Platinum Premier Sponsor:
IMAPS 2011 - Long Beach
October 9 - 13, 2011
Conference and Exhibition:
October 11-13, 2011
Professional Development Courses:
October 9 - 10, 2011
Early Registration Deadline Extended to: September 16, 2011
Hotel Deadline Extended to: September 16, 2011
The 44th International Symposium on Microelectronics was held at the Long Beach Convention Center, Long Beach, California, USA, and was organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 featuree technical tracks on 3D Packaging; Modeling, Design & Reliability; Next Generation Materials; Assembly & Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging & System-Integration. 28 technical sessions were held including sessions on: 3D-TSV Processes & Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal & Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic & LTCC; Thermal Management; Wire Bonding; Printed Electronics; MEMS Packaging; and many more. The 2011 symposium offered professional development courses, a GBC Marketing Forum on "Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges", and 2 keynote presentations. A truly International Symposium, IMAPS 2011 also offered: 2 new sessions on European Perspectives on Packaging/Integration; a new Chinese-to-English Translated Session on "Advanced Packaging in China"; and the return of the always popular Japanese-to-English Translated session on "Improvements in Advanced Packaging from Japan."
IMAPS 2011 featured...
|Complimentary Exhibit Hall Passes||Exhibits Passes were complimentary this year for all attendees. This complimentary registration will allow participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Marketing Forum. (PDCs, Sessions, Proceedings and Lunch are not included)|
|World-Renown Keynote Presentations
|16 Professional Development Courses||Advanced Packaging...(NEW); Basics of Microelectronics Packaging; Packaging Industry Updates & Trends; Polymers in Electronic Packaging; TSV...3D IC/Si Integrations; Wire Bonding...; 3D/TSV Integration and Packaging...; Signal/Power Integrity; MEMS Reliability...; Screen Printing; Counterfeit Electronics...(NEW); Design & Analysis of Experiments...(NEW); and many more.|
|An Unmatched, Global Technical Program
||28 Sessions, 190+ Papers and Posters
5-6 Concurrent Technical Tracks addressing:
3D Packaging; Modeling/Reliability; Next Gen. Materials; Assembly & Packaging; Advanced Technologies; Focus Track: Adv. Packaging & System-Integration
Program Grid (PDF) | Interactive Track
|State-of-the-Art Exhibition and Technology Showcase||Dedicated exhibit hall displaying new products and concepts.|
|Global Business Council Marketing Forum||Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges|
|Invaluable Student Program||Student Industry Panel/Reception, Broadcom HQ Tour, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections.|
...and that's only the technical side of the Symposium! There were also a lot of other exciting activites held -- the 17th Annual Golf Classic, the Welcome Reception and opening ceremonies, a Foundation Ca-Si-No Night, a companion tour of The Queen Mary Experience, to name only a few.
We hope you enjoy the 44th International Symposium on Microelectronics - IMAPS 2011, Long Beach!
The Westin Long Beach
333 East Ocean Blvd.
Long Beach, CA 90802
$169/night + tax
To make a reservation - http://www.starwoodmeeting.com/StarGroupsWeb/res?id=1010077017&key=ACB90
Or call (800) Westin1 or (562) 436-3000 and ask for International Microelectronics And Packaging Society.
Complimentary Internet in all rooms booked through our block.
IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.