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IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

Interactive Forum (Poster Session)


WP6
Interactive Forum (Poster Session)
Wednesday, November 3, 2010 Session 1:35 pm - 5:25 pm

Chairs: Lee Levine, Process Solutions Consulting

One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.

Modeling of a Heterojunction Bipolar Transistor Based AlGaAs / GaAs
Kherreddine Ghaffour, A. Bedia,  D. Ghaffour, A. Guen-Bouazza, B. Bouazza, Univerité Abou-Bekr Belkaid of Tlemcen

The Reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module Application
Chang-Bae Lee, Jin-Gu Kim, Young-Do Kweon, Kyoung-Moo Harr, Young-Ho Kim, Samsung Electro-Mechanics Co., Ltd.

"Cleaning" - The Dirty Word in Packaging Assembly
Rich Brooks, Kyzen Corporation

Development of a Low Voiding Solder Attach Process for Photovoltaic Cell Assemblies
Ian Hardy, Crane Electronics Group

Evaluation of Glass Frits for Development of Lead-Free Thick Film Resistor
W. Kinzy Jones, Sr., Florida International University; Xudong Chen, nScrypt Inc.

Optimization of Photovoltaic Power Generation using a Measurement and Management Technology (MMT) Platform
Levente J. Klein, Sergio Bermudez Rodrigues, Satya Nitta, Robert Sandstrom, Supratik Guha, Hendrik Hamann, IBM TJ Watson Research Center

A First Individual Solder Joint Encapsulant Adhesive
Mary Liu, Wusheng Yin, YINCAE Advanced Materials, LLC

Chip Embedding for Printed Circuit Boards and Subsystems
Thomas Gottwald, Alexander Neumann, Schweizer Electronic AG

Inkjet Printing of Thick-Film Resistors
Marcel Waßmer, Waldemar Diel, Klaus Krueger, Helmut-Schmidt-University

Identifying and Working with Government Regulations
Corey Jordan, American River International, Ltd.


Technical Program

 

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