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IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

Keynote Presentations


Dr. John Edmond, CREE

Tuesday, November 2, 2010
12:00 PM

Dr. John Edmond
CREE Research, Inc.

Presentation Title:
High Efficiency Blue and White LEDs for the New Lightbulb

Dr. John Edmond graduated summa cum laude from Alfred University in 1983 with a Bachelor of Science degree in ceramic engineering. He earned his Ph.D. in Materials Science at NC State University in 1987 and upon graduation co-founded Cree Research, Inc. Since its founding, Dr. Edmond has worked on the development and production of blue and green LEDs, first in SiC, then the Group III Nitrides on SiC.

In July 2007, Dr. Edmond earned a place on Business 2.0s ‘50 Who Matter Now’ list. The distinction places him alongside business celebrities such as Steve Jobs, founder and CEO of Apple, and the chiefs of Amazon, Cisco and Google. He and his team continue to advance the performance of LEDs to enable high efficiency solid state lighting solutions. He has 73 issued and 33 pending patents in the US, with an additional 147 issued and 127 pending foreign patents in the field of SiC and Group III-Nitrides.


Dr. Rao Tummala, GA Tech

Wednesday, November 3, 2010
11:45 AM

Dr. Rao Tummala
Professor and Director of 3D Systems Packaging Research Center
Georgia Institute of Technology

Presentation Title:
Grand Challenges and Potential Solutions in the Changing World of Nano-Electronics from ICs to 3D ICs to 3D Systems

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech, the largest Academic Center in Microsystems pioneering System-On-Package (SOP) vision, since 1994. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the first plasma flat panel display based on gas discharge, the first and next three generations of multichip packaging - alumina, glass-ceramic-copper and copperpolymer thin film, and materials for ink-jet printing and magnetic storage.

He received many industry, academic and professional society awards including Industry Week’s award for improving U.S. competitiveness, IEEE’s David Sarnoff, Major Education and Sustained Technical awards, Dan Hughes award from IMAPS, Engineering Materials Achievement award from DVM and ASM-International, Total Excellence in Manufacturing award from SME, John Jeppson’s award from the American Ceramic Society as well as the Distinguished Alumni Awards from the University of Illinois, the Indian Institute of Science, Bangalore and Georgia Tech. He received his BS from IISc, Bangalore and Ph.D. from the University of Illinois.

Prof. Tummala published 426 technical papers, holds 74 patents and inventions; authored the first modern packaging reference book - Microelectronics Packaging Handbook (Van Nostrand, 1988) and the first undergrad textbook - Fundamentals of Microsystems Packaging (McGraw Hill, 2001) and first book introducing the System-On-Package technology. He is a Fellow of IEEE, IMAPS, and the American Ceramic Society, and member of the National Academy of Engineering in the USA and in India. He was the President of both IEEE-CPMT and IMAPS.


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