It won’t be long before the next Annual IMAPS International Symposium on Microelectronic is upon us, October 9 - 13, 2011; this event will bring together the entire microelectronics industry into one large venue. Being held this year in Long Beach, California, near the heart of the Aerospace and Governmental electronics center, as Technical Chairs we are excited about the International participation and scope of the technical program that this Symposium is offering to the technical microelectronics industry.

The IMAPS technical organization has brought together 28 sessions with over 190 papers that cover a broad range of interest from 3D packaging to discrete LED packaging and materials, plus an Interactive Poster Session. We will have 22 Professional Development Courses. Two keynote presentations, one on Tuesday October 11th by Liam Madden, Corporate Vice President of Xilinx, Inc., and another special keynote presentation to be announced for Wednesday October 12th; and a Interactive Global Business Council meeting featuring three talks on “Impact of Packaging on Data Centers: Green Market Outlook,” “Medtronic Tempe Campus No Re-Work Initiative,” and “Social and Environmental Responsibility Improvements in the Electronics Supply Chain,” all to be presented by leading industry experts covering the industry and marketing concerns of today’s current economy environment.

IMAPS 2011 in Long Beach promises to be a technical program that addresses the needs of the individual engineer to the market demands of the Microelectronics industry. Highlighting, but not limited to following key areas of interest:

• We will have several International sessions on the activities from Europe (two sessions), Japan and China. We are very exited about these sessions as they truly bring an International flair to the Symposium.
• We will have several technology tracts that address 3D packaging, Modeling and Simulation, Advanced Materials, Assembly and Packaging, as well as sessions on RF and Microwave, and MEMS Packaging.
• A forum for networking with your counterparts and colleagues in the industry on the latest Microelectronics developments.
• A Global Business Council program that will address our ever changing market.
• Two keynote speakers, in which one will address the latest technology developments in 3D Packaging.

As the Technical Chair and Co-Chairs, we are enthusiastic about the program and what IMAPS is offering in this Symposium to the technical community. We gratefully acknowledge and extend sincere thanks to the IMAPS Technical Committee and IMAPS staff for their outstanding contribution to the 2011 program. We look forward to five days of creativity, innovation and networking.

Reserve your space now and we will see you in Long Beach, California, October 9th thru October 13th!

Richard Sigliano Kyocera America, Inc. rick.sigliano@kyocera.com

Benson Chan Endicott Interconnect benson.chan@eitny.com

Ivan Ndip Fraunhofer IZM ivan.ndip@fraunhofer.de

Kuo-Ning Chiang National Tsing Hua University knchiang@pme.nthu.edu.tw

 

Logo Bags, Final Program, Internet Café and Convention Hall Signs: