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Early Registration Deadline Extended to: September 16, 2011
Hotel Deadline Extended to: September 16, 2011

The 44th International Symposium on Microelectronics was held at the Long Beach Convention Center, Long Beach, California, USA, and was organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 featuree technical tracks on 3D Packaging; Modeling, Design & Reliability; Next Generation Materials; Assembly & Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging & System-Integration. 28 technical sessions were held including sessions on: 3D-TSV Processes & Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal & Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic & LTCC; Thermal Management; Wire Bonding; Printed Electronics; MEMS Packaging; and many more. The 2011 symposium offered professional development courses, a GBC Marketing Forum on "Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges", and 2 keynote presentations. A truly International Symposium, IMAPS 2011 also offered: 2 new sessions on European Perspectives on Packaging/Integration; a new Chinese-to-English Translated Session on "Advanced Packaging in China"; and the return of the always popular Japanese-to-English Translated session on "Improvements in Advanced Packaging from Japan."

IMAPS 2011 featured...

Complimentary Exhibit Hall Passes	Exhibits Passes were complimentary this year for all attendees. This complimentary registration will allow participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Marketing Forum. (PDCs, Sessions, Proceedings and Lunch are not included)
World-Renown Keynote Presentations	Mr. Liam Madden Corporate Vice President Xilinx, Inc. Dr. Ning-Cheng Lee Vice President, Technology Indium Corporation
16 Professional Development Courses	Advanced Packaging...(NEW); Basics of Microelectronics Packaging; Packaging Industry Updates & Trends; Polymers in Electronic Packaging; TSV...3D IC/Si Integrations; Wire Bonding...; 3D/TSV Integration and Packaging...; Signal/Power Integrity; MEMS Reliability...; Screen Printing; Counterfeit Electronics...(NEW); Design & Analysis of Experiments...(NEW); and many more.
An Unmatched, Global Technical Program	28 Sessions, 190+ Papers and Posters 5-6 Concurrent Technical Tracks addressing: 3D Packaging; Modeling/Reliability; Next Gen. Materials; Assembly & Packaging; Advanced Technologies; Focus Track: Adv. Packaging & System-Integration Program Grid (PDF) | Interactive Track
State-of-the-Art Exhibition and Technology Showcase	Dedicated exhibit hall displaying new products and concepts.
Global Business Council Marketing Forum	Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges
Invaluable Student Program	Student Industry Panel/Reception, Broadcom HQ Tour, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections.

...and that's only the technical side of the Symposium! There were also a lot of other exciting activites held -- the 17th Annual Golf Classic, the Welcome Reception and opening ceremonies, a Foundation Ca-Si-No Night, a companion tour of The Queen Mary Experience, to name only a few.

We hope you enjoy the 44th International Symposium on Microelectronics - IMAPS 2011, Long Beach!

Technical Program | Professional Development Courses (PDCs) | Exhibition Information

 

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Event Sponsors
Logo Bags, Final Program, Internet Café and Convention Hall Signs:	Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:	Logo Bags, Final Program, and Lanyards :	GBC Forum/Reception:
IMAPS Cafe:	Keynote Presentations:	Exhibit Hall Lunch:	Bag Insert:
Golf Sponsors
Golf "Birdie" Sponsor:	Golf Ball Markers:	Golf Hole Sponsor:	Golf Hole Sponsor:
Golf Hole Sponsor:	Golf Hole Sponsor:	Golf Hole Sponsor:
Media Sponsors