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   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver

IMAPS 2011 - Long Beach
44th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

October 9 - 13, 2011
Long Beach Convention Center
Long Beach, California, USA

IMAPS 2011 - Long Beach

Conference and Exhibition:
October 11-13, 2011
Professional Development Courses:
October 9 - 10, 2011

Message From The General Chair

Mark Hoffmeyer, General Chair

Greetings IMAPS members and the worldwide microelectronics community!

I am excited to be this year’s General Chair for IMAPS’ 44th Annual International Symposium on Microelectronics. I welcome your participation and hope you can join us October 9th thru 13th. IMAPS 2011 promises to be a special event with a strong technical program, and a large array of technology and manufacturing vendors at the exhibition hall. Please see the enclosed program review for details. Also note that our IMAPS team and its many dedicated volunteers have also enhanced the 2011 program with some exciting new features that provide added international flavor, and more learning and growth opportunities for you and your business as well. New on the 2011 slate is a Chinese-to-English translated technical session, two focus sessions on packaging perspectives from Europe, and back by popular demand, the Japanese-to-English translated session; our largest ever set of Professional Development Courses, (we will offer 22); and an expanded roster of technical presentations at the Global Business Council Forum.

Being held this year at the Long Beach Convention Center in Long Beach, California, IMAPS will showcase a vast array of technical information and products from many high technology companies that define vital arteries to the heart of Silicon Valley and its affiliation with a vast array of microelectronics developments, technology user based businesses, enormous microelectronics supply chain, and many top tier research institutes and universities.

The highlights for this year’s event include:

  • A tremendous technical program with 28 sessions, including excellent coverage of 3D Packaging, Emerging Technologies, Signal/Power Integrity, Thermal Management, Pb-Free Processing, Wire Bonding, and of course, the aforementioned focus and translated sessions featuring the latest in microelectronics packaging developments from China, Europe and Japan.
  • Two keynote presentations, one on Tuesday October 11th by Liam Madden, Corporate Vice President of Xilinx, Inc., and another special keynote presentation to be announced for Wednesday October 12 th.
  • Our largest ever line-up of 22 Professional Development Courses providing unique opportunities to brush up on your knowledge or move up the learning curve in a new area.
  • The IMAPS Global Business Council Forum, featuring three talks on “Impact of Packaging on Data Centers: Green Market Outlook,” “Medtronic Tempe Campus No Re-Work Initiative,” and “Social and Environmental Responsibility Improvements in the Electronics Supply Chain,” all to be presented by leading industry experts.
  • Extensive student participation, with cash awards for the two best student papers.
  • Exhibitors providing updates on their products and services.
  • A program for college students that includes a visit to Broadcom Corporate Headquarters.
  • A program with local high schools, giving students a chance to see what the microelectronics industry is all about.
  • A great golf tournament at the Skylinks Country Club (, to help us on the “all work and no play” front.

It’s been a great pleasure serving as general chair of this event. I am honored to be surrounded by a diligent and steadfast organizing committee and IMAPS staff. Please take a look at the full committee list so you’ll know who to thank! In addition, an event like IMAPS 2011 would not be possible without the support of our sponsors, so I’d like to thank them and highlight NATEL, Heraeus and Metalor as our Premier Sponsors.

I am also especially impressed that such a strong program has been lined up in a year of economic uncertainty further impacted by geologic turmoil, and the many personal tragedies caused by these recent natural disasters. My thoughts and prayers along with everyone in the IMAPS community go out to all who have been personally affected by these recent events.

In the face of these challenging times, one constant remains in our affiliated array of work disciplines: Electronic technology developments continue to advance at an unprecedented pace on a worldwide scale. As such, it remains critical to stay abreast of the latest new technology, technology applications, new research advances, and new microelectronics offerings to help sustain and grow our businesses. With a superb program that truly brings the entire electronics supply chain together, I can’t think of a better place to stay in tune than at the IMAPS 2011 Symposium in Long Beach, California.

I encourage you take some time from your busy schedule to attend IMAPS 2011, to learn about a diverse scope of technology advancements, meet and collaborate with your peers, and create a network of new contacts from all over the world!

See you in Long Beach!

Mark Hoffmeyer
IBM Corporation




Event Sponsors

Logo Bags, Final Program, Internet Café and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
GBC Forum/Reception:
Sikama - GBC Forum/Reception Sponsor
LORD - Golf "Birdie" Sponsor
Keynote Presentations:
Indium Corp - Keynote Sponsor
Exhibit Hall Lunch:
Kyocera America - Exhibit Lunch Sponsor
Bag Insert:
RIV Inc. - Bag Insert Sponsor
Golf Sponsors
Golf "Birdie" Sponsor:
LORD - Golf "Birdie" Sponsor
Golf Ball Markers:
Circuit Solutions, Inc. - Golf Ball Markers Sponsor
Golf Hole Sponsor:
Technic - Golf Hole Sponsor
Golf Hole Sponsor:
Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole Sponsor:
Golf Hole Sponsor: AGC Electronics America
Golf Hole Sponsor:
Golf Hole Sponsor: Dixon Golf
Golf Hole Sponsor:
Golf Hole Sponsor: Ceradyne Viox
Media Sponsors
Chip Scale Review - Media Sponsor
US Tech - Media Sponsor
MEPTEC - Media Sponsor


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Phone: 202-548-4001