Tuesday, October 11, 2011
12:00 PM

Mr. Liam Madden
Corporate Vice President
Xilinx, Inc.

Presentation Title:
“Stackonomics”: How 3-D Stacking Reverses the March Towards Monolithic Integration

Bio:
Mr. Liam Madden is corporate vice president of FPGA Development and Silicon Technology at Xilinx. He has responsibility for FPGA design, Advanced Packaging (including Stacked Silicon Interconnect) and Foundry Technology. He joined Xilinx in 2008, bringing more than 25 years experience in a range of design and technology leadership positions.

At Digital Equipment Corporation, Mr. Madden was a member of the team that developed the first Alpha and StrongArm processors, then went on to be VP of Processor Development at MIPS Technologies, Inc., delivering high performance embedded cores.

At Microsoft Corporation, he led the internal team that developed chips for the XBOX 360 and as a Senior Fellow at AMD he defined the SOC methodology used to integrate CPU and Graphics functions on a single die. At AMD he was also responsible for 3-D stacking technology.

Mr. Madden earned a BE from the University College Dublin and a MEng from Cornell University. He holds five patents in the areas of technology and circuit design.

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Wednesday, October 12, 2011
11:45 AM

Dr. Ning-Cheng Lee
Vice President, Technology
Indium Corporation

Presentation Title:
Trends of Solder Alloy Development

Abstract:
The world is moving rapidly toward green manufacturing. Lead-free soldering, as originally driven by ROHS of Europe, are becoming the main stream for electronic industry, and the less toxic Sn-based alloys such as SnAg, SnCu, or SnAgCu are the prevailing choices. However, the selection of ideal lead-free alloys appears to be a moving target, since the miniaturization trend of the electronic industry is constantly imposing new criteria hence new challenges on the solder materials. With decreasing size of pad, through-hole, microvia, and pitch, the substrates and components structure becomes more delicate, and the solder joints become more vulnerable. Increase in portability of more devices further raises the bar for shock resistance of solder joints. In general, new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature, (2) alloy with a better solder spread, (3) alloy with a slower wetting speed at melting temperature, (4) a softer alloy, or alloy with a reduced voiding tendency or greater ductility, (5) alloy with a refined grain size, (6) alloy with low tendency to form large IMC plate, (7) alloy with a higher resistance toward corrosion and electrochemical migration, (8) alloy with a greater oxidation resistance,(9) alloys with a greater electromigration resistance, (10) alloys with a greater resistance toward grain coarsening.

Bio:
Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 20 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” by McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received 1991 award from SMT Magazine and 1993 and 2001 awards from SMTA for best proceedings papers of SMI or SMTA international conferences, and 2008 award from IPC for Honorable Mention Paper – USA Award of APEX conference. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, and 2010 Electronics Manufacturing Technology Award from CPMT. He served on the board of governors for CPMT, serves on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Electronics Packaging Manufacturing. He has numerous publications and frequently gives presentations, invited to seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.

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