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IMAPS 2011 - Long Beach
44th International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!

October 9 - 13, 2011
Long Beach Convention Center
Long Beach, California, USA
www.imaps2011.org

IMAPS 2011 - Long Beach

Conference and Exhibition:
October 11-13, 2011
Professional Development Courses:
October 9 - 10, 2011

Interactive Forum (Poster Session)


WP6
Interactive Forum (Poster Session)
Wednesday, October 12, 2011
Session 1:35 pm - 5:25 pm

Chairs: Kevin Ouellette, BAE Systems; Aicha Elshabini, University of Idaho

One-on-One Interactive Forum. This is your chance for detailed interaction with authors whose work is too good to miss.

VSECURE: VLSI Standby Subthreshold Leakage Current Reduction Technique
Vaibhav Neema, Sanjiv Tokekar, Devi Ahilya University, Institute of Engineering and Technology  
                                                                                                              
Design, Development and Qualification of 64 Channel Hybrid Analog Multiplexer for Space Applications
Krishna Prasad, Gayathri Kumari, Santosh Joteppa, Gopalsharma Joshi, Satyanarayana Prasad, Vinod Chippalkatti, Amul Patel, J.C.Karelia, K.G. Domadia, R.M. Parmar, Centum Electronics Limited

Evaluation of Wetting and Intermetallic Formation on Alumina to Titanium Gold Based Brazing
Shadab Saddiqui, W. Kinzy Jones, Florida International University           

Single Probe Tester for Bare Board and Loaded Board with Open Sockets
Abdelghani Renbi, Jerker Delsing, Lulea University of Technology, EISLAB, Department of Computer Science and Space Engineering

A Low Cost and High Thermal Conductive Solderable Adhesive
Mary Liu, Wusheng Yin, YINCAE Advanced Materials, LLC

Improvement of Rated Power and VSWR Characteristics for Termination Resistor with Integrated Matching Network and Efficient Thermal Management
Akhlaqur Rahman, Fred Olinger, Michael Howieson, Thin Film Technology Corporation

Making Intelligent Tradeoffs Between SI, PI and EMI
Amolak Badesha, Avago Technologies; Hany Fahmy, Agilent Technologies

Low Temperature Reliability of Carbon Nanotube/Silicone Superhydrophobic Coatings
Yoonchul Sohn, Sangeui Lee, Dongouk Kim,  Kunmo Chu, Dongun Kim, Hajin Kim, Intaek Han, Samsung Advanced Institute of Technology, Samsung Electronics                              

Design of the Bonded Wire Location at the Insulated Gate Bipolar Transistor Module
Shih-Ying Chiang, Tuan-Yu Hung, Ray Hsing, Kuo-Ning Chiang, National Tsing Hua University      

Hardware Design for Gas Detection System Using Zeolite Coated with Nile Red
Son Nguyen, Z. Joan Delalic, Zameer Hasan, Joel B. Sheffield, David M. Kargbo, Temple University       

Simulation of Single-Phase Power Factor Correction  using DSP
S. Keraï, N. Keraï, K. Ghaffour, Université Abou Bakr Belkaîd; Faculté de Technologies

Thermal Performance of an Adhesive Bonded Superconducting Multichip Module on a Gifford-McMahon Cryocooler

Ranjith S. E. John, Vladimir Dotsenko, Corey Thompson, Ajay Malshe, Deepnarayan Gupta, University of Arkansas

Finding Your "Buffy” - Talent Acquisition and Retention in Today's Market
Patrick J. Troy, LMS Recruiting

Technical Program | Professional Development Courses (PDCs) | IMAPS 2011 Home

Event Sponsors

Logo Bags, Final Program, Internet Café and Convention Hall Signs:
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Logo Bags, Final Program, International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions:
Heraeus Materials Technology - Premier Sponsor, Gold
Logo Bags, Final Program, and Lanyards :
Metalor - Premier Sponsor, Silver
GBC Forum/Reception:
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IMAPS Cafe:
LORD - Golf "Birdie" Sponsor
Keynote Presentations:
Indium Corp - Keynote Sponsor
Exhibit Hall Lunch:
Kyocera America - Exhibit Lunch Sponsor
Bag Insert:
RIV Inc. - Bag Insert Sponsor
Golf Sponsors
Golf "Birdie" Sponsor:
LORD - Golf "Birdie" Sponsor
Golf Ball Markers:
Circuit Solutions, Inc. - Golf Ball Markers Sponsor
Golf Hole Sponsor:
Technic - Golf Hole Sponsor
Golf Hole Sponsor:
Golf Hole Sponsor: Coining Inc/Ametek
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Golf Hole Sponsor: AGC Electronics America
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Golf Hole Sponsor: Dixon Golf
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Golf Hole Sponsor: Ceradyne Viox
 
Media Sponsors
Chip Scale Review - Media Sponsor
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