VSECURE: VLSI Standby Subthreshold Leakage Current Reduction Technique
Vaibhav Neema, Sanjiv Tokekar, Devi Ahilya University, Institute of Engineering and Technology
Design, Development and Qualification of 64 Channel Hybrid Analog Multiplexer for Space Applications
Krishna Prasad, Gayathri Kumari, Santosh Joteppa, Gopalsharma Joshi, Satyanarayana Prasad, Vinod Chippalkatti, Amul Patel, J.C.Karelia, K.G. Domadia, R.M. Parmar, Centum Electronics Limited
Evaluation of Wetting and Intermetallic Formation on Alumina to Titanium Gold Based Brazing
Shadab Saddiqui, W. Kinzy Jones, Florida International University
Single Probe Tester for Bare Board and Loaded Board with Open Sockets
Abdelghani Renbi, Jerker Delsing, Lulea University of Technology, EISLAB, Department of Computer Science and Space Engineering
A Low Cost and High Thermal Conductive Solderable Adhesive
Mary Liu, Wusheng Yin, YINCAE Advanced Materials, LLC
Improvement of Rated Power and VSWR Characteristics for Termination Resistor with Integrated Matching Network and Efficient Thermal Management
Akhlaqur Rahman, Fred Olinger, Michael Howieson, Thin Film Technology Corporation
Making Intelligent Tradeoffs Between SI, PI and EMI
Amolak Badesha, Avago Technologies; Hany Fahmy, Agilent Technologies
Low Temperature Reliability of Carbon Nanotube/Silicone Superhydrophobic Coatings
Yoonchul Sohn, Sangeui Lee, Dongouk Kim, Kunmo Chu, Dongun Kim, Hajin Kim, Intaek Han, Samsung Advanced Institute of Technology, Samsung Electronics
Design of the Bonded Wire Location at the Insulated Gate Bipolar Transistor Module
Shih-Ying Chiang, Tuan-Yu Hung, Ray Hsing, Kuo-Ning Chiang, National Tsing Hua University
Hardware Design for Gas Detection System Using Zeolite Coated with Nile Red
Son Nguyen, Z. Joan Delalic, Zameer Hasan, Joel B. Sheffield, David M. Kargbo, Temple University
Simulation of Single-Phase Power Factor Correction using DSP
S. Keraï, N. Keraï, K. Ghaffour, Université Abou Bakr Belkaîd; Faculté de Technologies
Thermal Performance of an Adhesive Bonded Superconducting Multichip Module on a Gifford-McMahon Cryocooler
Ranjith S. E. John, Vladimir Dotsenko, Corey Thompson, Ajay Malshe, Deepnarayan Gupta, University of Arkansas
Finding Your "Buffy” - Talent Acquisition and Retention in Today's Market
Patrick J. Troy, LMS Recruiting
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