Platinum Premier Sponsor:

   Gold Premier Sponsor:
   Silver Premier Sponsor:
Natel - Premier Sponsor, Platinum
Heraeus Materials Technology - Premier Sponsor, Gold
Metalor - Premier Sponsor, Silver

IMAPS 2011 - Long Beach
44th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

October 9 - 13, 2011
Long Beach Convention Center
Long Beach, California, USA

IMAPS 2011 - Long Beach

Conference and Exhibition:
October 11-13, 2011
Professional Development Courses:
October 9 - 10, 2011

Early Registration Deadline Extended to: September 16, 2011
Hotel Deadline Extended to: September 16, 2011

The 44th International Symposium on Microelectronics was held at the Long Beach Convention Center, Long Beach, California, USA, and was organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 featuree technical tracks on 3D Packaging; Modeling, Design & Reliability; Next Generation Materials; Assembly & Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging & System-Integration. 28 technical sessions were held including sessions on: 3D-TSV Processes & Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal & Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic & LTCC; Thermal Management; Wire Bonding; Printed Electronics; MEMS Packaging; and many more. The 2011 symposium offered professional development courses, a GBC Marketing Forum on "Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges", and 2 keynote presentations. A truly International Symposium, IMAPS 2011 also offered: 2 new sessions on European Perspectives on Packaging/Integration; a new Chinese-to-English Translated Session on "Advanced Packaging in China"; and the return of the always popular Japanese-to-English Translated session on "Improvements in Advanced Packaging from Japan."

IMAPS 2011 featured...

Complimentary Exhibit Hall Passes Exhibits Passes were complimentary this year for all attendees. This complimentary registration will allow participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Marketing Forum. (PDCs, Sessions, Proceedings and Lunch are not included)
World-Renown Keynote Presentations
Mr. Liam Madden, Corporate VP, Xilinx
Mr. Liam Madden
Corporate Vice President
Xilinx, Inc.
Dr. Ning-Cheng Lee, VP, Technology, Indium
Dr. Ning-Cheng Lee
Vice President, Technology
Indium Corporation
16 Professional Development Courses Advanced Packaging...(NEW); Basics of Microelectronics Packaging; Packaging Industry Updates & Trends; Polymers in Electronic Packaging; TSV...3D IC/Si Integrations; Wire Bonding...; 3D/TSV Integration and Packaging...; Signal/Power Integrity; MEMS Reliability...; Screen Printing; Counterfeit Electronics...(NEW); Design & Analysis of Experiments...(NEW); and many more.
An Unmatched, Global Technical Program
28 Sessions, 190+ Papers and Posters
5-6 Concurrent Technical Tracks
3D Packaging; Modeling/Reliability; Next Gen. Materials; Assembly & Packaging; Advanced Technologies; Focus Track: Adv. Packaging & System-Integration
Program Grid (PDF) | Interactive Track
State-of-the-Art Exhibition and Technology Showcase Dedicated exhibit hall displaying new products and concepts.
Global Business Council Marketing Forum Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges
Invaluable Student Program Student Industry Panel/Reception, Broadcom HQ Tour, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections.

...and that's only the technical side of the Symposium! There were also a lot of other exciting activites held -- the 17th Annual Golf Classic, the Welcome Reception and opening ceremonies, a Foundation Ca-Si-No Night, a companion tour of The Queen Mary Experience, to name only a few.

We hope you enjoy the 44th International Symposium on Microelectronics - IMAPS 2011, Long Beach!

Technical Program


Event Sponsors

Logo Bags, Final Program, Internet Café and Convention Hall Signs:
NATEL - Platinum Sponsor

Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
GBC Forum/Reception:
Sikama - GBC Forum/Reception Sponsor
LORD - Golf "Birdie" Sponsor
Keynote Presentations:
Indium Corp - Keynote Sponsor
Exhibit Hall Lunch:
Kyocera America - Exhibit Lunch Sponsor
Bag Insert:
RIV Inc. - Bag Insert Sponsor
Golf Sponsors
Golf "Birdie" Sponsor:
LORD - Golf "Birdie" Sponsor
Golf Ball Markers:
Circuit Solutions, Inc. - Golf Ball Markers Sponsor
Golf Hole Sponsor:
Technic - Golf Hole Sponsor
Golf Hole Sponsor:
Golf Hole Sponsor: Coining Inc/Ametek
Golf Hole Sponsor:
Golf Hole Sponsor: AGC Electronics America
Golf Hole Sponsor:
Golf Hole Sponsor: Dixon Golf
Golf Hole Sponsor:
Golf Hole Sponsor: Ceradyne Viox
Media Sponsors
Chip Scale Review - Media Sponsor
US Tech - Media Sponsor
MEPTEC - Media Sponsor



Hotel Reservations (Hotel Deadline: September 7, 2011)
Reservations must be made directly with the:

The Westin Long Beach
333 East Ocean Blvd.
Long Beach, CA 90802

$169/night + tax

To make a reservation -

Or call (800) Westin1 or (562) 436-3000 and ask for International Microelectronics And Packaging Society.

Complimentary Internet in all rooms booked through our block.

IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic