted must represent original, previously unpublished work.
Planned
Sessions Include:
| Industry “Focused” |
• Consumer, Portable and Wireless
• Biomedical
• Telecom
• Defense and Security
• Computing and Gaming
• Automotive, Industrial, Harsh Environment Electronics Applications
• Solar and Alternative Energy |
| 3D Integration and Packaging Track |
• 3D System Integration
• 3D Packaging Approaches
• 3D Processing Technology
• 3D Equipment and Materials Advances
• 3D Simulation and Modeling
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| Systems & Applications |
• Thermal Management
• Power Management
• Cost Reduction, Outsourcing and Supply Chain Management
• Electromagnetic Interference (EMI)
• Sensors and Nano Packaging
• Emerging Technologies
• System Packaging
• Microwave & RF Applications
• Electrostatic Discharge (ESD) Protection
• Photonic / Optoelectronic Packaging
• Packaging for Extreme Environments
• MEMS Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices |
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| Design |
• Electrical Modeling, Signal & Power Integrity
• High Performance Interconnects and Boards
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials |
| Materials and Process |
• Flip-Chip and Wafer Bumping Processes and Reliability
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Design for Reliability
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed Electronics
• Ultra Low-K Packaging
• Uses of Precious Metals in Microelectronics |
Translated
(Invited Speakers Only) |
• Japanese (Japanese
to English translation)
• Chinese (Chinese to English translation) |
| Interactive Poster Session |
Outstanding papers that
do not fit in planned or created
sessions will be considered for this interactive session. |
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Abstracts
Due: March 19, 2010
Notice of Acceptance: May 7, 2010
Final Manuscripts Due: August 27, 2010
Please send your 250-300
word abstract electronically only on/before March 19, 2010, using the On-line submittal form at: www.imaps.org/abstracts.htm.
All Speakers are required to pay a reduced registration fee.
If you need assistance with the on-line
submittal form, please email Jackki Morris-Joyner jmorris@imaps.org or call 305-382-8433
Cash Awards Offered!
• Best Paper of the Symposium
- One (1)
$2000 Cash Award
• Outstanding Paper - Two (2) $500 Cash Awards
Best Paper of Session - top 5 considered for Best
of Symposium and Outstanding Papers. |
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Transportation
It’s easy to get to Raleigh Convention Center, especially with an International Airport just a few minutes away. Just 20 minutes away from downtown Raleigh, Raleigh-Durham International Airport features numerous carriers offering direct service to 37 destinations. An East Coast hub, RDU offers nearly 450 daily arrivals and departures on nine major and 16 regional carriers. International flights run daily as well.
Ground transportation is provided by the Raleigh-Durham International Airport Taxi Service, the Triangle Transit Authority and local limousine and shuttle companies. Cab fare is approximately $30. However, many hotels offer shuttle service to and from the airport.
RDU International Airport
1600 Terminal Blvd, I-40 at Exit 284B
919-840-2123
www.rdu.com
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