Modeling of a Heterojunction Bipolar Transistor Based AlGaAs / GaAs
Kherreddine Ghaffour, A. Bedia, D. Ghaffour, A. Guen-Bouazza, B. Bouazza, Univerité Abou-Bekr Belkaid of Tlemcen
The Reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module Application
Chang-Bae Lee, Jin-Gu Kim, Young-Do Kweon, Kyoung-Moo Harr, Young-Ho Kim, Samsung Electro-Mechanics Co., Ltd.
"Cleaning" - The Dirty Word in Packaging Assembly
Rich Brooks, Kyzen Corporation
Development of a Low Voiding Solder Attach Process for Photovoltaic Cell Assemblies
Ian Hardy, Crane Electronics Group
Evaluation of Glass Frits for Development of Lead-Free Thick Film Resistor
W. Kinzy Jones, Sr., Florida International University; Xudong Chen, nScrypt Inc.
Optimization of Photovoltaic Power Generation using a Measurement and Management Technology (MMT) Platform
Levente J. Klein, Sergio Bermudez Rodrigues, Satya Nitta, Robert Sandstrom, Supratik Guha, Hendrik Hamann, IBM TJ Watson Research Center
A First Individual Solder Joint Encapsulant Adhesive
Mary Liu, Wusheng Yin, YINCAE Advanced Materials, LLC
Chip Embedding for Printed Circuit Boards and Subsystems
Thomas Gottwald, Alexander Neumann, Schweizer Electronic AG
Inkjet Printing of Thick-Film Resistors
Marcel Waßmer, Waldemar Diel, Klaus Krueger, Helmut-Schmidt-University
Identifying and Working with Government Regulations
Corey Jordan, American River International, Ltd.
