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IMAPS Global Business Council (GBC) - The Business Side of the Microelectronics Supply Chain

GBC 2011 Marketing Forum
“Tomorrow’s Supply Chain:
Overcoming Environmental & Societal Challenges”

INCLUDED WITH YOUR IMAPS 2011 REGISTRATION

IMAPS 2011 Home

GBC Reception Sponsored by:
Sikama - GBC Sponsor


Wednesday, October 12, 2011
Long Beach Convention Center - Exhibit Hall Theater
5:30 pm - 6:30 pm
GBC Reception immediately following Forum

This GBC-Marketing Forum is a business session for all IMAPS 2011 attendees who wish to participate. A Networking Reception will follow. Pre-registration is strongly recommended in order to plan the reception.

“Impact of Packaging on Data Centers: Green Market Outlook”

Given the ever increasing demand for IT, the increased heat dissipation for high performance chips, and high density packaging available (e.g., blade servers), the impact on residual heat in data centers (DCs) is driving the need for more efficient cooling technologies. Different types of DCs will be described with the current technologies as well as market outlook for them.

Dr. David Seeger, Green Technologies Program Director at IBM

About Dr. Seeger:
Dr. Seeger plans and develops IBM’s offerings for green data centers. David earlier led IBM’s research program on advanced electronic and optical packaging technology. Before this research, he managed for IBM many areas in process development of semiconductors including lithography, chemical mechanical polishing, electro-deposition, and reactive ion etching.

“Medtronic Tempe Campus No Re-Work Initiative”

Medtronic’s No Re-Work Initiative realized the shift in manufacturing paradigm where the foundations for first-pass design success were established. Many changes were implemented, including methods of earlier issue detection, alignment of requirements with suppliers, and enhanced testing processes. Estimated cost savings due to scrap reduction and increased productivity were substantial. The initiative also fueled improvements in first run yield and key product lines. The best practices applied to reaching this initiative will be discussed.

Mr. Patrick Malone, Director, Hybrid Manufacturing at Medtronic, Inc.

About Mr. Malone:
Patrick Malone is the Director of Manufacturing Operations for the Medtronic Tempe Campus. Patrick oversees hybrid electronic assembly and test, IC probes, and die-prep for implantable microelectronics. Patrick holds a Master of Science in Ceramic Engineering from Alfred University and a MBA from Arizona State University. He holds several US Patents.

“Social and Environmental Responsibility Improvements in the Electronics Supply Chain”

With many business networks of the microelectronics supply chain, environmental and social impacts of one company can impact many relationships. Practical experiences of driving environmental and social responsibility improvements will be shared with particular emphasis on supply chain transparency of carbon and conflict minerals.

Mr. Bruce Klafter, Managing Director, Corporate Responsibility and Sustainability for Applied Materials at Hewlett-Packard

About Mr. Klafter:
Bio soon.

GBC Reception immediately following Forum

GBC Reception Sponsored by:
Sikama - GBC Sponsor
Reception Door Prizes are donated by:

DuPont Microcircuit Materials
HexaTech Inc.
Kyocera America
NATEL
NTK Technologies
IMAPS
DuPont Microcircuit Materials
HexaTech Inc.
Kyocera America
NATEL - Platinum Sponsor
NTK Technologies
IMAPS



GBC Attendance INCLUDED WITH YOUR IMAPS 2011 REGISTRATION


IMAPS Global Business Council | 611 2nd St, NE | Washington, DC 20002 | 202-548-4001