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IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

Message From The Technical Chairs

Technical Chair, Sara Paisner
Technical Co-Chair, Georg Meyer-Berg
Technical Co-Chair, Jin Yu
Technical Co-Chair, Urmi Ray

Mark your Calendars! We look forward to seeing you October 31st to November 4th at the 43rd Annual IMAPS International Symposium on Microelectronics, the premier conference bringing together the entire microelectronics supply chain. Held this year in the heart of the Research Triangle in Raleigh, North Carolina, we as Technical Chairs are excited by the scope and quality of this year’s program and hope that you are planning to attend.

We have brought together a Technical Program with 26 sessions that includes an Interactive Poster session, with more than 190 papers and posters addressing all aspects of microelectronics packaging. We will also have 18 Professional Development Courses, 2 Keynote Presentations, a powerful Global Business Council meeting, and significant student participation activities.

IMAPS 2010 in North Carolina’s Research Triangle promises to be an excellent technical program including several special focused sessions that address innovative technology and new development in the application areas of 3D Packaging, Modeling and Design for System/Power Integrity, LEDs, Wafer Level CSP, Pb-free Packaging and others. Here are a few highlights, offering opportunities to:

  • Dive deep into technology and development. The overall program is organized into five tracks that address 3D Packaging, Modeling and Reliability, Next Generation Materials, Assembly and Packaging, and Advanced Technologies. Specific topics within these tracks include the latest technical innovations in LEDs and MEMS, Emerging Technologies, 3D Packaging, as well as Microwave and RF Applications.
  • Explore business trends. The highly successful Global Business Council program, which was a big hit last year, will be held on Wednesday, November 3rd, and is comprised of two powerful presentations addressing the business trends and key market drivers in our society.
  • Network with colleagues from all over the world. One of the great aspects of attending a technical program of this nature is the chance to meet and converse with peers from all over the world. IMAPS, a truly international society, will have speakers from 15 countries, and attendees from Europe, the Pacific Rim, and the Americas, providing incredible opportunities for networking and idea sharing.
  • Listen to two eminent industry leaders provide keynote presentations: Dr. John Edmond, co-founder of Cree Research, Inc. and Dr. Rao Tummala, Professor and Director at the Georgia Institute of Technology.
  • Connect to the microelectronics supply chain. Many exhibitors have registered already, ensuring that our Exhibits Hall will feature a diverse range of companies showcasing their latest products and technologies.

As the Technical Chair and Co-Chairs, we are excited about the impact this powerful technical program will have on our society members and their respective businesses, and we gratefully acknowledge our IMAPS Technical Committee and IMAPS staff for an outstanding job reviewing abstracts, organizing sessions, and providing invaluable help preparing this Symposium. We look forward to a fantastic 5 days of insights, inspiration and idea sharing.

Reserve your space now, and we’ll see you in North Carolina’s Research Triangle, October 31st to November 4th!

Sara Paisner
Lord Corporation
Georg Meyer-Berg
Infineon Technologies AG
Jin Yu
Urmi Ray
Qualcomm Inc.


Event Sponsors

Logo Bags, Final Program, Internet Café and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags and Final Program:
Hesse & Knipps - Premier Sponsor, Gold
Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Thick Film Division - Premier Sponsor, Gold
President Reception, Wireless and Lanyards :
Metalor - Presidential Sponsor
GBC Reception:
Dow Electronic Materials - GBC Sponsor
Exhibit Hall Lunch:
RFMD - Lunch Sponsor
Refreshment Breaks:
LORD Corporation - Refreshment Breaks Sponsor
Bag Inserts:
Terra Universal - Bag Insert Sponsor
Golf Sponsors
Golf Luncheon and Hole:
LORD Corporation - Golf Luncheon and Hole Sponsor
Technic Inc. - Golf Sponsor
VIOX Corporation - Golf Sponsor
Media Sponsors
Meptec - Media Sponsor
US Tech - Media Sponsor
Wafer & Device Packaging and Interconnect - Media Sponsor
Antennas Online - Media Sponsor
Equipment Protection - Media Sponsor
LED Journal - Media Sponsor
Thermal News - Media Sponsor

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
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Phone: 202-548-4001